Method of cleaning and micro-etching semiconductor wafers

A semiconductor and wafer technology, applied in semiconductor devices, chemical instruments and methods, semiconductor/solid-state device manufacturing, etc., can solve problems such as inability to remove metals and reduce the efficiency of solar cells

Inactive Publication Date: 2011-08-17
SUN CHEM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Some alkaline cleaners have been found to remove organic materials well but not metals
Therefore, there is a need in the semiconductor industry for an improved method of removing contaminants from semiconductor wa

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0075] A single crystal silicon ingot is bonded to a contact plate and an attachment jig. This loads on a traditional jigsaw tool. The wire saw is coated with abrasive silicon carbide particles. A slurry comprising polyethylene glycol and silicon carbide particles of #600 to #1000 size in a weight ratio of 1:1 was sprayed onto the ingot from the slurry nozzle of the tool during cutting. Contaminants of copper, zinc and iron prior to cleaning were above 1 mg. The monocrystalline silicon wafer cut from the ingot was then treated with 0.5 wt% tetramethylammonium hydroxide, 0.4 wt% potassium hydroxide, 0.25 wt% tripropylene glycol, 0.1 wt% iminodiacetic acid Aqueous alkaline composition consisting of a mixture of sodium salt and 0.05% by weight of a medium nonionic surfactant of general formula II for cleaning and microetching for 10 minutes, wherein x is 4 to 5, y is 3 to 6, R 1 is C 8-9 branched alcohol and R 2 is CH 3 . The balance is water. The pH of the composition is...

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PUM

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Abstract

A method of simultaneously cleaning inorganic and organic contaminants from semiconductor wafers and micro-etching the semiconductor wafers. After being cut or sliced from ingots, semiconductor wafers are contaminated with cutting fluid as well as metal and metal oxides from the saws used in the cutting process. Aqueous alkaline cleaning and micro-etching solutions containing alkaline compounds and mid-range alkoxylates are used to simultaneously clean and micro-etch the semiconductor wafers. The method provided includes the steps of a) providing semiconductor ingots; b) cutting the semiconductor ingots to form one piece or pieces of semiconductor wafers containing inorganic and organic contaminants; and c) applying an aqueous alkaline solution comprising one or more quaternary ammonium hydroxides, one or more alkali hydroxides and one or more mid-range alkoxylates in sufficient amounts to remove the contaminants and micro-etch the semiconductor wafers.

Description

technical field [0001] The invention relates to a method for simultaneously cleaning a semiconductor wafer from inorganic and organic contaminants and microetching the semiconductor wafer. More specifically, the present invention relates to a method of simultaneously cleaning a semiconductor wafer from inorganic and organic contaminants and microetching the semiconductor wafer using an alkaline aqueous solution comprising an alkaline compound and a mid-range alkoxylate. Background technique [0002] Traditionally, semiconductor wafers can be manufactured through the following steps: [0003] (1) cutting a semiconductor ingot by an inner diameter saw to obtain wafers; [0004] (2) washing the wafer with water to remove contaminants; and [0005] (3) The wafer is then cleaned to remove contaminants including heavy metals and particles and then dried. [0006] Such wafers are typically used in the manufacture of photovoltaic devices such as solar cells. A solar cell is a de...

Claims

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Application Information

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IPC IPC(8): H01L21/02B28D5/00C11D7/26C11D7/32C11D7/06
CPCH01L31/18H01L21/0201H01L21/30604H01L21/02052
Inventor R·K·巴尔R·钱
Owner SUN CHEM CORP
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