Method for producing P-type III nitride material
A manufacturing method and nitride technology, which are applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of high P-type resistivity, low hole concentration, and high ionization energy of magnesium impurities, and improve quantum efficiency. , the effect of improving injection efficiency and reducing series resistance
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Embodiment 1
[0026] Such as figure 2 As shown, a fabrication method of a III-nitride laser comprises the following processes:
[0027] 1. See figure 1 , using (0001) facet sapphire (C-Al 2 o 3 )1 as the substrate.
[0028] 2. Epitaxially grow a layer of N-type gallium nitride 2 on the (0001) plane sapphire substrate, the growth temperature is 1000-1100° C., and the thickness is 0.5-4 microns.
[0029] 3. A layer of N-type AlGaN 3 is grown as a carrier confinement layer. The growth temperature is 1050-1100°C, and the thickness is 0.5-1 micron.
[0030] 4. Growing the active layer 4 of the light emitting device. The active layer can adopt different structures such as quantum dots and quantum wells.
[0031] 5. Then grow a P-type AlGaN layer 5 again. The growth temperature is 1000-1100°C, and the thickness is 0.1-1 micron.
[0032] 6. Cover another layer of P-type quaternary nitride layer 6 on it. The growth temperature is 1000-1100°C, and the thickness is 0.1-2 microns. The growt...
Embodiment 2
[0038] Such as image 3 As shown, a manufacturing method of a heterojunction bipolar transistor includes the following processes:
[0039] 1. Using (0001) surface sapphire (C-Al 2 o 3 )1 as the substrate.
[0040]2. Epitaxial growth of a layer of high concentration N + Type gallium nitride 2, the growth temperature is 1000-1100°C, the thickness is 0.5-4 microns, and silicon is used as the N-type impurity. This layer acts as an ohmic contact layer.
[0041] 3. A layer of N-type gallium nitride 3 is grown on it, the growth temperature is 1050-1100°C, and the thickness is 0.5-1 micron.
[0042] 4. Growing a layer 4 of an N-type aluminum gallium nitride (AlGaN) layer. The growth temperature is 1050-1100°C, and the thickness is 0.5-1 micron.
[0043] 5. Then grow a P-type gallium nitride layer 5 again. The growth temperature is 1000-1100°C, and the thickness is 0.1-1 micron. Mg was used as a dopant.
[0044] 6. Cover another layer of P-type quaternary nitride layer 6 on i...
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