Aqueous cutting fluid and aqueous cutting agent

A technology of cutting fluid and cutting slurry, applied in the direction of grinding/polishing equipment, base materials, additives, etc., to achieve the effect of high processing accuracy

Inactive Publication Date: 2015-01-28
NISSHIN CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] The inventors have learned that the outstanding problems are solved by adding 0.01-20% by weight of acetylenic diols and / or their alkylene oxide adducts to aqueous cutting fluids

Method used

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  • Aqueous cutting fluid and aqueous cutting agent
  • Aqueous cutting fluid and aqueous cutting agent
  • Aqueous cutting fluid and aqueous cutting agent

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0059] A fluid, labeled M-1, was obtained by mixing 13% deionized water, 18% PEG200 and 68% diethylene glycol, and adding 1% acetylenic diol A (2,5,8,11-tetra Methyl-6-dodecyn-5,8-diol ethylene oxide adduct, which added 4 moles of ethylene oxide) in the system. This liquid was mixed with a silicon carbide (SiC) abrasive (Shinano Electronic Refining Co., Ltd., GC#1000, average particle size 11 microns) and stirred until an aqueous slurry for cutting silicon ingots was obtained.

[0060] The determination of the abrasive dispersion stability of the water-based cutting slurry is carried out by measuring the average particle size just after it is prepared and after it has been kept standing for 24 hours. The results are shown in Table 3. The viscosity stability and processing accuracy of the slurry were measured by cutting a silicon ingot under the following conditions. The results are also listed in Table 3.

[0061] Cutting conditions

[0062] Cutting tool: multi wire saw ...

Embodiment 2～11 and comparative Embodiment 1～7

[0081] As described in Example 1, an aqueous cutting fluid (M-2 to M-18) was prepared by mixing and stirring the component amounts as described in Tables 1 and 2. As described in Example 1, this liquid was mixed with silicon carbide abrasive (Shinano Electronic Refining Co., Ltd., GC#1000, average particle size 11 μm) and stirred until an aqueous slurry was obtained.

[0082] The dispersion stability of the prepared aqueous cutting slurry abrasive was evaluated by measuring the average particle size just after preparation and after 24 hours of storage. The results are shown in Tables 3 and 4. The slurry was also evaluated for its viscosity stability and processing accuracy by cutting a silicon ingot under the same conditions as in Example 1. The results are also shown in Tables 3 and 4.

[0083] Table 1

[0084]

[0085] Table 2

[0086]

[0087]

[0088] Alkyne diol A: Ethylene oxide adduct of 2,5,8,11-tetramethyl-6-dodeyn-5,8-diol with 4 moles of ethylene oxide ...

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Abstract

The invention relates to an aqueous cutting fluid and aqueous cutting agent. The aqueous cutting fluid contains 0.01-20 wt% of alkyndialcohol or its alkylidene oxide affixtures, the aqueous cutting fluid is then combined with a grinding medium to form an aqueous cutting agent, the aqueous cutting agent has advantages of disperse stability and viscosity stability of grinding medium and higher machining precision.

Description

technical field [0001] The present invention relates to an aqueous cutting fluid and slurry that facilitates the cutting of workpieces, including ingots of silicon, quartz, crystal, compound semiconductors, magnets, etc., for semiconductor, solar cell and other industrial fields. More specifically, the present invention relates to an aqueous cutting slurry comprising an aqueous cutting fluid and an abrasive, which has the advantages of dispersion stability of the abrasive, viscosity stability, and higher machining accuracy than the prior art. Background technique [0002] One known method of cutting an ingot of hard and brittle material is to use a wire saw or cut-off wheel. In the cutting method using a wire saw, cutting fluid is usually added during the cutting operation to lubricate the cutting tool and workpiece, remove frictional heat, and clean debris. The cutting fluid includes an oil-based cutting fluid containing mineral oil and additives, a glycol-based cutting fl...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C10M161/00C10M129/16C10M129/08C10M145/24C10M173/02C10N30/04B24B27/06B24B37/00B28D5/00C10M105/14C10M105/18C10M125/26C10M145/16C10M173/00C10N40/22C10N40/32H01L21/304
CPCC10M129/08C10M173/00C10N2040/22
Inventor 谷井一郎林贵幸木村崇志水崎透
Owner NISSHIN CHEM IND CO LTD
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