Method for making integrated silicon on insulator (SOI) laterally diffused metal oxide semiconductor (LDMOS) device with double vertical channels
A vertical and device technology, applied in the field of integrated dual vertical channel SOI LDMOS devices, can solve problems such as unfavorable improvement of device and system reliability, energy saving and environmental protection, low device work efficiency, easy to heat and other problems, and achieve excellent Effects of electrical and thermal properties
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[0031] The method for realizing the SOI CMOS VLSI process of integrating dual vertical channel SOI LDMOS devices specifically includes the following steps:
[0032] 1. Select a polished SOI wafer as the initial material. The SOI wafer is completely isolated into two semiconductor regions by a buried insulating layer, and the thickest one of the two semiconductor regions is P-type. As a substrate, the thin one is N-type as the top silicon film for making devices and circuits;
[0033] 2. Oxidize the surface of the top layer of silicon film for the first time, the thickness of the oxide layer is 50-100nm, deposit silicon nitride on the surface of the oxide layer, the thickness of the silicon nitride layer is 300-500nm, and the oxide layer completely covers the top layer of silicon On the upper surface of the film, the silicon nitride completely covers the upper surface of the oxide layer; the first photolithography is carried out by using the second shallow trench gate area and...
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