Softener for flash of chip molding compound

A technology of molding compound and softener, which is applied in detergent compounding agent, detergent composition, chemical instrument and method, etc., can solve the problems of poor curing performance and reduction of particle size of water-based epoxy resin.

Pending Publication Date: 2022-05-06
NANTONG HUADA MICROELECTRONICS GROUP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The results show that: when the amount of diethanolamine increases, the hydrophilicity of the modified epoxy resin is

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Use the TO-220 experimental dummy (chip encapsulated in epoxy resin, connected to the copper lead frame) for testing. The experimental conditions are set to soak at 65°C for 30 minutes. The experimental results are shown in the table below.

[0031] .

[0032] Referring to the results in the above table, it shows that alcohol amines have a more obvious effect on softening the flash, while glycol ether acetates have a better effect on dissolving wax.

Embodiment 2

[0034] Take 3g of the wax and polyethylene wax mixture with a ratio of 1:1, put them in 10g of the test sample, soak them at 70°C for half an hour, and investigate the dissolution of the wax alone. The experimental results are shown in the table below.

[0035] .

[0036] Through this embodiment, the wax dissolving ability of each experimental sample can be visually observed.

Embodiment 3

[0038]Use TO-220 products for testing, the experimental conditions are set to soak for 30 minutes and 60 minutes at 70°C, and then conduct reliability tests

[0039] .

[0040] Referring to the results in the above table, samples 1, 2, and 3, which use alcohol amine organic bases as the basic components, have better reliability on the plastic package, which is better than the inorganic base sample No. 4

[0041] Test Conclusions:

[0042] By above-mentioned embodiment 1,2,3 as seen, at 60 ℃~70 ℃ of temperature:

[0043] Using No. 1, 2 and 4 samples, the effect of softening the flash is good, the effect of removing wax of No. 2 is not good, and the softening effect of No. 3 is not good. Samples 1, 3, and 4 that use glycol ether acetate solvents have good wax removal effects and no missing plating, which is better than sample No. 2 that does not contain glycol ether acetate solvents. This shows that glycol ether acetates have a better dissolving effect on wax. Using sample...

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PUM

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Abstract

The invention discloses an overflow softening agent for a chip molding compound. The main components of the overflow softening agent comprise an alcohol amine organic alkali, an amide and nitrogen methyl pyrrolidone solvent, an alcohol amine ether cellosolve and a glycol ether acetate wax remover. The low-temperature softening and removing agent has a good softening and removing effect on epoxy resin overflowing materials under the low-temperature condition, and meanwhile, can also dissolve Ba wax or polyethylene wax in the overflowing epoxy resin molding compound under the low-temperature condition of 60 DEG C +/-10 DEG C.

Description

technical field [0001] The invention relates to a processing technology for overflow of plastic sealing compound. Background technique [0002] Chip molding compounds usually use epoxy resin as the main component. The chemical softening of the existing chip molding compound is a high-temperature process above 100°C. Due to the high working temperature, it will have a great adverse effect on the performance of the packaged plastic compound and the packaged chip product. However, the softening temperature of wax and polyethylene wax, the cosolvents of epoxy resin molding compound, is very high. The softening point of wax is 86°C, and the softening point of polyethylene wax is 115°C. It is difficult to melt it at a temperature lower than the softening point of wax clear. [0003] The invention of application number 201810202983.5 discloses a softener for the softening of liquid crystal box frame glue, including ethanol with a volume percentage of 5% to 10%, ethyl acetate with...

Claims

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Application Information

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IPC IPC(8): C11D7/26C11D7/32C11D7/50C11D7/60C23G1/24
CPCC11D7/3218C11D7/3227C11D7/3263C11D7/3281C11D7/266C11D7/5013C11D11/0047C11D3/0015C23G1/24
Inventor 王建荣葛飞虎张文仲
Owner NANTONG HUADA MICROELECTRONICS GROUP
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