Self-sintering nano-copper soldering paste and preparation method and use method thereof

A nano-copper, self-sintering technology, applied in welding equipment, manufacturing tools, welding media, etc., can solve the problems of limiting the application of copper nanoparticles, poor sintered body performance, long sintering time, etc., to shorten the chemical reaction time and sintering performance. Good, short chemical reaction time effect

Pending Publication Date: 2022-05-27
重庆平创半导体研究院有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, because copper nanoparticles are easily oxidized, there are deficiencies in the current research, such as too high sintering temperature, too long sintering time, too high sintering pressure, poor performance of sintered body, and reducing sintering environment.
These defects largely limit the application of copper nanoparticles in the field of electronic packaging

Method used

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  • Self-sintering nano-copper soldering paste and preparation method and use method thereof
  • Self-sintering nano-copper soldering paste and preparation method and use method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] A self-sintered nano copper solder paste in the present embodiment, the preparation method thereof and the method of use thereof:

[0030]Weigh 50mmol of copper chloride dissolved in a flask containing 20ml of water, the flask is heated in an oil bath, so that the solution temperature is maintained at 90 ° C, 0.96mg of citric acid and 0.76mg of sodium hypophosphite are added to the flask, and after 15min of the reaction, centrifugal cleaning can obtain citric acid-coated CuNPs. Mix CuNPs with ethanol to obtain a copper paste by mixing it with ethanol in a volume ratio of 90:10. The aqueous solutions of 2% sodium alginate, 1% OP-10 and 35% aqueous ammonia were uniformly obtained to obtain a burn aid. On the substrate 4 and the back of chip 1 using screen printing co-firing agent and drying, and then on the substrate 4 of the co-firing agent printed a layer of copper paste and dried, chip 1, the burner layer 2, nano copper particle layer 3, substrate 4 four position diagram a...

Embodiment 2

[0032] A self-sintered nano copper solder paste in the present embodiment, the preparation method thereof and the method of use thereof:

[0033] Weigh 50mmol of copper chloride dissolved in a flask containing 20ml of water, the flask is heated in an oil bath, so that the solution temperature is maintained at 90 ° C, 0.96mg of citric acid and 0.76mg of sodium hypophosphite are added to the flask, and after 15min of the reaction, centrifugal cleaning can obtain citric acid-coated CuNPs. Mix CuNPs with ethanol in volume ratio 85:15 to obtain copper paste. The aqueous solution of 1% o-hydroxybenzoic acid, 1% OP-10 and 30% hydrazine hydrate was uniformly obtained to obtain a burn aid. On the substrate 4 and the back of chip 1 using screen printing co-firing agent and drying, and then on the substrate 4 of the co-firing agent printed a layer of copper paste and dried, chip 1, the burner layer 2, nano copper particle layer 3, substrate 4 four position diagram as attached Figure 1 As sho...

Embodiment 3

[0035] A self-sintered nano copper solder paste in the present embodiment, the preparation method thereof and the method of use thereof:

[0036] Weigh 50mmol of copper chloride dissolved in a flask containing 20ml of water, the flask is heated in an oil bath, so that the solution temperature is maintained at 90 ° C, 0.96mg of citric acid and 0.76mg of sodium hypophosphite are added to the flask, and after 15min of the reaction, centrifugal cleaning can obtain citric acid-coated CuNPs. Mix CuNPs with ethanol in volume ratio 85:15 to obtain copper paste. The aqueous solution of 3% acrylic resin, 1% EP-10 and 50% ethylenediamine was homogeneous to obtain a burn aid. On the substrate 4 and the back of chip 1 using screen printing co-firing agent and drying, and then on the substrate 4 of the co-firing agent printed a layer of copper paste and dried, chip 1, the burner layer 2, nano copper particle layer 3, substrate 4 four position diagram as attached Figure 1 As shown, the mass ratio ...

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Abstract

The invention belongs to the technical field of welding materials, and particularly relates to self-sintering nano-copper soldering paste and a preparation method and using method thereof.The self-sintering nano-copper soldering paste comprises a nano-copper particle layer and a sintering aid layer, the surfaces of nano-copper particles are coated with citric acid layers, and the sintering aid layer comprises a complexing agent and a reducing agent; the complexing agent comprises at least one of sodium alginate, o-hydroxybenzoic acid and acrylic resin, and the reducing agent comprises at least one of hydrazine, hydrazine hydrate and ethylenediamine. According to the method, sintering can be achieved only by means of heat release of a chemical reaction, expensive specific equipment and a reducing atmosphere without extra atmosphere and heating, high-temperature sintering is avoided, meanwhile, high-temperature service is guaranteed, and the sintering performance is good.

Description

Technical field [0001] The present invention belongs to the technical field of welding materials, specifically relates to a self-sintering nano copper solder paste, the preparation method thereof and the method of use thereof. Background [0002] Over the past few years, the growing demand for electronics has caused a huge revolution in the field of electronics. As a third-generation semiconductor, wide-bandgap semiconductor devices (WBGs) consume 18-20 times less energy than Si base chips at the same computing speed, and can work normally at large voltages and high temperatures, while having better switching performance. But higher service temperatures make it difficult for existing high-temperature lead-free solders to meet the needs of the semiconductor industry. [0003] Because of its unique physical and chemical properties, conductive metal nanoparticles have the characteristics of melting point and large specific surface area of block materials, which can achieve low tempe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/30B23K35/363
CPCB23K35/302B23K35/362B23K35/025B23K35/3612
Inventor 陈显平钱靖
Owner 重庆平创半导体研究院有限责任公司
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