Method of preparing metal roller with surface relief microstructure

Abstract

The invention discloses a preparing method of metallic roller with surface relief microstructure, which comprises the following steps: (1) applying photo resist on the metallic roller; producing microstructure mask on the photo resist; removing light part until metallic surface emergence through development; (2) placing the processing metallic roller in electromoulding solution; connecting to electrical source negative pole; proceeding metallic electrodeposition with the thickness of deposition at 150-500 nanometer; (3) getting out of metallic roller from electromoulding solution; removing surplus photo resist; getting the metallic roller. This invention combines the photolithographic process and electromoulding to realize the production of metallic roller.

Description

technical field [0001] The invention relates to the field of micro-machining metal surfaces, in particular to a method for machining relief microstructures on the surface of a cylinder by combining methods such as laser interference lithography and electroforming. Background technique [0002] In order to replicate surface relief microstructures in large quantities, the LIGA (lithography-electroforming) process is usually used to facilitate the replication of the mother board. On the cathode of the electroforming tank, a metal nickel plate of a certain thickness is deposited on the photoresist, and then separated from the photoresist. A relief structure is formed on the metal nickel plate, and a metal nickel master plate is made. Then use the master plate to recast the metal working plate. Here, the advantage of the photolithography-electroforming process is that the electroforming copy is fast and easy. [0003] In the actual replication production process, it is necessary...

AI Technical Summary

Problems solved by technology

The existing problems are: (1) When pulsed lasers with wavelengths of 1060nm and 532nm process the surface of materials (such as metals), the material has a low absorption rate of light and the thermal effect is very obvious. During processing, the material is ablated by locally generating high temperature , a large amount of light energy is converted into heat energy, forming a crater effect; (2) In order to obtain a high average power laser output, the laser beam used is a multi-transverse mode spot, and the spot quality is poor (M 2 <10), therefore, the minimum light spot is generally around 30-50 μm, the multi-mode laser beam cannot be focused into a thinner beam, and the processing accuracy is limited; (3) In order to obtain a deeper processing effect, high repetition frequency pulse work ( ~20kHz) mode, using vectorization mode during scanning, forming multiple repeated laser pulse processing at the same processing position (light spot), the material has a low absorption rate of the first pulse laser, but the energy absorption of subsequent pulses increases , which is conducive to deeper processing, but is more prone to cratering

[0020] However, when the above-mentioned process is directly transplanted to the surface of the metal drum to process the microstructure, it encounters difficulties

The main problem is that, unlike silicon substrates, the etch rate of metal is much lower than that of photoresist, so that the photoresist needs to be etched deeply, when the duty cycle of the photoresist grating groove ( When depth / stripe width) is greater than 2:1, the etching of photoresist is more difficult; A New Process Method for Fabricating Microstructures on Rollers

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