Medium temperature Ag base brazing filler metal and its preparing method

A medium-temperature and solder technology, which is applied in the formulation of new low-cost medium-temperature cadmium-free Ag-based solder and its preparation field, can solve the problems of high price of solder and the like

Inactive Publication Date: 2005-05-18
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The present invention is aimed at the problem that the existing Ag-based solder contains toxic elements and the solder is expensive, thereby determining that 30AgCuZn is used as the initial alloy, by adjusting the content of copper and zinc and adding Mn, Sn, P to the initial alloy to reduce melting Elements and traces of La modification treatment elements p...

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  • Medium temperature Ag base brazing filler metal and its preparing method
  • Medium temperature Ag base brazing filler metal and its preparing method
  • Medium temperature Ag base brazing filler metal and its preparing method

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specific Embodiment approach 1

[0006] Specific embodiment one: the medium-temperature Ag-based solder of the present embodiment is made up of seven components of Ag, Cu, Zn, Mn, Sn, P and La, and the weight percentages of each component of the solder are: Ag: 29.5-30.5%, Zn: 31.5-32.5%, Mn: 2.5-3.5%, Sn: 2.5-3.5%, P: 0.4-0.8%, La: 0.2-0.4%, and the balance is Cu.

[0007]The various methods of making medium-temperature Ag-based solder, its preparation steps are: material selection, feeding smelting, casting, extrusion and drawing process, the raw materials used are Ag, Cu, Sn-La, Zn, Cu-Mn, Cu -P, its amount is based on the weight percentage of each raw material in the final product in the following ranges: Ag: 29.5-30.5%, Zn: 31.5-32.5%, Mn: 2.5-3.5%, Sn: 2.5-3.5% , P: 0.4 to 0.8%, La: 0.2 to 0.4%, and the balance is Cu.

specific Embodiment approach 2

[0008] Specific embodiment two: this embodiment is the detailed medium-temperature cadmium-free Ag-based solder preparation method that the applicant has done, and it comprises the following steps successively:

[0009] 1. Addition method of P element: the addition of P needs to pass through the master alloy Cu-P, and the weight content of P in the Cu-P master alloy used in the present invention is 13.5-14%.

[0010] 2. La element addition method: Rare earth elements are active elements, which are easy to oxidize and burn at high temperature, which adds a certain degree of difficulty to the smelting process. If the rare earth elements are directly added, the rare earths will quickly contact with oxygen on the surface of the alloy, and will be burned and cannot enter the alloy. However, due to the Sn-friendly tendency of rare earths, according to the Sn-La phase diagram, it can be seen that after Sn-La is smelted into an alloy, the melting point of the Sn-La alloy increases. Fo...

specific Embodiment approach 3

[0027] Specific Embodiment Three: This embodiment is the preparation process of brazing nickel-free nickel-nickel-nickel (Cu—Sn—B alloy) spectacle frames.

[0028] Brazing process and process specification:

[0029] 1. Surface treatment of the test piece: Since there are oxide films and adsorption layers on the surface of the test piece, and these adsorption layers often affect the brazing quality of the joints, it is necessary to perform necessary film removal treatment before welding. The film method is a manual mechanical film removal method, that is, the surface of the specimen is polished with 240#-1000# water sandpaper, and then rinsed with acetone and absolute ethanol. 2. Selection of heating method: High-frequency induction brazing has the advantages of fast heating speed, easy temperature control, good working environment, easy automatic control of heating specifications, and high pass rate of products, so it is applied to large-scale industrial brazing production , ...

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Abstract

The medium temperature silver base brazing filler metal consists of: Ag 29.5-30.5 wt%, Zn 31.5-32.5 wt%, Mn 2.5-3.5 wt%, Sn 2.5-3.5 wt%, P 0.4-0.8 wt% and La 0.2-0.4 wt% except Cu. The preparation process includes the following steps: selecting material, material throwing and smelting, casting, extrusion and drawing. During the step of material throwing and smelting, electrolytic copper and P-Cu alloy are first heated quickly inside furnace for complete melting, covering agent is added, Zn, Cu-Mn alloy are added successively, Ag and Sn-La are added after lowering the temperature, and the temperature is finally raised to 1050-1100 deg.c while stirring before tapping. The product has the features of no harmful elements contained, relatively low cost, short production process, stable quality and raised extrusion and drawing finished product rate.

Description

Technical field: [0001] The invention relates to a new low-cost, medium-temperature, cadmium-free Ag-based solder formulation and a preparation method thereof for brazing of ferrous metals, non-ferrous metals and hard alloys. Background technique: [0002] In the past 30 years, my country's urbanization process has continued to advance, and people have migrated from rural areas to cities, and the demand for supporting urbanized living materials has increased rapidly. For example, the demand for household appliances represented by refrigerators and air conditioners continues to rise, and building decoration materials and their manufacturing industries are also booming. Brazing technology plays an important role in these emerging industries. According to incomplete statistics, only home appliance manufacturing needs to consume 100 tons of Ag solder per year in China, and building materials processing tools needs to consume 200 tons of Ag solder per year in China. In order to ...

Claims

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Application Information

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IPC IPC(8): B23K35/30B23K35/40
Inventor 何鹏冯吉才钱乙余邓志容
Owner HARBIN INST OF TECH
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