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Polyimide and preparation method thereof

A technology of polyimide and aromatic diamine, which is applied in the field of preparation of high-performance polymer polyimide, can solve the problem of low dielectric coefficient, poor electrical performance and manufacturing process cost of polyimide containing alicyclic structure Requires high-level problems to achieve the effect of high temperature resistant polyimide film, good solubility, and reduced process steps

Inactive Publication Date: 2011-11-23
DONGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] The polyimide containing alicyclic and trifluoromethyl groups of the present invention not only solves the defects of solubility and optical transparency of films made of traditional polyimide, but also improves the manufacturing process of fluorine-containing polyimide High cost requirements and poor electrical properties of polyimides containing alicyclic structures, etc., and the advantages of two types of modified polyimides are combined to achieve the convenience of industrial production with high light transparency, high solubility, and low dielectric coefficient. , high temperature resistant polyimide film target

Method used

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  • Polyimide and preparation method thereof
  • Polyimide and preparation method thereof
  • Polyimide and preparation method thereof

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Experimental program
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Effect test

Embodiment 1

[0040] Under the protection of nitrogen, a monomer containing cyclohexane structure and trifluoromethyl substituted aromatic diamine has the following structure:

[0041]

[0042] It is dissolved in N-methylpyrrolidone with benzophenone tetraacid dianhydride in an equimolar ratio to obtain a solution with a total solid mass percentage of 5%, adding isoquinoline (consumption is 2% of the moles of diamine monomer times) as a catalyst, nitrogen flow was introduced to take away the moisture generated during the reaction, after condensation reaction at 110°C for 2 hours, imidization was continued at 205°C for 15 hours, then, the reaction product was poured into ethanol, and the precipitate was collected , dry to obtain floc polyimide solid; the molecular structural formula of described polyimide is:

[0043]

[0044] Among them, Ar is n is 40;

Embodiment 2

[0046] Under the protection of nitrogen, a monomer containing cyclohexane structure and trifluoromethyl substituted aromatic diamine has the following structure:

[0047]

[0048] It is dissolved in N,N-dimethylformamide with biphenyltetralic dianhydride in an equimolar ratio to obtain a solution with a total solid mass percentage of 10%, adding isoquinoline (consumption is diamine monomer moles 4 times of that) as a catalyst, nitrogen flow was introduced to take away the moisture generated during the reaction, after condensation reaction at 90°C for 4 hours, imidization was continued at 190°C for 20 hours, then, the reaction product was poured into ethanol, collected and precipitated Throw out, dry, obtain floc polyimide solid; The molecular structural formula of described polyimide is:

[0049]

[0050] Among them, Ar is n is 30;

Embodiment 3

[0052] Under the protection of nitrogen, a monomer containing cyclohexane structure and trifluoromethyl substituted aromatic diamine has the following structure:

[0053]

[0054] It is dissolved in N,N-dimethylacetamide with diphenyl ether tetra-acid dianhydride in an equimolar ratio to obtain a solution with a total solid mass percentage of 15%, adding isoquinoline (consumption is diamine monomer mole 3 times the number) as a catalyst, nitrogen flow was introduced to take away the moisture generated during the reaction, after condensation reaction at 95°C for 3 hours, imidization was continued at 200°C for 10 hours, and then the reaction product was poured into methanol and collected The precipitate is separated out and dried to obtain the flocculent polyimide solid; the molecular structural formula of the polyimide is:

[0055]

[0056] Among them, Ar is n is 50;

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Abstract

The invention relates to polyimide prepared from a trifluoromethyl-substituted aromatic diamine monomer containing a cyclohexane structure and a preparation method thereof. The molecular structural formula of polyimide is shown as the specification. The preparation method comprises the following steps: dissolving a trifluoromethyl-substituted aromatic diamine monomer containing the cyclohexane structure and an aromatic dianhydride monomer in an organic solvent in a molar ratio of 1:1 under the protection of nitrogen, adding isoquinoline to be used as the catalyst, performing a condensation reaction at 90-120 DEG C for 2-6 hours, performing an imidization reaction at 190-210 DEG C for 10-24 hours, performing a one-step polymerization reaction, pouring the reaction product in methanol or ethanol, collecting the separated precipitate, and drying to obtain fibrous polyimide. The method modifies the one-step preparation method of polyimide; and the prepared polyimide can be used to solve the defects of the traditional polyimide film on dissolubility, optical transparency and the like, and correct the problems such as high cost required by the manufacturing process and poor electric properties.

Description

technical field [0001] The invention belongs to the preparation of high-performance polymer polyimide, in particular to the preparation of a polyimide structure polymer and a preparation method thereof by a monomer containing a cyclohexane structure and a trifluoromethyl-substituted aromatic diamine. Background technique [0002] Polyimide is a heat-resistant polymer material with excellent comprehensive properties. Since the industrialization began in the 1960s and 1970s, they have been applied in various fields. Especially as a high-performance fiber, a high heat-resistant composite material matrix and an electronic packaging material, it has been widely used in aerospace, machinery, microelectronics, petrochemical and other industries. Although such high temperature resistant materials have excellent comprehensive properties, most polyimides have high Melting temperature, insoluble in organic solvents (mostly only soluble in concentrated sulfuric acid), brings great dif...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10
Inventor 李光莫鑫杨胜林金俊弘江建明
Owner DONGHUA UNIV
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