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Composition and method for reducing copper oxide to metallic copper

A composition and compound technology, applied in metal hydrides, chemical instruments and methods, improvement of metal adhesion of insulating substrates, etc., can solve the problems of high cost, high operation cost of reduction process, high production cost, etc.

Inactive Publication Date: 2000-03-29
MORTON INT INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since amine boranes are expensive to produce, they are very expensive, making the reduction process expensive to operate

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] A reducing aqueous solution was prepared with 1.6 g / l dimethylamine borane and 15.2 g / l sodium hydroxide. Using this solution as a control, the copper plate was immersed in the reducing solution for 4 minutes at room temperature to reduce the copper oxide formed on the above copper plate. Record the trigger time. The percent weight loss of the copper oxide coating and the resistance time of the resulting coating in a 10% by volume hydrochloric acid bath were recorded.

[0027]A reducing aqueous solution was prepared with 2.7g / l morpholine·borane and 15.2g / l sodium hydroxide. This is an experimental formula used to determine the effect of morpholine borane as a reducing agent. It contains -BH 3 The composition is stoichiometrically equivalent to that contained in a 1.6 g / L DMAB reducing solution. The plates were immersed in the reducing solution for 4 minutes. Record the trigger time. The percent weight loss of the oxide layer and the resistance time of the obtained...

Embodiment 2

[0032] The present inventors tested the effect of morpholine-borane at different concentrations. The saturation concentration of morpholine borane in 15.2 g / l sodium hydroxide aqueous solution is about 50-60 g / l. The results listed in Table 2 below show that morpholine borane is an effective reducing agent in the concentration range from about 1 g / l to saturation.

[0033] Morpholine Borane

concentration

trigger time

weight loss %

acid resistance

0g / l

>4 minutes

＜5％

<10 seconds

1g / l

69 seconds

17％

45 minutes

25g / l

9 seconds

19％

50 minutes

50g / l

7 seconds

20％

50 minutes

[0034] As for the amine borane reducing agent, it is known that amine borane is consumed even after reducing all the copper oxide on the plate to metallic copper, and when no additional copper oxide is added to the solution. The reason why amine borane con...

Embodiment 3

[0046] To test the effect of the potential reducing stabilizer thiourea, a reducing aqueous solution was prepared with 2.7 g / l morpholine·borane and 15.2 g / l sodium hydroxide. DMAB was purchased from Aldrich Chemical Company, Milwaukee, Wisconsin. Sodium hydroxide was purchased from Hill Brothers Chemical Company, Orange, California. This solution was used as a control solution at room temperature. Experimental solutions were prepared by adding 2.5 ppm thiourea to a solution of the same composition as the control solution. Both control and test solutions were poisoned with 0.075 g / l copper oxide. The concentration of morpholine-borane in both solutions was determined before the addition of copper oxide and 24 hours after the addition of copper oxide. The results are listed in Table 3.

[0047] Morpholine boron

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PUM

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Abstract

A composition for reducing a copper oxide layer to metallic copper so as to facilitate bonding a resin to the metallic copper is disclosed. The composition is an aqueous reducing solution containing a cyclic borane compound. Example of such cyclic borane compounds include those having nitrogen or sulfur as a ring-forming member, such as morpholine borane, piperidine borane, pyridine borane, piperazine borane, 2,6-lutidine borane, 4-methylmorpholine borane, and 1,4-oxathiane borane, and also N, N-diethylaniline borane.

Description

[0001] related application [0002] This application is a continuation-in-part of US Application No. 08 / 574,946 filed December 19,1995. field of invention [0003] The present invention relates to compositions and methods for reducing copper oxide to metallic copper in the manufacture of multilayer printed wiring boards. Background of the invention [0004] Successful fabrication of multilayer printed wiring boards requires bonding copper and resin layers together. However, direct bonding of copper and resin layers does not have sufficient adhesive strength. Therefore, the bonding strength between copper and resin is usually improved by depositing an oxide layer (such as cuprous oxide, copper oxide, etc.) on the copper surface. The formation of an oxide layer turns the copper surface from pink to brownish black, and it creates microscopic unevenness on the copper surface that allows the copper surface and the resin to interlock to improve bond strength. [0005] However, ...

Claims

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Application Information

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IPC IPC(8): C07F5/00C07F5/02C23C22/63C23C22/83H05K3/38
CPCH05K2203/0315H05K2203/1157C23C22/83H05K3/385C23C18/40C23C22/63C07F5/006C07F5/022B05D3/102C07F5/00
Inventor J·法克勒M·拉什S·坎贝尔
Owner MORTON INT INC
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