Process for preparing single crystal silicon substrate surface self-assembly rare earth nano-film
A single crystal silicon wafer, self-assembly technology, applied in liquid chemical plating, metal material coating process, solid-state chemical plating and other directions, can solve the problem of long film forming cycle, achieve low cost, obvious effect, film forming dense effect
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Embodiment 1
[0011] First, pretreat the monocrystalline silicon wafer, soak the monocrystalline silicon wafer in aqua regia, heat the aqua regia in an electric furnace for 5 hours, and cool it naturally at room temperature for 8 hours, take out the monocrystalline silicon wafer, and use Rinse repeatedly with deionized water and dry in a desiccator.
[0012] Immerse the treated single crystal silicon wafer in the prepared rare earth modifier and let it stand for 8 hours. After taking it out, rinse it with deionized water, dry it at room temperature, place it in an oven, and keep it warm at 120 degrees Celsius for 1 hour to obtain the rare earth self-assembled nano film.
[0013] The component weight percent of the rare earth modifier that the present invention adopts is:
[0014] Ethanol content: 65%, rare earth compounds: 5%, ethylenediaminetetraacetic acid: 4%, ammonium chloride: 5%, urea: 25%, concentrated hydrochloric acid: 1%.
[0015] SPM-9500 atomic force microscope, L116E ellipsom...
Embodiment 2
[0018] First, pretreat the monocrystalline silicon wafer, soak the monocrystalline silicon wafer in aqua regia, heat the aqua regia in an electric furnace for about 6 hours, and naturally cool it at room temperature for about 7 hours, then take out the monocrystalline silicon wafer , rinsed repeatedly with deionized water, and dried in a desiccator.
[0019] Immerse the treated single crystal silicon wafer in the prepared rare earth modifier and let it stand for 8 hours. After taking it out, rinse it with deionized water, dry it at room temperature, place it in an oven, and keep it warm at 120 degrees Celsius for 1 hour to obtain the rare earth self-assembled nano film.
[0020] The component weight percent of the rare earth modifier that the present invention adopts is:
[0021] Ethanol content: 83%, rare earth compounds: 3.5%, ethylenediaminetetraacetic acid: 1%, ammonium chloride: 2%, urea: 10%, concentrated hydrochloric acid: 0.5%.
[0022] The characterization means in ...
Embodiment 3
[0025] Firstly, pretreat the monocrystalline silicon wafer, soak the monocrystalline silicon wafer in aqua regia, heat the aqua regia with an electric furnace for about 5 hours, and naturally cool it at room temperature for about 7 to 8 hours. The slices were taken out, rinsed repeatedly with deionized water, and placed in a desiccator to dry.
[0026] Immerse the treated single crystal silicon wafer in the prepared rare earth modifier and let it stand for 8 hours. After being taken out, rinsed with deionized water, dried at room temperature, placed in an oven, and kept at 120° C. for 1 hour, the rare earth self-assembled nano film was obtained.
[0027] The component weight percent of the rare earth modifier that the present invention adopts is:
[0028] Ethanol content: 70%, rare earth compounds: 5%, ethylenediaminetetraacetic acid: 4%, ammonium chloride: 5%, urea: 15%, concentrated hydrochloric acid: 1%.
[0029] Adopt the experimental instrument in the embodiment 1 to ev...
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