Alloy high temperature oxidation resisting nanostructure conductive coating prepared with spinel powder reduction method

A technology of high temperature oxidation resistance and spinel structure, which is applied to conductive layers on insulating carriers, heating inorganic powder plating, circuits, etc. The method is simple, the film thickness is uniform and controllable, and the repeatability is strong.

Inactive Publication Date: 2010-03-17
SHANGHAI INST OF CERAMIC CHEM & TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The disadvantage is the spinel coating process. After the slurry coating, the coating alloy generally needs to be reduced in a reducing atmosphere to improve the bonding degree of the coating and the alloy, but this brings difficulties to the actual operation. a lot of inconvenience
Especially for the processing of the large-scale metal connection plate actually used in the stack, a relatively large high-temperature reduction space is required, which increases the difficulty and cost of preparation

Method used

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  • Alloy high temperature oxidation resisting nanostructure conductive coating prepared with spinel powder reduction method
  • Alloy high temperature oxidation resisting nanostructure conductive coating prepared with spinel powder reduction method
  • Alloy high temperature oxidation resisting nanostructure conductive coating prepared with spinel powder reduction method

Examples

Experimental program
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Effect test

Embodiment 1

[0034] Preparation and reduction treatment of spinel nanopowder materials: (i) prepared by citric acid gel (Pechini) method (Mn 0 / 9 Y 0.1 co 2 o 4 ) Spinel structure nanopowder material: the soluble salt of Y, Mn and Co is dissolved in deionized water at a ratio of 0.1:0.9:2 in the molar ratio of Y ions, Mn ions and Co ions, wherein Y ions, The total concentration of Mn ions and Co ions is 1 mol / L; add citric acid 3 times the total molar weight of Y ions, Mn ions and Co ions, mix and stir evenly, and heat and volatilize the solution at 80°C to form a sol. The sol was further dried in an oven at 160°C, expanded and solidified into a xerogel, heated and burned in a high-temperature furnace at 400°C to remove organic matter as much as possible, and then calcined at 700°C to burn off residual organic matter and form a phase. After that, it was further ball-milled in absolute ethanol and dried to obtain Y-doped Mn-Co(Mn 0.9 Y 0.1 co 2 o 4 ) spinel nano powder material. (ii)...

Embodiment 2

[0040] Preparation and reduction treatment of spinel nanopowder materials: (i) prepared by combustion method (MnCo 1.8 Fe 0.2 o 4 ) Spinel structure nanopowder material: the soluble salt of Mn, Co and Fe is dissolved in deionized water at the ratio of 1:1.8:0.2 in the molar ratio of Mn ion, Co ion and Fe ion, wherein the total amount of cations is The concentration is 1mol / L; add glycine 3 times the total molar amount of cations, mix and stir evenly, heat and dry the liquid on an electric furnace and then burn it, and the burned powder is heated in a high-temperature furnace at 700°C to remove residual organic matter and form a phase . Then further ball milling in absolute ethanol and drying to obtain Mn-Co-Fe nano powder material. (ii) The nano-powder was further reduced at 700° C. under a hydrogen reducing atmosphere for 1 hour, and the temperature was lowered to obtain an intermediate powder for coating.

[0041] Preparation of the coating film: (i) mix the powder after...

Embodiment 3

[0043] Preparation and reduction treatment of spinel nanopowder materials: (i) prepared by citric acid gel (Pechini) method (Mn 1.5 co 1.5 o 4 ) Spinel structure nanopowder material: the soluble salt of Mn and Co is dissolved in deionized water at a ratio of 1:1 by the molar ratio of Mn ions and Co ions, wherein the concentration of the sum of Mn ions and Co ions is 2mol / L; Mn in other preparation steps and embodiment 1 0.9 Y 0.1 co 2 o 4 Nano powder preparation and sintering conditions are the same. (ii) Mn to be prepared 1.5 co 1.5 o 4 The nano-powder was further reduced at 700° C. for 2 hours in a hydrogen reducing atmosphere, and the temperature was lowered to obtain an intermediate powder for coating.

[0044] Preparation of the coating film: (i) mix the powder after the above-mentioned reduction treatment with terpineol and ethyl cellulose, etc., and carry out ball milling for 15 hours to obtain a powder slurry for the coating film, wherein the organic slurry i...

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Abstract

The invention provides a preparing method of an alloy high temperature oxidation resisting nanostructure conductive coating, i.e. a spinel powder reduction coating method. On one hand, coating powdermaterial with favorable sintering performance is obtained by the regulation and control of the preparing process of coating powder material and effective reductive treatment; on the other hand, a nanometer microstructure film is prepared on the alloy surface by adopting silk screen assisted improved sizing agent coating technology. The film has controllable and even thickness and superior performance, and coating is tightly combined with the alloy; the coating alloy has lower area specific resistance (ASR) and higher long-time running stability under high temperature oxidation environment. Thespinel powder reduction coating method originated by the invention has simple film manufacturing method, low cost and strong repetitiveness, can be applied to coating preparation of alloy with different shapes or sizes, has superiority especially when preparing the large-area alloy coating in practical application, can greatly lower the preparing cost of the alloy coating and has strong applicability.

Description

technical field [0001] The invention relates to a method for preparing an alloy high-temperature-resistant oxidation nanostructure conductive coating, in particular to a spinel powder reduction method for preparing an alloy high-temperature oxidation-resistant nanostructure conductive coating, which belongs to the field of energy materials. Background technique [0002] As the operating temperature of SOFC decreases, it is possible to use low-cost alloys as connecting plates. The characteristics of easy processing, high electrical conductivity and high thermal conductivity of the alloy connecting plate are very beneficial to the cost reduction and stress relaxation of the SOFC stack. However, in order to make the possibility a reality, the long-term stability or life of the alloy connecting plate in the SOFC environment must also be solved; this problem has become one of the main obstacles restricting the development of the plate-type SOFC. The oxide scale formed on the sur...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C24/08H01B5/14H01B13/00
Inventor 辛显双王绍荣温廷琏
Owner SHANGHAI INST OF CERAMIC CHEM & TECH CHINESE ACAD OF SCI
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