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POSS/epoxy nanometer hybrid material and preparation method and application thereof

A hybrid material, epoxy nanotechnology, applied in epoxy resin coatings, epoxy resin glue, plastic/resin/wax insulators and other directions, can solve the problems of difficult solvent purification, poor mechanical properties, difficult reaction degree, etc. The production and preparation process is easy to control, the aging resistance is good, and the transparency is good.

Inactive Publication Date: 2011-03-16
FUDAN UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the simple blending method is prone to phase separation and has poor mechanical properties; the disadvantage of the chemical modification method is that the process is complicated, and solvents are usually used to make purification difficult, and it is difficult to control the degree of reaction

Method used

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  • POSS/epoxy nanometer hybrid material and preparation method and application thereof
  • POSS/epoxy nanometer hybrid material and preparation method and application thereof
  • POSS/epoxy nanometer hybrid material and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] POSS / epoxy nano-hybrid material formula 1

[0052] Composition Amount (mass parts)

[0053] Hydrogenated bisphenol A epoxy resin 100

[0054] Diisobutyl-hexaepoxy POSS 10

[0055] Epoxysilane 10

[0056] Methylhexahydrophthalic anhydride 10

[0057] UV absorber 3

[0058] 1-cyanoethyl-2-ethyl-4-methylimidazole 2

[0059] In the reactor, add 50 parts of hydrogenated bisphenol A epoxy resin, 10 parts of diisobutyl-hexaepoxy POSS, stir for 5 hours, add 10 parts of epoxy silane, and continue stirring for 0.5 hours to obtain component A ,stand-by.

[0060] In the reactor, add 50 parts of hydrogenated bisphenol A epoxy resin, 10 parts of methyl hexahydrophthalic anhydride, stir for 2 hours, add component A, continue stirring for 1 hour, then add 3 parts of UV absorber, 2 parts of 1- Cyanoethyl-2-ethyl-4-methylimidazole curing accelerator, stirred for 1 hour to obtain POSS / epoxy nano-hybrid material.

[0061] The POSS / epoxy nano-hybrid material was heated at 100° C. fo...

Embodiment 2

[0063] POSS / epoxy nano-hybrid material formula 2

[0064] Composition Amount (mass parts)

[0065] Hydrogenated bisphenol A epoxy resin 100

[0066] Trihexyl-Pentaepoxide POSS 50

[0067] Tetraphenyl-tetraepoxy POSS 50

[0068] Epoxysilane 20

[0069] Tin octoate 2

[0070] In the reactor, add 50 parts of hydrogenated bisphenol A epoxy resin, 50 parts of trihexyl-pentaepoxy POSS, 50 parts of tetraphenyl-tetraepoxy POSS, stir for 6 hours, add 20 parts of epoxy silane , and continue to stir for 1 hour to obtain component A for use.

[0071] In the reactor, add 50 parts of hydrogenated bisphenol A epoxy resin and 2 parts of tin octoate, stir for 2 hours, add component A, and continue stirring for 5 hours to obtain POSS / epoxy nano-hybrid material.

[0072] The POSS / epoxy nano-hybrid material was heated at 150° C. for 2 hours, and cured in situ to obtain the POSS / epoxy nano-hybrid material.

Embodiment 3

[0074] POSS / epoxy nano-hybrid material formulation 3

[0075] Composition Amount (mass parts)

[0076] Cycloaliphatic epoxy resin 50

[0077] Hydrogenated bisphenol A epoxy resin 50

[0078] Octaepoxy POSS 100

[0079] Zirconium acetylacetonate 0.01

[0080] In the reactor, add 50 parts of cycloaliphatic epoxy resin and 100 parts of hydroxyl silicone oil, and stir for 8 hours to obtain component A, which is ready for use.

[0081] In the reactor, add 50 parts of hydrogenated bisphenol A epoxy resin and 0.01 part of zirconium acetylacetonate, and stir for 10 hours to obtain component B.

[0082] Mix the above-mentioned components A and B evenly, heat at 80° C. for 10 hours, and cure in situ to obtain a POSS / epoxy nano-hybrid material.

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Abstract

The invention belongs to the technical field of chemical industry and photoelectricity, and in particular relates to a high-heat-resistant POSS / epoxy nanometer hybrid material and a preparation method and application thereof. The high-heat-resistant POSS / epoxy nanometer hybrid material comprises (a) at least one epoxy resin, (b) at least one polyhedral oligomeric silsesquioxane (POSS), (c) at least one acidic curing agent, (d) unnecessary organosilane, and (e) an unnecessary auxiliary agent. The POSS / epoxy nanometer hybrid material prepared by the method does not have a phase separation phenomenon, has the characteristics of the epoxy resin such as high caking property, mechanical strength, shearing strength and processability, and has the characteristics of the POSS such as high heat resistance, insulating property, elasticity, ageing resistance and transparency; the production and preparation process is simple, and easy to control; a solvent is not used in the production process; and the method is an environmental-friendly and energy-saving method for synthesizing the POSS / epoxy nanometer hybrid material. The POSS / epoxy nanometer hybrid material is used for an adhesive, an LED packaging material, a photoelectric conversion material, an insulating material, a coating material, a circuit protection material, an optical protection material and the like.

Description

technical field [0001] The invention belongs to the field of chemical industry and optoelectronic technology, and specifically relates to a POSS / epoxy nano-hybrid material with excellent heat resistance, aging resistance, transparency, insulation and light resistance, and a preparation method and application thereof. More specifically, the present invention relates to a POSS / epoxy nano hybrid material, which comprises epoxy resin, polyhedral oligomeric silsesquioxane (POSS), acid curing agent, optional organosilane, and optional auxiliary agent . The invention also relates to the preparation method and application of the POSS / epoxy nanometer hybrid material. The composition of the present invention can be used as a raw material in adhesives, LED packaging materials, photoelectric conversion materials, insulating materials, coating materials, circuit protection materials, optical protection materials and other fields. Background technique [0002] Polyhedral oligomeric sils...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L63/02C08K5/549C08K5/5435C08G59/42C09J163/00C09J163/02C09D163/00C09D163/02H01B3/40H01L23/29
Inventor 游波唐勇潘倩
Owner FUDAN UNIV
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