Carbon nano tube reinforcing epoxy structural adhesive and method for preparing same
A technology of epoxy structural adhesive and carbon nanotubes, applied in the direction of epoxy resin adhesive, adhesive, adhesive type, etc. The effect of improving performance, improving mechanical properties and high impact toughness
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Embodiment 1
[0027] Accurately weigh the following raw materials, bisphenol A epoxy resin 50g, bisphenol F epoxy resin 10g, carbon nanotube reinforced epoxy resin 10g, fumed silicon 18g, triphenylphosphine oxide 2g, 1,4- Butanediol diglycidyl ether 10g, the above-mentioned components are added in the double planetary power mixer in turn, vacuumed to -0.1MPa, under the condition that the rotation speed is 1000 rpm and the revolution speed is 8 rpm, Stir mechanically for 2 hours to obtain component A, mix evenly to obtain component A of the epoxy resin adhesive, pack and place it for use; mix curing agents such as N-aminoethylpiperazine 3g, isophoronediamine 39g, polyether Mix 37g of amine, 13g of bis(4-amino-3-methylcyclohexyl)methane, and 8g of thixotropic agent such as fumed silicon to obtain component B of the epoxy resin adhesive, which is packaged and placed for use.
[0028] When in use, mix the prepared component A and component B uniformly at a weight ratio of 100:45, cure at 60°C f...
Embodiment 2
[0030] Accurately weigh the following raw materials, bisphenol A epoxy resin 50g, bisphenol F epoxy resin 10g, carbon nanotube reinforced epoxy resin 2g, fumed silicon 23g, resorcinol 10.5g, 1,6- Add 9.5g of hexanediol diglycidyl ether, add the above-mentioned components into the double planetary power mixing mixer in turn, vacuumize to -0.1MPa, under the conditions of rotation speed of 1000 rpm and revolution speed of 10 rpm , mechanically stirred for 2 hours to obtain component A, mixed evenly to obtain component A of the epoxy resin adhesive, packaged and placed for use; curing agents such as isophorone diamine 42g, polyetheramine 32g, bis(4-amino Mix 7g of cyclohexyl)methane, 9g of diaminodiphenylmethane, and thixotropic agent such as fumed silicon 10g to obtain component B of the epoxy resin adhesive, which is packaged and placed for use.
[0031] When in use, mix the prepared component A and component B uniformly at a weight ratio of 100:49.5, cure at 68°C for 6 hours, a...
Embodiment 3
[0033]Accurately weigh the following raw materials: 60g of bisphenol A epoxy resin, 5g of bisphenol F epoxy resin, 6g of carbon nanotube reinforced epoxy resin, 19g of fumed silicon, 1g of polyacrylamide, butyl glycidyl ether ( BGE) 9g, add the above components into the double planetary power mixing mixer in turn, vacuumize to -0.09MPa, and mechanically stir for 2 hours under the conditions of rotation speed of 800 rpm and revolution speed of 15 rpm to obtain Component A, mixed evenly to obtain component A of the epoxy resin adhesive, packed and placed for use; curing agents such as triethylenetetramine 3g, isophoronediamine 37g, polyetheramine 37g, m-xylylenediamine 3g, 10g of bis(4-amino-3-methylcyclohexyl)methane, and 10g of a thixotropic agent such as fumed silicon are mixed evenly to obtain component B of the epoxy resin adhesive, which is packaged and placed for use.
[0034] When in use, mix the prepared component A and component B uniformly at a weight ratio of 100:40....
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