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Magnetic field induced deposition method for preparing magnetic nano-gap electrode

A magnetic nano, gap electrode technology, applied in the fields of nanotechnology, nanotechnology, nanostructure manufacturing, etc., can solve the problem that the preparation method is limited to electroplating and electroless plating, the gap between prototype electrodes cannot be too large, and magnetic nanogap electrodes are rare, etc. problem, to achieve the effect of no need for equipment investment, improvement of surface structure and tip shape, and simple method

Inactive Publication Date: 2008-09-17
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, the electroplating method and the electroless plating method both reduce the gap by the online deposition and growth of metal on the electrode pair, but at the same time increase the lateral width of the electrode, and the electroplating method needs to The voltage applied to the leads is only suitable for individual operations on specific devices; the electromigration method not only requires electrical connection between the leads at both ends of the prototype electrode, but also requires that the gap between the prototype electrode pair should not be too large (usually in the quasi-nano or sub-micron scale, The prior art uses the electron beam etching method to prepare its prototype electrode structure)
[0004] Magnetic nanogap electrodes have special application prospects in the manipulation and orderly assembly of magnetic nanoparticles, electromagnetic control research of biomolecules, detection and sensing technology, and research on electron transport characteristics. However, magnetic nanogap electrodes are still very rare at present. The preparation methods involved are also limited to electroplating and electroless plating, and related application research is greatly limited

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Embodiment 1: Gold, silver or copper electrode pairs with micron or submicron gaps are processed on silicon-based materials by ordinary photolithography technology, and used as prototype electrodes. After cleaning the surface of the prototype electrode, put bifunctional molecular sulfur-containing compounds such as mercaptoethylamine or 1,6-hexanedithiol or dimercaptosuccinic acid or thioglycolic acid or NH 2 -(CH 2 )n-S-S-(CH 2 )n-NH 2 (n>2) or NH 2 -(CH 2 )n-S-(CH 2 )n-NH 2 Molecular assembly is carried out in an ethanol solution of (n>2); the above-mentioned electrode assembled with bifunctional molecules is put into colloidal silver or palladium ion solution for electrode surface activation treatment. The above-mentioned electrodes activated by palladium surface are respectively put into nickel, cobalt or magnetic alloy electroless plating solution, and an external magnetic field (magnetic field strength is 0.01~2 tesla) is applied along the electrode pair dir...

Embodiment 2

[0019] Embodiment 2: A pair of gold, silver or copper electrodes with a micron or submicron gap is processed on a silicon-based material by a common photolithography process, and this is used as a prototype electrode. After cleaning the surface, the prototype electrode was put into ethanol solution of mercaptoethylamine for molecular assembly; the above electrode assembled with bifunctional molecules was put into colloidal nickel solution for activation. The above-mentioned nickel-activated electrodes are placed in the electroless plating solution of nickel or nickel alloy, and an external magnetic field (magnetic field strength is 0.01-2 Tesla) is applied along the direction of the electrode pair to induce magnetic nickel metal or nickel alloy on the electrode. The tip of the pair is preferentially deposited and oriented to grow, and finally a nano-gap electrode structure of magnetic nickel or nickel alloy is obtained respectively.

Embodiment 3

[0020] Embodiment 3: Gold, silver or copper electrode pairs with micron or submicron gaps are processed on silicon-based materials by ordinary photolithography technology, and used as prototype electrodes. After cleaning the surface of the prototype electrode, it was put into ethanol solution of mercaptoethylamine for molecular assembly; the above electrode assembled with bifunctional molecules was put into colloidal cobalt solution for activation. The above cobalt-activated electrodes are respectively placed in the electroless plating solution of cobalt or cobalt alloy, and an external magnetic field (magnetic field strength is 0.01-2 tesla) is applied along the direction of the electrode pair to induce magnetic cobalt or cobalt alloy on the electrode. The tip of the pair is preferentially deposited and grown oriented to obtain a nanogap electrode structure of magnetic cobalt or cobalt alloy, respectively.

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Abstract

The invention is a method prepares magnetic nanogap electrode by magnetic field induced guided precipitation which relates to a process technology of nanostructure and nanodevice. The method is by selective precipitation and the magnetic field along the electrode pair synchrostep oriented growing magnetic metal on the normal litho electrode. Narrow the gap between the litho electrode pairs to nanometer grade without widen the side of the electrode so to achieve simple and cheap production of the magnetic nanogap electrode. The prepare method is: first, produce prototype electrode with gap of micrometer or sub-micrometer grade; assemble bi-function molecular and bonding reaction initiator on the surface of the electrode so the surface has got catalysis activity.; put above electrode into the chemical plating agent of magnetic metal or alloy, meanwhile, exert a magnetic field along the electrode pairs to synchrosteply orient the magnetic metal or alloy to ferentially precipitate and grow at the electrode pairs' narrow ends to obtain the magnetic electrode with nanogap.

Description

technical field [0001] The invention relates to a processing technology for nanostructures and nanodevices, in particular to a method for preparing magnetic nanogap electrodes by selective chemical deposition induced by a magnetic field, and belongs to the technical field of nanodevices processing. Background technique [0002] Nanoelectronic devices, whose characteristic size is within the nanoscale (1-100nm), no longer follow the basic operating laws of traditional microelectronics, and the volatility and quantum effects of electrons will play an important role in such devices. Breakthroughs in key technologies are expected to become new economic growth points and will have a profound impact on all aspects of human society. Nanofabrication technology is the basis for the development of nanoelectronic devices. [0003] Nano-gap electrodes are a key structure or basis for the development of nanoelectronic devices, especially single-electron devices. Electron beam etching (...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B82B3/00H01L21/288H01L21/445
Inventor 徐丽娜顾宁解胜利黄岚
Owner SOUTHEAST UNIV
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