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Hot plate

Inactive Publication Date: 2005-11-24
IBIDEN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0013] In the hot plate of the present invention, the leakage quantity thereof is 10−7 Pa·m3 / sec (He) or less by measurement with a helium leakage detector. When the leakage quantity is in such a degree, the ceramic substrate mentioned above is sufficiently densely sintered. Thus, the ceramic substrate can give a thermal conductivity of 150 W / m·k or more. Therefore, the ceramic substrate mentioned above has excellent temperature-rising / dropping property. Additionally, at the time of cooling, a gas as a coolant does not permeate the ceramic substrate; therefore, the ceramic substrate has high cooling thermal efficiency and particularly has superior temperature-dropping property.
[0014] Since the above-mentioned ceramic substrate is superior in mechanical property, no warp is generated in the ceramic substrate and the ceramic substrate is also superior in breakdown voltage and Young's modules at a high temperature.
[0025] The average particle diameter of the nitride ceramic powder used in the sintering is preferably from about 0.1 to 5 μm. This is because the powder is easily sintered.

Problems solved by technology

However, such a heater made of metal has the following problems.
Because in a thin metal plate a bend, a strain and so on are generated on the basis of thermal expansion resulting from heating so that a silicon wafer put on the metal plate is damaged or inclined.
However, if the thickness of the heater plate is made thick, a problem that the heater becomes heavy and bulky arises.
However, since the metal plate is thick, the temperature of the heater plate does not follow the change in the voltage or current amount promptly.
Thus, a problem that the temperature is not easily controlled is caused.

Method used

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Examples

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examples 1 to 7

Manufacture of Hot Plates (Reference to FIG. 6)

[0167] (1) The following paste was used to conduct formation by a doctor blade method to obtain a green sheet 0.47 mm in thickness: a paste obtained by mixing 1000 parts by weight of aluminum nitride powder (made by Tokuyama Corp., average particle diameter: 0.6 μm) fired at 500° C. in the air for 1 hour, 40 parts by weight of yttria (average particle diameter: 0.4 μm), 115 parts by weight of an acrylic binder, 5 parts by weight of a dispersant and 530 parts by weight of alcohols composed of 1-butanol and ethanol.

[0168] (2) Next, this green sheet was dried at 80° C. for 5 hours, and subsequently portions for conductor-filled through holes for connection to external terminals 1.8 mm, 3.0 mm and 5.0 mm in diameter were made by punching.

[0169] (3) The following were mixed to prepare a conductor containing paste A: 100 parts by weight of tungsten carbide particles having an average particle diameter of 1 μm, 3.0 parts by weight of an acr...

example 8

Manufacture of a Hot Plate (Reference to FIG. 5)

[0179] (1) A composition made of 1000 parts by weight of aluminum nitride powder (made by Tokuyama Corp., average particle diameter: 0.6 μm) fired at 500° C. in the air for 1 hour, 40 parts by weight of yttria (Y2O3, average particle diameter: 0.4 μm), 115 parts by weight of an acrylic binder and an alcohol was subjected to spray-drying to make granular powder.

[0180] (2) Next, this granular powder was put into a mold and formed into a flat plate form to obtain a formed body (green). A cool isostatic press (CIP) made of Kobe Steel Ltd. was used to compress this formed body at 300 MPa (3 t / cm2) Thereafter, the surface thereof was ground.

[0181] (3) The raw formed body subjected to the above-mentioned working processing was hot-pressed at 1800° C. and a pressure of 20 MPa to obtain a nitride aluminum sintered body having a thickness of 3 mm.

[0182] Next, this plate was cut out into a disc having a diameter of 230 mm to prepare a plate (...

example 9

[0193] The following paste was used to conduct formation by a doctor blade method to obtain green sheets 0.50 mm in thickness: a paste obtained by mixing 100 parts by weight of silicone nitride powder (made by Tokuyama Corp., average particle diameter: 0.6 μm) fired at 500° C. in the air for 1 hour, 40 parts by weight of yttria (average particle diameter: 0.4 μm), 20 parts by weight of alumina, 40 parts by weight of silica, 11.5 parts by weight of an acrylic binder, 0.5 part by weight of a dispersant and 53 parts by weight of alcohols composed of 1-butanol and ethanol.

[0194] The green sheets were used to produce a lamination in the same way as in Example 1. The lamination was degreased at 600° C. and then compressed at a pressure of 300 MPa (3 t / cm2) by means of a cool isostatic press (CIP) made by Kobe Steel Ltd. Next, the same way as in Example 1 was performed except that firing conditions were made as follows: a temperature of 1900° C. and a pressure of 20 MPa (200 kg / cm2). In t...

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Abstract

An object of the present invention is to provide a hot plate which is superior in thermal conductivity, is superior in temperature-rising / dropping property, particularly in temperature-dropping property, and has high cooling thermal efficiency at the time of cooling. The hot plate of the present invention is a hot plate comprising: a ceramic substrate; and a resistance heating element formed on the surface of said ceramic substrate or inside said ceramic substrate, wherein said ceramic substrate has a leakage quantity of 10−7 Pa·m3 / sec (He) or less by measurement with a helium leakage detector.

Description

TECHNICAL FIELD [0001] The present invention relates to a hot plate which is used mainly in the semiconductor industry and has superior temperature-rising / dropping property. BACKGROUND ART [0002] Hitherto, a heater, a wafer prober and the like wherein a base material made of metal such as stainless steel or aluminum alloy is used has been used in semiconductor producing / examining devices and so on, examples of which include an etching device and a chemical vapor deposition device. [0003] However, such a heater made of metal has the following problems. [0004] First, the thickness of the heater plate has to be as thick as about 15 mm since the heater is made of metal. Because in a thin metal plate a bend, a strain and so on are generated on the basis of thermal expansion resulting from heating so that a silicon wafer put on the metal plate is damaged or inclined. However, if the thickness of the heater plate is made thick, a problem that the heater becomes heavy and bulky arises. [000...

Claims

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Application Information

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IPC IPC(8): C04B35/581H05B3/20C04B35/584C23C14/50C23C16/46H01L21/00H05B3/10H05B3/14H05B3/16H05B3/18H05B3/68H05B3/74
CPCH05B3/143H01L21/67103
Inventor HIRAMATSU, YASUJIITO, YASUTAKA
Owner IBIDEN CO LTD
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