Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Resin composition for embedded capacitor, and dielectric layer and metal foil-clad plate manufactured by using same

A resin composition and capacitor technology, applied in the direction of fixed capacitor electrodes, fixed capacitor dielectrics, fixed capacitor parts, etc., can solve the problem of brittleness of composite materials, difficult to line etching machines, and can not meet the processing requirements of embedded capacitor materials and other problems, to achieve the effect of excellent processing performance, avoiding brittleness and low water absorption

Inactive Publication Date: 2011-02-16
GUANGDONG SHENGYI SCI TECH
View PDF4 Cites 34 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Chinese patent CN200610007389.8 discloses a resin composition for embedded capacitors. The resin composition disclosed in this patent mainly focuses on solving bond strength, heat resistance and flame retardancy, and does not solve The problem of brittleness of the composite material composed of this resin composition and ceramic material, this resin composition is very brittle because of itself, after compounding with a large amount of ceramic filler, the brittleness is even greater, it is difficult to pass through the printed circuit board ( The circuit etching machine used in the PCB) processing process cannot meet the processing requirements for embedding materials

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Resin composition for embedded capacitor, and dielectric layer and metal foil-clad plate manufactured by using same
  • Resin composition for embedded capacitor, and dielectric layer and metal foil-clad plate manufactured by using same
  • Resin composition for embedded capacitor, and dielectric layer and metal foil-clad plate manufactured by using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-3

[0072] Bisphenol A epoxy resin (epoxy resin A), brominated epoxy resin (epoxy resin B), and carboxyl-terminated nitrile rubber (C), were dissolved in ethylene glycol methyl ether, and added relative to epoxy The biphenyl phenolic resin and 2-MI (2-methylimidazole) in a molar ratio of 0.9 are mixed at room temperature to obtain a glue solution. The obtained glue solution was coated on the copper foil, and then baked in an oven at 155° C. for 5 minutes to be cured to stage B, so as to obtain a resin composite copper foil. Next, take two resin-composite copper foils and laminate them on the glued side, laminate and cure at 190°C, and measure the tensile modulus, elongation, Tg and peel strength after the cured product is obtained. The specific proportioning and performance of embodiment 1, embodiment 2 and embodiment 3 are shown in table 1.

Embodiment 4

[0078]Dissolve bisphenol A epoxy resin (epoxy resin A), brominated epoxy resin (epoxy resin B), and phenoxy resin mixture in ethylene glycol methyl ether, as for the reaction solution, also added as curing agent 0.9 molar ratio of biphenyl phenolic resin and 2-MI, and then mix the resulting glue at room temperature. Then add 40vol% barium titanate as an additive, mix evenly, then pour the obtained glue on the copper foil, and bake it in an oven at 155°C for 4 minutes to semi-cure to the B stage to make a resin composite copper foil. Next, take two RCCs and put them on top of each other with their adhesive surfaces, laminate and cure at 190°C. After the cured product was obtained, the tensile modulus, elongation, Tg, peel strength, Dk / Df and flame retardancy were measured, and the results are shown in Table 2.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a resin composition for an embedded capacitor, and a dielectric layer and a metal foil-clad plate manufactured by using the same. The resin composition for the embedded capacitor comprises the following components in percentage by weight: 5 to 60 percent of epoxy resin, 5 to 45 percent of at least one of phenoxy resin and carboxyl-terminated nitrile butadiene rubber, 2 to 45 percent of biphenyl phenolic resin or naphthalene phenolic resin and 5 to 85 percent of high-dielectric constant fillers. The dielectric layer manufactured by using the resin composition for the embedded capacitor is a resin sheet or resin composite metal foil; the resin sheet comprises a carrier film and the resin composition for the embedded capacitor coated on the carrier film; and the resin composite metal foil comprises metal foil and the resin composition for the embedded capacitor, which is coated on the metal foil.

Description

technical field [0001] The invention relates to a resin composition for embedded capacitors, in particular to a resin composition for embedded capacitors, a dielectric layer and a metal foil-clad plate made by using the resin composition. Background technique [0002] With the development of electronic devices towards high functionality and miniaturization, the proportion of passive devices in electronic systems is increasing. For example, the number of passive components in a mobile phone is 20 times that of active components. At present, passive devices are mainly surface-mounted, occupying a large amount of space on the substrate, and there are many interconnections and soldering points on the surface, which greatly reduces the electrical performance and reliability of materials and systems. In order to provide an electronic system that is lighter, better in performance, cheaper in price, and more reliable in performance, it is the only choice to convert the past surface...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C08L71/10C08L63/10C08L63/04C08L61/06B32B15/098B32B15/092H01G4/14B32B15/08C08L13/00C08L63/00C08L63/02H01G4/005
Inventor 苏民社孙宝磊
Owner GUANGDONG SHENGYI SCI TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com