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Positive-type photosensitive resin composition

A technology of photosensitive resin and composition, which is applied in the direction of optics, photomechanical equipment, photosensitive materials used in photomechanical equipment, etc., can solve the problems of poor mechanical properties and storage stability, difficulties, and large changes in sensitivity, and achieve preservation The effect of excellent stability and good mechanical properties

Active Publication Date: 2012-08-08
TORAY IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these resin compositions have problems of poor mechanical properties and storage stability, and large changes in sensitivity.
For the above reasons, it is difficult to use these resin compositions instead of photosensitive polyimide or photosensitive polybenzoxazole in applications such as surface protection films and interlayer insulating films of semiconductor elements.

Method used

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  • Positive-type photosensitive resin composition
  • Positive-type photosensitive resin composition
  • Positive-type photosensitive resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0100] The following examples are given to illustrate the present invention, but the present invention is not limited to these examples. In addition, the evaluation of the photosensitive resin composition in an Example was performed by the following method.

[0101] (1) Pattern processability evaluation

[0102] Preparation of photosensitive resin film

[0103] A photosensitive resin composition (hereinafter referred to as varnish) is coated on a 6-inch silicon wafer so that the film thickness after prebaking is T1=8.0 μm, and then a hot plate (coating and developing device Mark Co., Ltd. manufactured by Tokyo Electron Co., Ltd.) is used. -7) Prebaking at 120° C. for 3 minutes to obtain a photosensitive resin film.

[0104] Film Thickness Measuring Method

[0105] Using Lambda Ace STM-602 manufactured by Dainippon Screen Manufacturing Co., Ltd., the film after prebaking and development was measured at a refractive index of 1.629, and the cured film was measured at 1.773...

Synthetic example 1

[0126] Synthetic Example 1 Synthesis of Hydroxyl-containing Anhydride (a)

[0127] Under a stream of dry nitrogen, 18.3g (0.05mol) of 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (BAHF) and 34.2g (0.3mol) of allyl glycidyl ether were dissolved in 100g of γ-butyrolactone (GBL), cooled to -15°C. A solution obtained by dissolving 22.1 g (0.11 mol) of anhydrous trimellitic acid chloride in 50 g of GBL was added dropwise thereto so that the temperature of the reaction liquid would not exceed 0°C. After completion of the dropwise addition, the reaction was carried out at 0° C. for 4 hours. This solution was concentrated with a rotary evaporator, and added to 1 L of toluene to obtain a hydroxyl-containing acid anhydride (a) represented by the following formula.

[0128]

[0129] Hydroxy-containing anhydride (a)

Synthetic example 2

[0130] Synthetic Example 2 Synthesis of Hydroxyl-containing Diamine Compound (b)

[0131] 18.3 g (0.05 mol) of BAHF was dissolved in 100 mL of acetone and 17.4 g (0.3 mol) of propylene oxide, and cooled to -15°C. A solution obtained by dissolving 20.4 g (0.11 mol) of 3-nitrobenzoyl chloride in 100 mL of acetone was added dropwise thereto. After completion of the dropwise addition, the reaction was carried out at -15°C for 4 hours, and then returned to room temperature. The precipitated white solid was filtered and dried under vacuum at 50°C.

[0132] 30g of solid was added into a 300mL stainless steel autoclave, dispersed in 250mL of methyl cellosolve, and 2g of 5% palladium on carbon was added. Hydrogen is introduced into it with a balloon, and the reduction reaction is carried out at room temperature. After about 2 hours, it was confirmed that the balloon could no longer shrink, and the reaction was terminated. After completion of the reaction, the palladium compound as ...

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Abstract

The invention provides a positive-type photosensitive resin composition that is produced with novolac resin and has good mechanical properties and high storage stability. A positive-type photosensitive resin composition, comprises: (a) a novolac resin; (b) a polymer comprising, as a main component, a structure represented by formula (1) below and / or a structure represented by formula (2) below: (wherein formulae (1) and (2), R<1> and R<2> may be the same or different and each represent an organic group having at least two carbon atoms and a valence of 2 to 8, R<3> and R<4> may be the same or different and each represent hydrogen or a monovalent organic group of 1 to 20 carbon atoms, -NH-R<5> in formula (1) and -CO-R<6> in formula (2) each represent a polymer end group, R<5> and R<6> each represent a monovalent organic group having 2 to 30 carbon atoms which includes an unsaturated hydrocarbon group, n is in the range of 10 to 100,000, l and m each represent an integer of 0 to 2, and p and q each represent an integer of 0 to 4, provided that p+q>0; (c) a quinone diazide compound; (d) an alkoxymethyl group-containing compound; and (e) a solvent.

Description

technical field [0001] The present invention relates to a positive photosensitive resin composition. More specifically, it relates to a positive-type photosensitive resin composition suitable for a surface protection film of a semiconductor device, an interlayer insulating film, an insulating layer of an organic electroluminescent device, etc., and partially soluble in an alkaline developer after exposure to ultraviolet rays. Background technique [0002] Heat-resistant resins such as polyimide and polybenzoxazole have excellent heat resistance and electrical insulation properties, so they can be used as surface protection films and interlayer insulation films of semiconductor devices such as LSI (large-scale integration) . In recent years, along with the miniaturization of semiconductor elements, a resolution of several micrometers is also required for surface protection films, interlayer insulating films, and the like. Therefore, in the above-mentioned applications, fine...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/023C08F290/06C08F299/02C08G73/10C08G73/22G03F7/004G03F7/022H01L21/027
Inventor 藤田阳二有本真治池鲤生
Owner TORAY IND INC
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