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Method for preparing catalytic conductive particles suitable for printed electronics

A conductive particle, catalytic technology, applied in the direction of carbon silicon compound conductors, conductors, circuits, etc., can solve the problems of unsuitability for printer use, large particle size, etc., and achieve obvious price advantages, light weight, high dispersion stability.

Inactive Publication Date: 2010-11-24
SUN YAT SEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Cao Ding et al. (Preparation of silver-coated glass fibers by ultrasonic treatment electroless plating [J]. Powder Metallurgy Materials Science and Engineering, 2009, 14, 422-426) reported a silver-coated glass fiber prepared by ultrasonic treatment, the glass used The fiber reaches the level of tens of microns, and the particle size is relatively large after silver plating, which is not suitable for printers

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] The sensitized and activated conductive carbon powder with a diameter of 30 nm was uniformly dispersed ultrasonically in a mixed solution containing perfluorooctanesulfonyl fluoride and cetyltrimethylammonium bromide at a concentration of 0.5 g / L. Electroless nickel plating on its surface, loaded with catalytic metal nickel. The particles with catalytic Ni / C structure were obtained by centrifugation.

Embodiment 2

[0025] The sensitized and activated conductive carbon powder with a diameter of 30nm was ultrasonically dispersed in a mixed solution containing perfluorooctanesulfonyl fluoride and polyvinylpyrrolidone at concentrations of 2ml / L and 0.5g / L, respectively. The alloy of nickel and palladium is electrolessly plated on its surface, and a catalytic metal nickel-palladium alloy is loaded on it. The particles with catalytic Ni-Pd / C structure were obtained by centrifugal separation.

Embodiment 3

[0027] Ultrasonic uniformly disperse the sensitized and activated acetylene carbon black powder with a diameter of 40nm in a mixed solution containing cetyltrimethylammonium bromide and polyvinyl alcohol at a concentration of 0.5g / L and 1.0g / L respectively . The surface is chemically plated with palladium and loaded with catalytic metal palladium. The particles with catalytic Pd / C structure were obtained by centrifugation.

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Abstract

The invention discloses a method for preparing catalytic conductive particles suitable for printed electronics. The method comprises the following steps of: first dispersing pre-treated nano-scale carbon powder into solution under the action of an auxiliary agent, then uniformly plating and coating catalytic metal on the surface of the carbon powder by a chemical plating method, and finally performing centrifugal separation to obtain a product. The particles prepared by the method are metal-coated carbon particles, which are very light and have obvious price advantage compared with expensive and relatively heavy nanometer pure silver particles or nanometer pure copper particles; the catalytic conductive particles have chemical plating catalytic capability, have a uniform spherical shape and the diameter of less than 100 nanometers and are suitable for the printed electronics; and secondary chemical plating treatment on the surfaces of the particles is easy to realize.

Description

technical field [0001] The invention relates to a preparation technology of catalytic conductive particles. Background technique [0002] The preparation process of conductive nanoparticles suitable for printed electronics is a hot research direction in the field of conductive inks in recent years. People try to use physical and chemical processing methods to obtain conductive nano-metal particles of nano-scale copper and silver, which are used to produce conductive inks to print electronic circuits. [0003] However, due to the high price of nano-silver, the production cost of nano-silver conductive ink is too high, which limits its application; while nano-copper is prone to oxidation, and anti-oxidation protection is required in the process of processing and printing electronics, resulting in complicated process and poor stability, which also limits its promotion. application. [0004] Based on this, the present invention loads cheap metals with good electrical conductiv...

Claims

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Application Information

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IPC IPC(8): H01B1/02H01B1/04H01B5/00H01B13/00C23C18/18C23C18/32C23C18/42C23C18/50
Inventor 崔国峰郭燕芬
Owner SUN YAT SEN UNIV