Resin composition for embedded capacitor, and dielectric layer and metal foil-clad plate manufactured by using same

A resin composition and capacitor technology, applied in the direction of fixed capacitor electrodes, fixed capacitor dielectrics, fixed capacitor parts, etc., can solve the problem of brittleness of composite materials, difficult to line etching machines, and can not meet the processing requirements of embedded capacitor materials and other problems, to achieve the effect of excellent processing performance, avoiding brittleness and low water absorption

Inactive Publication Date: 2011-02-16
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Chinese patent CN200610007389.8 discloses a resin composition for embedded capacitors. The resin composition disclosed in this patent mainly focuses on solving bond strength, heat resistance and flame retardancy, and does not solve The problem of brittleness of the composite material composed of this resin composition and ceramic mat

Method used

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  • Resin composition for embedded capacitor, and dielectric layer and metal foil-clad plate manufactured by using same
  • Resin composition for embedded capacitor, and dielectric layer and metal foil-clad plate manufactured by using same
  • Resin composition for embedded capacitor, and dielectric layer and metal foil-clad plate manufactured by using same

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0071] Example 1-3:

[0072] Dissolve bisphenol A epoxy resin (epoxy resin A), brominated epoxy resin (epoxy resin B), and carboxy-terminated nitrile rubber (C) in ethylene glycol methyl ether, and add to the epoxy Biphenyl-type phenolic resin and 2-MI (2-methylimidazole) are mixed at room temperature to obtain a glue liquid. The obtained glue solution is coated on the copper foil, and then baked in an oven at 155° C. for 5 minutes to be cured into a stage B to obtain a resin composite copper foil. Then, two resin composite copper foils were laminated on their glued surfaces, laminated and cured at 190°C, and the cured product was obtained and the tensile modulus, elongation, Tg and peel strength were measured. The specific proportions and properties of Example 1, Example 2, and Example 3 are shown in Table 1.

Example Embodiment

[0077] Example 4:

[0078] The bisphenol A epoxy resin (epoxy resin A), brominated epoxy resin (epoxy resin B), and phenolic resin mixture are dissolved in ethylene glycol methyl ether. As for the reaction solution, a curing agent is also added Biphenyl phenolic resin and 2-MI in a 0.9 molar ratio, and then mixed the resulting glue solution at room temperature. Then add 40 vol% of the additive barium titanate, mix evenly, then pour the obtained glue on the copper foil, and bake in an oven at 155° C. for 4 minutes to semi-cured into a B-stage to produce a resin composite copper foil. Then, take two RCCs and lay them on their glued surfaces, laminate them at 190°C and cure them. After the cured product was obtained, the tensile modulus, elongation, Tg, peel strength, Dk / Df and flame retardancy were measured. The results are shown in Table 2.

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PUM

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Abstract

The invention relates to a resin composition for an embedded capacitor, and a dielectric layer and a metal foil-clad plate manufactured by using the same. The resin composition for the embedded capacitor comprises the following components in percentage by weight: 5 to 60 percent of epoxy resin, 5 to 45 percent of at least one of phenoxy resin and carboxyl-terminated nitrile butadiene rubber, 2 to 45 percent of biphenyl phenolic resin or naphthalene phenolic resin and 5 to 85 percent of high-dielectric constant fillers. The dielectric layer manufactured by using the resin composition for the embedded capacitor is a resin sheet or resin composite metal foil; the resin sheet comprises a carrier film and the resin composition for the embedded capacitor coated on the carrier film; and the resin composite metal foil comprises metal foil and the resin composition for the embedded capacitor, which is coated on the metal foil.

Description

technical field [0001] The invention relates to a resin composition for embedded capacitors, in particular to a resin composition for embedded capacitors, a dielectric layer and a metal foil-clad plate made by using the resin composition. Background technique [0002] With the development of electronic devices towards high functionality and miniaturization, the proportion of passive devices in electronic systems is increasing. For example, the number of passive components in a mobile phone is 20 times that of active components. At present, passive devices are mainly surface-mounted, occupying a large amount of space on the substrate, and there are many interconnections and soldering points on the surface, which greatly reduces the electrical performance and reliability of materials and systems. In order to provide an electronic system that is lighter, better in performance, cheaper in price, and more reliable in performance, it is the only choice to convert the past surface...

Claims

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Application Information

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IPC IPC(8): C08L71/10C08L63/10C08L63/04C08L61/06B32B15/098B32B15/092H01G4/14B32B15/08C08L13/00C08L63/00C08L63/02H01G4/005
Inventor 苏民社孙宝磊
Owner GUANGDONG SHENGYI SCI TECH
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