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Radiation-sensitive resin composition, interlayer insulation film, microlens and process for producing them

A resin composition and sensitive technology, applied in the field of radiation-sensitive resin composition, can solve problems that have not yet been seen

Inactive Publication Date: 2007-01-17
JSR CORPORATIOON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When forming a microlens, it is also required that the microlens has a good melt shape (required radius of curvature), high heat resistance, high solvent resistance, and high transmittance, but there is no radiation-sensitive resin combination that meets the above requirements. thing

Method used

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  • Radiation-sensitive resin composition, interlayer insulation film, microlens and process for producing them
  • Radiation-sensitive resin composition, interlayer insulation film, microlens and process for producing them
  • Radiation-sensitive resin composition, interlayer insulation film, microlens and process for producing them

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0176] Synthesis examples and examples are given below to further describe the present invention in detail, but the present invention is not limited to the following examples.

[0177]

[0178] Device: GPC-101 (manufactured by Showa Denko Co., Ltd.)

[0179] Column: GPC-KF-801, GPC-KF-802, GPC-KF-804 and GPC-KF-804 combined

[0180] Mobile phase: tetrahydrofuran containing 0.5% by weight phosphoric acid.

Synthetic example 1

[0183] 1 part by weight of azobisisobutyronitrile, 4 parts by weight of cumyl dithiobenzoate and 50 parts by weight of diethylene glycol ethyl methyl ether were added to a flask equipped with a condenser tube and a stirrer. Then add 20 parts by weight styrene, 20 parts by weight methacrylic acid, 20 parts by weight methacrylic acid tricyclic [5.2.1.0 2，6 ] Decane-8-yl ester and 40 parts by weight of glycidyl methacrylate were replaced with nitrogen, and then slowly stirred. The temperature of the solution was raised to 60°C, and the temperature was maintained for 24 hours, then 3 parts by weight of azobisisobutyronitrile was added, and stirred at 60°C for 4 hours, and 200 parts by weight of diethylene glycol ethyl methyl ether was added to obtain Solution of Copolymer (A-1). The polystyrene-equivalent weight average molecular weight (Mw) of the copolymer (A-1) was 10,000, the molecular weight distribution (Mw / Mn) was 1.4, and the residual monomer was 2.0% by weight. The soli...

Synthetic example 2

[0185]1 part by weight of azobisisobutyronitrile, 4 parts by weight of cumyl dithiobenzoate and 50 parts by weight of diethylene glycol ethyl methyl ether were added to a flask equipped with a condenser tube and a stirrer. Then add 16 parts by weight of methacrylic acid, 18 parts by weight of glycidyl methacrylate, 6 parts by weight of tricyclic methacrylate [5.2.1.0 2，6 ] Decane-8-yl ester, 30 parts by weight of p-vinylbenzyl glycidyl ether, and 30 parts by weight of polyethylene glycol (n=2) monomethacrylate were replaced with nitrogen, and then slowly stirred. The temperature of the solution was raised to 60°C, and the temperature was maintained for 24 hours, then 3 parts by weight of azobisisobutyronitrile was added, and stirred at 60°C for 4 hours, and 200 parts by weight of diethylene glycol ethyl methyl ether was added to obtain Solution of Copolymer (A-2). The polystyrene-equivalent weight average molecular weight (Mw) of the copolymer (A-2) was 11,000, the molecular ...

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Abstract

A radiation-sensitive resin composition that exhibits high radiation sensitivity, having such a development margin that desirable pattern configuration can be formed even when the optimum development time is exceeded in the development step, that is capable of easily forming a patterned thin film excelling in adherence and reduces the amount of sublimed matter occurring at firing, and that is appropriately usable in production of an interlayer insulation film or microlens. There is provided a radiation-sensitive resin composition comprising carboxylated epoxidized polymer (A) exhibiting a ratio of, as measured by gel permeation chromatography, weight average molecular weight (Mw) in terms of polystyrene to number average molecular weight (Mn) in terms of polystyrene, Mw / Mn, of 1.7 or below, and 1,2-quinonediazide compound (B).

Description

technical field [0001] The present invention relates to a radiation-sensitive resin composition, an interlayer insulating film, and a microlens, and methods for their preparation. Background technique [0002] Electronic devices such as thin-film transistor (hereinafter referred to as "TFT") liquid crystal display elements, magnetic head elements, integrated circuit elements, and solid-state imaging elements are generally provided with an interlayer insulating film to insulate interconnections arranged in layers. As a material for forming an interlayer insulating film, since it is preferable to obtain a desired pattern shape with a small number of steps and a material with sufficient flatness, radiation-sensitive resin compositions are widely used (refer to Japanese Patent Laid-Open No. 2001-354822 and Japanese Patent Application Laid-Open No. 2001-343743). [0003] Among the above-mentioned electronic components, for example, TFT liquid crystal display elements are manufac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/023G02B3/00G03F7/00
CPCG03F7/0005G03F7/0233G03F7/022
Inventor 梶田彻蓑轮贵树志保浩司
Owner JSR CORPORATIOON
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