Light-sensing organic field-effect transistor and preparation method thereof
An organic field and transistor technology, which is applied in the field of light-sensing organic field-effect transistors and its preparation, can solve the problems of lack of applications of different aggregation states of high light-sensitive semiconductors, and achieve the effects of low cost, high response, and good application prospects
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Embodiment 1
[0049] This embodiment prepares light-sensing organic field-effect transistor according to the following steps:
[0050] 1) The substrate layer used is a single crystal silicon wafer with a thickness of 400-500 microns, and the gate electrode is highly doped silicon (such as nitrogen or phosphorus, with a doping concentration of 1 to 9×10 per cubic meter. 20 ), the thickness of the gate electrode is about 400-500 microns;
[0051] 2) According to silicon thermal oxidation method (Wang Yongzhen, Gong Guoquan, Cui Jingzhong, Preparation and Application of Silicon Dioxide Thin Film, Vacuum and Low Temperature, 2003, 9, 228), an insulating layer was prepared on the gate electrode, and the material constituting the insulating layer was dioxide Silicon; wherein, the temperature of thermal oxidation is 900-1200°C, and the thickness of the insulating layer is 500 nanometers;
[0052] 3) The substrate deposited with an insulating layer obtained in step 2) is ultrasonically cleaned wit...
Embodiment 2
[0077] According to the same preparation method as in Example 1, only the good solvent in step 4) is changed to chloroform, and the poor solvent is methanol, and the photosensitive organic field effect is obtained under the same preparation conditions as in Example 1 above. Transistor, the morphology and device performance of the transistor are the same as those in Example 1.
Embodiment 3
[0079] According to the same preparation method as in Example 1, only the good solvent in step 4) was changed to toluene, and the poor solvent was methanol, and the light-sensing organic field effect transistor was obtained under the same preparation conditions as in Example 1 above, The morphology and device performance of the transistor are the same as those in Example 1.
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