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Surface treatment method for reducing secondary electron yield of oxygen-free copper

A surface treatment and secondary electron technology, applied in the direction of electrolytic inorganic material coating, etc., can solve the problems of low bonding strength and poor bonding stability, and achieve the effects of low cost, effective deposition, and low secondary electron output

Pending Publication Date: 2022-07-01
UNIV OF SCI & TECH BEIJING +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Among them, in the preparation method of the reduced graphene oxide / copper composite coating of the present invention, copper is used as a connecting agent to improve the problems caused by the absence of chemical bonding, extremely low solid solubility, and thermal expansion coefficient mismatch between copper and carbon. The problem of low bonding strength and poor bonding stability can effectively improve the interface bonding state between the coating and the substrate

Method used

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  • Surface treatment method for reducing secondary electron yield of oxygen-free copper
  • Surface treatment method for reducing secondary electron yield of oxygen-free copper
  • Surface treatment method for reducing secondary electron yield of oxygen-free copper

Examples

Experimental program
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Effect test

Embodiment 1

[0060] Weigh 0.06g of graphene oxide, place it in 150ml of deionized water, and ultrasonically stir for 30min with a 1200W ultrasonic disperser until graphene oxide is completely dispersed in deionized water to form a stable graphene oxide plating solution; Weigh 8mmol of pentahydrate sulfuric acid Copper, dissolved in 150 ml of deionized water and stirred until completely dissolved. The oxygen-free copper sheet is used as the anode and the pure copper sheet is used as the cathode. The two electrodes are first placed in the graphene oxide plating solution at the same time, and the distance between the two electrodes is adjusted to 3 cm. A DC voltage was applied to deposit graphene oxide with a deposition voltage of 5V and a deposition time of 30s. Then the power was turned off, the two electrodes were taken out, and placed in a copper sulfate plating solution. The oxygen-free copper on which graphene oxide was deposited was used as the cathode, and the pure copper sheet was us...

Embodiment 2

[0063] Weigh 0.08g of graphene oxide, place it in 150ml of deionized water, and ultrasonically stir it for 10min with a 1200W ultrasonic disperser until graphene oxide is completely dispersed in deionized water to form a stable graphene oxide plating solution; Weigh 10mmol of pentahydrate sulfuric acid Copper, dissolved in 150 ml of deionized water and stirred until completely dissolved. The oxygen-free copper sheet is used as the anode and the pure copper sheet is used as the cathode. The two electrodes are first placed in the graphene oxide plating solution at the same time, and the distance between the two electrodes is adjusted to 3 cm. A DC voltage was applied to deposit graphene oxide with a deposition voltage of 5V and a deposition time of 30s. Then the power was turned off, the two electrodes were taken out, and placed in a copper sulfate plating solution. The oxygen-free copper on which graphene oxide was deposited was used as the cathode, and the pure copper sheet wa...

example 3

[0066] Weigh 0.1g of graphene oxide, place it in 150ml of deionized water, and ultrasonically stir for 30min with a 1200W ultrasonic disperser until graphene oxide is completely dispersed in deionized water to form a stable graphene oxide plating solution; Weigh 8mmol of pentahydrate sulfuric acid Copper, dissolved in 150 ml of deionized water and stirred until completely dissolved. The oxygen-free copper sheet is used as the anode and the pure copper sheet is used as the cathode. The two electrodes are first placed in the graphene oxide plating solution at the same time, and the distance between the two electrodes is adjusted to 3 cm. A DC voltage was applied to deposit graphene oxide with a deposition voltage of 3 V and a deposition time of 30 s. Then the power was turned off, the two electrodes were taken out, and placed in a copper sulfate plating solution. The oxygen-free copper on which graphene oxide was deposited was used as the cathode, and the pure copper sheet was u...

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Abstract

The invention discloses a surface treatment method for reducing oxygen-free copper secondary electron yield, and belongs to the field of space vacuum microwave device manufacturing. The method comprises the steps that an oxygen-free copper sheet is subjected to first ultrasonic cleaning and then serves as an anode, surface electrolysis treatment is conducted in a CuSO4 solution, and then second ultrasonic cleaning is conducted for standby application; preparing a graphene oxide suspension plating solution and a copper sulfate plating solution; carrying out first electrochemical deposition on the oxygen-free copper sheet to obtain a graphene oxide coating on the surface of the substrate, and then carrying out second electrochemical deposition to obtain a graphene oxide / copper composite coating on the surface of the substrate; and naturally drying in the air, and then carrying out atmosphere heat treatment to obtain the reduced graphene oxide / copper composite coating. The reduced graphene oxide-copper composite coating prepared by the scheme of the invention has excellent bonding strength, excellent thermal stability and excellent electron absorption performance, and can effectively reduce the secondary electron yield of oxygen-free copper.

Description

technical field [0001] The invention belongs to the field of space vacuum microwave device manufacturing, and in particular relates to a surface treatment method for reducing the yield of oxygen-free copper secondary electrons. Background technique [0002] Traveling wave tube is one of the core devices commonly used in the field of electric vacuum. During operation, the traveling electron beam interacts with the microwave electromagnetic field to amplify the microwave signal. It is widely used in radar, electronic countermeasures, communication, security inspection and medical treatment. Diagnosis and other fields, it is the core device of microwave power amplification. The collector of the traveling wave tube is the structural unit in the traveling wave tube that collects the electrons that have exchanged energy with the electromagnetic field. When the electrons are injected into the collector, the valence electron transition inside the collector material will be excited t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/34C25D5/50C25D5/00C25D9/06
CPCC25D5/34C25D5/505C25D5/00C25D9/06Y02P10/20
Inventor 郝俊杰张海丰蔡军潘攀杜英华付豪葛颖
Owner UNIV OF SCI & TECH BEIJING
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