Lead-free solder solder paste for electronic industry and method for manufacturing soldering fluid

Abstract

The invention relates to a welding material, in particular to a preparation method of electronic industry-used lead-free solder paste and flux; wherein, the welding material comprises 85 to 90% lead-free solder powder and 10 to 15% flux; the lead-free solder powder is a 25 to 45 micrometer lead-free solder made by tin, copper, silver and titanium; the flux comprises a high viscosity rosin, an organic acid activator, a thixotropic agent, a wetting agent and a solvent. The welding material has the advantages of green environmental protection of lead-free solder, resolving the drawbacks of lead-free solder of high melting point and low fluidity, high expansion rate, no- halogen, low post-weld residue and corrosive property, high insulation resistance, and good protection performance.

Description

(1) Technical field:

[0001] The invention relates to a welding material, in particular to a preparation method of a lead-free solder solder paste and flux for the electronic industry. (two) background technology:

[0002] In recent years, as people pay more and more attention to environmental protection, environmental protection laws and regulations are becoming more and more strict. Lead-free solder pastes that do not contain lead, mercury, cadmium, chromium 6+, etc. have been used in large quantities. The existing lead-free solder pastes have problems such as few types, easy drying, poor soldering performance, and unsatisfactory printing performance. The present invention provides a high-reliability lead-free solder paste for the electronics industry with good soldering and printing performance in order to overcome the above-mentioned shortcomings and deficiencies of the prior art. (3) Contents of the invention:

[0003] The object of the present invention is to design ...