High temp. resistance capsule, and its prepn. method

A technology of high temperature resistance and capsule, applied in the directions of microcapsule preparation and microsphere preparation, etc., can solve the problems of inability to have both sealing and heat resistance, low heat resistance temperature and low heat resistance temperature, and easy rupture of capsules, so as to improve emulsification. The effect of good effect, thermal stability and heat resistance, low production cost

Inactive Publication Date: 2005-05-04
TIANJIN POLYTECHNIC UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the molecular chain structure is a linear aromatic polyamide, its sealing performance is not good, and the capsule wall is relatively thin, and the capsule is easy to break
Although methyl methacrylate can be pre-dissolved in paraffin and polymerized with free radicals in the microcapsules to form an inner film, which improves the sealing performance of the microcapsules, the heat-resistant temperature of the microcapsules is lower than that of the aromatic polyamide body. The temperature is much lower, that is, sealing and heat resistance cannot be achieved at the same time

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0025] Any known encapsulation technique can be used in the preparation process of the capsule of the present invention. The most commonly used method is interfacial polymerization or in-situ polymerization, especially the in-situ polymerization is more suitable for producing the capsules of the present invention, because the in-situ polymerization can effectively control the generated capsules according to the addition of wall materials and capsule cores. The wall of the capsule is thick, and the capsule core functional substance A and volatile substance B can be effectively coated inside the capsule, which is beneficial to the improvement of product quality.

[0026] The applicable capsule diameter range of the present invention is not limited, generally from 10 nanometers to 10 millimeters, preferably from 50 nanometers to 1 millimeter.

[0027] The shape of the capsule of the present invention is generally approximately spherical, and after heat treatment, the capsule will...

Embodiment 1

[0031] After heating and melting 40 grams of n-eicosane, mix it with 5 milliliters of hexanaphthene, add it to a solution of 20 grams of styrene-maleic anhydride copolymer emulsifier (19% aqueous solution) and 300 milliliters of distilled water, and emulsify at a high speed On the machine, emulsify at 8000 rpm for 90 minutes to obtain emulsion D, adjust the pH value of emulsion D to 3-5; Stir at 200 rpm until melamine is completely dissolved to obtain prepolymer E; Emulsion D is transferred to a 500ml three-necked flask, placed in a 70°C water bath, stirred at 600 rpm, and prepolymer E is slowly added dropwise, and the reaction continues after the drop is complete Emulsion F was obtained in 180 minutes. 10% sodium hydroxide solution adjusted the pH value of emulsion F to 7-9, filtered under reduced pressure, washed once with 100 ml of 25% hot ethanol, washed twice with hot water, and dried the filter cake to obtain microcapsules. The diameter of the capsule is in the range of...

Embodiment 2

[0033] 10 grams of n-hexadecane was heated and melted and mixed with 10 milliliters of n-heptane, and the rest of the raw materials and process conditions were the same as in Example 1. After testing, the heat-resistant temperature of the obtained capsule is 268° C., and the diameter of the capsule is in the range of 0.05-0.95 microns.

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Abstract

The invention relates to a high temperature resistant capsule and a manufacturing method thereof. The product is characterized in that the capsule core includes at least one functional substance A and at least one volatile substance B capable of dissolving the capsule core but insoluble in the dispersion medium, and the volume ratio of the functional substance A to the volatile substance B is 19 : 1~1:1; the functional substance A refers to the following less volatile liquid or solid powder substances: paraffin-like substances, chlorinated paraffin-like substances, higher fatty alcohols, higher fatty acids, epoxy resin adhesives , fragrance or essence, coloring agent; the volatile substance B includes at least one of the following hydrophobic liquid substances with a boiling point lower than 150° C. but higher than room temperature. The manufacturing method is characterized in that conventionally obtained capsules are subjected to heat treatment, including drying at 70-90° C. to constant weight, and then heat-treating at 130° C.-190° C. for 30 minutes to 150 minutes. The invention has the advantages of simple process, low cost and strong applicability. Tests show that the high temperature resistance of the experimental capsule of the invention can reach 290°C.

Description

technical field [0001] The invention relates to a high-temperature-resistant capsule and a manufacturing method thereof. Specifically, at least one functional substance is used as the capsule core, and a certain proportion of at least one volatile substance that can dissolve the functional substance but is insoluble in the dispersion medium is added to the capsule core. Under the action of emulsifier and high-speed stirring, the mixture of functional substances and volatile substances is dispersed in the dispersion medium, and one or more high polymers that can form a film are used as the wall material to wrap the function volatile substances and volatile substances, the obtained capsules are dried to remove volatile substances, and then heat-treated to obtain high-temperature-resistant capsules. The international patent classification number is proposed to be Int.C1 7 C09K 5 / 06. Background technique [0002] Capsule technology is mainly used to adjust or change the apparen...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B01J13/02B01J13/06C09K21/14
Inventor 张兴祥樊耀峰王学晨牛建津
Owner TIANJIN POLYTECHNIC UNIV
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