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Method for preparing Cu-TiNi composite material

A technology of composite materials and raw materials, applied in the field of preparation of Cu-TiNi composite materials, can solve the problems of interface debonding, poor interface bonding strength, failure, etc., and achieve the effects of high interface bonding strength, improved thermal conductivity and high thermal conductivity.

Inactive Publication Date: 2008-05-14
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because the patented method adopts cold die forging to prepare Cu / TiNi composite material, Cu and TiNi alloy in the composite material are combined by mechanical meshing, and the interface bonding strength is poor. When used, due to the difference in thermal expansion coefficient between Cu and TiNi alloy Huge difference leads to interface debonding and failure

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] 1. Red copper plate and TiNi alloy strip containing 55wt% Ni are used as raw materials. There are two copper plates, one of which is 4.2mm thick, on which a plurality of small grooves of 2.4mm deep, 2.0mm wide, and 2.0mm apart are processed; the other is about 1.8 mm thick. TiNi alloy 2.5mm thick, wire cut to a TiNi alloy strip with an end face size of 2.5mm×2.0mm, the length depends on the size of the copper plate;

[0020] 2. After pickling the purple Cu plate and TiNi alloy strip to remove the oxide film, they are embedded and riveted and fixed, and the whole is placed in a hydrogen-protected resistance heating furnace, heated to 750 ° C, kept for 40-50 minutes, and then a reduction of 65% is carried out hot rolling to obtain Cu / TiNi composite sheet material;

[0021] 3. Heat the Cu / TiNi composite material obtained in step (2) in a vacuum heating furnace at 750°C for 2 hours. After water-cooling and quenching, apply a compressive stress of 360 MPa along the longitud...

Embodiment 2

[0023] 1. Red copper plate and TiNi alloy strip containing 57wt% Ni are used as raw materials. There are two copper plates, one of which is 4.2mm thick, and a plurality of small grooves of 2.4mm deep, 2.0mm wide, and 2.0mm apart are processed on it; the other is about 1.8mm thick. TiNi alloy 2.5mm thick, wire cut to a TiNi alloy strip with an end face size of 2.5mm×2.0mm, the length depends on the size of the copper plate;

[0024] 2. Pickling the purple Cu plate and TiNi alloy strip to remove the oxide film, then inserting and riveting them, place the whole in a hydrogen-protected resistance heating furnace, heat to 780°C, keep it warm for 40-50min, and then carry out a reduction of 70% hot rolling to obtain Cu / TiNi composite sheet material;

[0025] 3. Heat the Cu / TiNi composite material obtained in step (2) in a vacuum heating furnace at 780°C for 2 hours. After water-cooling and quenching, apply a compressive stress of 311MPa along the longitudinal direction of the plate,...

Embodiment 3

[0027] 1. Red copper plate and TiNi alloy strip containing 58wt% Ni are used as raw materials. There are two copper plates, one of which is 4.2mm thick, and a plurality of small grooves with a depth of 2.4mm, a width of 2.0mm, and a distance of 2.0mm are processed on it; the other is about 1.8mm thick. TiNi alloy 2.5mm thick, wire cut to a TiNi alloy strip with an end face size of 2.5mm×2.0mm, the length depends on the size of the copper plate;

[0028] 2. After pickling the purple Cu plate and TiNi alloy strip to remove the oxide film, they are embedded and riveted and fixed, and the whole is placed in a hydrogen-protected resistance heating furnace, heated to 820 ° C, kept for 40-50 minutes, and then a reduction of 75% is carried out hot rolling to obtain Cu / TiNi composite sheet material;

[0029] 3. Heat the Cu / TiNi composite material obtained in step (2) in a vacuum heating furnace at 810°C for 2 hours. After water-cooling and quenching, apply a compressive stress of 239M...

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Abstract

The invention discloses a Cu-TiNi composite material preparation method, comprising the following steps: firstly, raw material preparation; secondly, composite structure manufacture; thirdly, hot-rolling compounding; fourthly, solid melting process; fifthly, crushing stress aging treatment. The invention has the advantages that: the preparation method is simple technology; the combining limiting interface of Cu-TiNi composite material has high-strength, small expansion coefficient, high heat conduction rate, low density; the invention is a renewing product for the prior electronic packaging material; the invention is suitable for industrial production, which satisfies the requirements of modern electronic industry for packaging material.

Description

technical field [0001] The invention relates to a preparation method of a Cu-TiNi composite material with low thermal expansion coefficient and high thermal conductivity. The composite material can be used as a heat sink for electronic packaging and belongs to the technical field of functional materials. Background technique [0002] Since the birth of the simplest silicon monolithic integrated circuit in 1958, integrated circuit technology has gone through several development stages of small-scale integrated circuits, medium-scale integrated circuits, large-scale integrated circuits, very large-scale integrated circuits and hybrid microcircuits. In the integrated circuit, the packaging material plays the role of fixing the chip, protecting the internal components, transmitting electrical signals and dissipating the heat of the components, and is a key component of the integrated circuit. With the development of integrated circuits towards high density, miniaturization, and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/01H05K7/20B21B1/38B21B47/00B23K20/04C22F1/00
Inventor 李劲风郑子樵
Owner CENT SOUTH UNIV
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