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High-thermal-conductivity copper alloy glass mold bottom and preparation method thereof

A glass mold and copper alloy technology, applied in glass manufacturing equipment, glass pressing, glass blowing, etc., can solve the problems of reducing the service life of the mold bottom, falling off, increasing the complexity and difficulty of machining, and achieving good toughness, Effect of enhanced stress resistance and toughness, excellent thermal conductivity

Pending Publication Date: 2022-05-31
ORI MOLD TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Traditional copper alloys need to add a large amount of precious metals such as nickel and cobalt in the casting process to improve the overall performance of the alloy, such as oxidation resistance, thermal conductivity, tensile strength and other physical properties, and heat dissipation holes need to be processed by mechanical equipment And cooperate with another accessory wind plate to cool and dissipate heat, which will increase the complexity and difficulty of machining virtually, so as to improve the cooling effect of copper alloy during use, as a machining part in the preparation process of glass mold bottom is an important cost factor that cannot be ignored
[0005] In the published patent literature, as described in CN103203447A "a method for casting the bottom of a glass mold", the technician creatively uses cast iron for the mold base in the mold bottom, and uses a copper alloy for the molding part of the contact surface with the glass, so as to The method of inlay casting is combined to reduce the cost of using copper alloy. However, this technology has been used on the machine for a long time. Due to the inconsistency of the physical parameters such as thermal expansion coefficient and thermal conductivity of cast iron and copper alloy, after repeated heating The joint surface will gradually produce gaps, and the high-temperature glass liquid will penetrate into the joint surface along the gap, and as the joint surface slowly expands, it will eventually fall off, reducing the service life of the mold bottom.

Method used

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  • High-thermal-conductivity copper alloy glass mold bottom and preparation method thereof
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  • High-thermal-conductivity copper alloy glass mold bottom and preparation method thereof

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preparation example Construction

[0031] The present invention will be described in detail below, a kind of preparation method of high thermal conductivity copper alloy glass mold bottom, comprises the following steps:

[0032] Step 1: mold bottom design; in the above step 1, the designed mold base is semi-elliptical, hollow with cooling fins, the glass mold bottom is designed, and the wooden mold is made.

[0033] Step 2: Modeling; in the step 2, first make the heat dissipation fin sand mold, then make the bottom sand mold, fix the heat dissipation fin sand mold in the bottom sand mold, and wait for pouring.

[0034] Step 3: smelting; in the step 3, the production raw materials for the bottom of the high thermal conductivity copper alloy glass mold are prepared, the chemical elements and mass percentages of the production raw materials are as follows: 1-3.5% nickel, 32--43% zinc, 5-6.5% aluminum and 0.5-1.0% silicon, and the rest is copper; the smelting process is as follows: according to the above mass compo...

Embodiment 1

[0040] The chemical composition of the high thermal conductivity copper alloy glass mold base material with cooling fins of the technical proposal is as follows: 1.6% nickel, 41% zinc, 5.6% aluminum and 0.8% silicon, and the balance is copper; The method for preparing the mold base of a high heat-conducting copper alloy glass mold with cooling fins comprises the following steps:

[0041] A) The design of the mold base, the mold base is semi-elliptical and hollow with 4 cooling fins, and then the wooden mold is made;

[0042] B) Modeling, first make the heat dissipation fin sand mold, then make the mold bottom sand mold, fix the heat dissipation fin sand mold in the mold bottom sand mold, and wait for pouring;

[0043] C) Melting, according to the above mass composition, add electrolytic copper (grade A cathode electrolytic copper with the brand name of Cu-CATH-1) into the intermediate frequency electric furnace, and add pre-smelted zinc (brand name is 0# electrolytic zinc ingo...

Embodiment 2

[0048] The chemical composition of the bottom material of the high thermal conductivity copper alloy glass mold with cooling fins is as follows: 3.1% nickel, 36% zinc, 5.9% aluminum and 0.7% silicon, and the remainder is copper; The method for preparing the bottom of a high thermal conductivity copper alloy glass mold comprises the following steps:

[0049] A) The design of the mold base, the mold base is semi-elliptical and hollow with 4 cooling fins, and then the wooden mold is made;

[0050] B) Modeling, first make the heat dissipation fin sand mold, then make the mold bottom sand mold, fix the heat dissipation fin sand mold in the mold bottom sand mold, and wait for pouring;

[0051] C) Melting, according to the above mass composition, add electrolytic copper (grade A cathode electrolytic copper with the brand name of Cu-CATH-1) into the intermediate frequency electric furnace, and add pre-smelted zinc (brand name is 0# electrolytic zinc ingot)-aluminum after melting (bra...

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Abstract

The invention discloses a high-thermal-conductivity copper alloy glass mold bottom and a preparation method thereof. The preparation method comprises the following steps: step 1, designing the mold bottom; step 2, shaping; step 3, smelting; 4, pouring is conducted; step 5, discharging from a box; and sixthly, heat treatment is conducted. The invention has the following beneficial effects: the copper matrix in the formula of the technical scheme has good toughness and excellent thermal conductivity, so that the requirement of high-machine-speed production of glass products can be met; the nickel can be infinitely dissolved with the matrix copper, so that the corrosion resistance is high, the stress resistance and the toughness can be enhanced, and the solid solubility of the zinc in the copper alloy is high, so that the zinc has a solid solution strengthening effect; aluminum can improve the oxidation resistance and hardness of the copper alloy; in addition, due to the fact that the heat dissipation fins are arranged in the structure of the mold bottom, the heat dissipation area is greatly increased, corresponding machining difficulty and workload cannot be brought about, and therefore the heat conductivity of the mold bottom of the copper alloy glass mold can achieve the excellent effect.

Description

technical field [0001] The invention relates to the technical field of glass mold material preparation, in particular to a high thermal conductivity copper alloy glass mold base and a preparation method thereof. Background technique [0002] Glass mold is an important tooling equipment for manufacturing glass products. In the process of industrial production, glass molds are frequently in contact with molten high-temperature glass liquid, which is inseparable from the quality of glass products. Therefore, glass is required to have strong resistance. High temperature performance and better thermal conductivity, in order to meet the requirements of customers for high-speed bottle making. With the continuous development of high-speed bottle making technology, the speed of glass bottle forming machines is getting higher and higher, so that the high strength of glass molds Comprehensive performance requirements such as high thermal conductivity are more stringent. At present, th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22C9/02B22C9/24C22C9/04C22F1/08C21D9/00C03B9/335C03B9/38C03B9/48C03B11/10C03B11/12
CPCB22C9/02B22C9/24C22C9/04C22F1/08C21D9/0068C03B9/33C03B9/3866C03B9/48C03B11/10C03B11/125Y02P40/57Y02P10/20
Inventor 戈剑鸣
Owner ORI MOLD TECH SUZHOU