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Curable resin composition, dry membrane and printed circuit board using same

A technology of curable resin and composition, applied in printed circuit parts, secondary processing of printed circuit, photosensitive materials for opto-mechanical equipment, etc. problems, achieving the effects of low flame retardancy, low warpage, low environmental burden, and excellent flexibility

Active Publication Date: 2010-09-29
TAIYO HLDG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the current situation is that these methods of improving affinity have little effect on aluminum hydroxide, and basically cannot obtain the effect of improving the curvature of the cured film.

Method used

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  • Curable resin composition, dry membrane and printed circuit board using same
  • Curable resin composition, dry membrane and printed circuit board using same
  • Curable resin composition, dry membrane and printed circuit board using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0173] Hereinafter, although an Example and a comparative example are shown and this invention is concretely demonstrated, this invention is not limited to a following example. In addition, the following "parts" and "%" refer to a mass basis unless otherwise specified.

Synthetic example

[0175] (A-1) is equivalent to the synthesis of the resin of aforementioned carboxyl-containing resin (5):

[0176] 2400 g (3 moles) of polycarbonate diol derived from 1,5-pentanediol and 1,6-hexanediol (manufactured by Asahi Kasei Chemicals Corporation, TJ5650J) were charged into a reaction vessel equipped with a stirring device, a thermometer, and a condenser. , number average molecular weight 800), 603 g (4.5 moles) of dimethylolpropionic acid and 238 g (2.6 moles) of 2-hydroxyethyl acrylate as a monohydroxy compound. Then, 1887g (8.5 moles) of isophorone diisocyanate as a polyisocyanate was put in, heated to 60°C while stirring, and then stopped. When the temperature in the reaction vessel began to drop, it was heated again, and the stirring was continued at 80°C. The spectrum confirms the absorption spectrum of the isocyanate group (2280cm -1 ) disappears, the reaction ends. Then, carbitol acetate was added so that the solid content would be 50% by mass. The acid valu...

Embodiment 1～9、 comparative example 1～4

[0185] Use the resin solution of above-mentioned synthesis example, mix according to the various compositions shown in Table 1 and the ratio (mass part) shown in Table 1, carry out pre-mixing by agitator, then carry out kneading with 3 roller mills, prepare resistance Solder curable resin composition. Here, the particle size was measured with a particle size analyzer manufactured by ERICHSEN, and the degree of dispersion of the curable resin composition obtained was evaluated to be 15 μm or less.

[0186] [Table 1]

[0187]

[0188]

[0189] Performance evaluation:

[0190] optimal exposure

[0191] A circuit pattern substrate with a copper thickness of 35 μm is ground with a polishing roll, washed with water, dried, and then coated with the thermosetting and photocurable resins of Examples 2 to 9 and Comparative Examples 1 to 4 above by the screen printing method on the entire surface. The composition was dried in a hot air circulation drying oven at 80° C. for 3...

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Abstract

The invention provides a curable resin composition, dry membrane and printed circuit board using the same, more particularly, the invention provide a curable resin composition and a dry membrane, as well as a printed circuit board formed by a flame-resistant curable membrane such as a solder resisting membrane and the like formed by using the same, wherein, the curable resin composition has a halogen-free flame retardant, and can form a solder resisting layer with low warpage and excellent flame resistance and bending. The curable resin composition contains (A) carboxyl-contained resin, (B) aluminium hydroxide and (C) spherical silica a thermocuring resin composition comprises the above (A), (B) and (C), and (D) a thermocuring component with more than two ring-shaped ether group and / or ring-shaped sulfide group, and a photocuring thermocuring resin composition comprises the above (A), (B), (C) and (D), and (F) a photopolymerisable initiator and (G) a photopolymerisable monomer, preferably contains (E) a phosphorus-containing compound.

Description

technical field [0001] The present invention relates to a curable resin composition, and particularly relates to a curable resin composition capable of forming a solder resist having low warpage and excellent flame retardancy and flexibility. The present invention also relates to a dry film and a flame-retardant printed circuit board using the curable resin composition. Background technique [0002] Conventionally, since printed wiring boards and flexible wiring boards (hereinafter, abbreviated as FPC) are mounted on electronic devices, they are required to have flame retardancy, and some solder resists thereof are also required to have flame retardancy. Among them, FPC is generally composed of a polyimide substrate, so it is a thin film, unlike a printed circuit board with a glass epoxy substrate. However, since the solder resist to be applied has the same film thickness both on the printed circuit board and on the FPC, the burden of flame retardancy of the solder resist i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L75/16C08L63/10C08K13/06C08K9/06C08K3/36C08K3/22G03F7/004G03F7/027H05K1/02
CPCC08F290/06C08J5/18C08K3/22C08K3/36C08K7/18C08K9/06C08K2003/2227C08L75/04H05K3/28
Inventor 横山裕米田一善有马圣夫
Owner TAIYO HLDG CO LTD
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