Method for preparing catalytic conductive particles suitable for printed electronics
A conductive particle, catalytic technology, applied in the direction of carbon silicon compound conductors, conductors, circuits, etc., can solve the problems of unsuitability for printer use, large particle size, etc., and achieve obvious price advantages, light weight, high dispersion stability.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0023] The sensitized and activated conductive carbon powder with a diameter of 30 nm was uniformly dispersed ultrasonically in a mixed solution containing perfluorooctanesulfonyl fluoride and cetyltrimethylammonium bromide at a concentration of 0.5 g / L. Electroless nickel plating on its surface, loaded with catalytic metal nickel. The particles with catalytic Ni / C structure were obtained by centrifugation.
Embodiment 2
[0025] The sensitized and activated conductive carbon powder with a diameter of 30nm was ultrasonically dispersed in a mixed solution containing perfluorooctanesulfonyl fluoride and polyvinylpyrrolidone at concentrations of 2ml / L and 0.5g / L, respectively. The alloy of nickel and palladium is electrolessly plated on its surface, and a catalytic metal nickel-palladium alloy is loaded on it. The particles with catalytic Ni-Pd / C structure were obtained by centrifugal separation.
Embodiment 3
[0027] Ultrasonic uniformly disperse the sensitized and activated acetylene carbon black powder with a diameter of 40nm in a mixed solution containing cetyltrimethylammonium bromide and polyvinyl alcohol at a concentration of 0.5g / L and 1.0g / L respectively . The surface is chemically plated with palladium and loaded with catalytic metal palladium. The particles with catalytic Pd / C structure were obtained by centrifugation.
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More