Silicon nitride non-aqueous tape-casting slurry and its preparation method
A silicon nitride non-aqueous-based, casting slurry technology, applied in the field of nitride-based non-aqueous-based casting slurry and its preparation, can solve the problems of lack of research materials and data for non-aqueous-based casting slurry, etc. Achieve the effects of good machinability, simple preparation process and high strength
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[0020] The preparation process of the slurry of the present invention is shown in Figure 1, including batching, mixing, two ball milling and post-treatment procedures.
[0021] (1) Weigh 1 to 6% silicon nitride whiskers and 18 to 25% silicon nitride powder by mass percentage, add absolute ethanol and methyl ethyl ketone as an organic solvent in a ratio of 3:1 to 1:1, Triethyl phosphate is used as a dispersant, the dispersant content is 0.8-6%, and NH 3 ·H 2 O adjust the pH value of the slurry to 9-11 to ensure that the slurry has a high absolute value of Zeta potential, fully exert the electrostatic repulsion between particles, and obtain Si after ball milling on a ball mill for 6-48 hours 3 N 4 Suspension, balls and tanks used for ball milling are silicon nitride balls and nylon ball milling tanks respectively. The aspect ratio of the α-silicon nitride whiskers is 10-200, and the particle size of the silicon nitride powder is about 0.5 μm.
[0022] (2) Add 1 to 8% of poly...
Embodiment 1
[0025] Embodiment 1: The solid content in the design slurry is 35%, the content of α-silicon nitride whiskers is 4.6%, the content of silicon nitride powder is 25%, and the content of dispersant triethyl phosphate is 2.6% %, the content of the binder polyvinyl butyral is 4.2%, the total content of the plasticizer is 4.1%, and the pH value is 9. The slurry is prepared according to the technological process in Figure 1, and the rheology is shown in Figure 2. The micromorphology of the cast film surface obtained after casting is shown in Fig. 5 . The surface of the casting film is smooth, and the powder particles and pores are evenly distributed.
Embodiment 2
[0026] Embodiment 2: The solid content in the design slurry is 33%, the content of α-silicon nitride whiskers is 5.3%, the content of silicon nitride powder is 23%, and the content of dispersant triethyl phosphate is 1.9% %, the content of the binder polyvinyl butyral is 4.7%, the total content of the plasticizer is 3.8%, the pH value is 11, and the slurry is prepared according to the technological process in Figure 1, and the rheological properties are shown in Figure 3 .
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