Preparation method of novel tungsten-copper-zinc alloy material

A technology of zinc alloy and tungsten copper, which is applied in the field of metallurgy, can solve the problems of low strength and hardness, and achieve the effects of low thermal expansion coefficient, high thermal conductivity and high electrical conductivity
CN102492884AInactive Publication Date: 2012-06-13BEIJING INSTITUTE OF TECHNOLOGYGY
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
BEIJING INSTITUTE OF TECHNOLOGYGY
Publication Date
2012-06-13
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a preparation method of a tungsten-copper-zinc alloy material. The preparation method comprises the specific processes of: burdening and mixing micro-scale pure tungsten powder, tungsten powder coated by pure copper on the surface as well as micro-scale copper powder and zinc powder, and carrying out cold isostatic extrusion, spark plasma sintering (SPS) and other methods to prepare the tungsten-copper-zinc alloy material with relative density more than 95%. The preparation method has the advantages that: by virtue of the preparation method, the tungsten-copper-zinc composite material with the relative density more than 95%, high hardness and higher strength can be prepared; brass has higher strength and hardness than pure copper; and through combing high strength and high density of tungsten as well as high conductivity, high thermal conductivity, higher strength and hardness and other performances of brass, the high-temperature-resistant and corrosion-resistant tungsten-copper-zinc alloy material suitable for electric spark machining, electronic packaging and aerospace materials are prepared.
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Description

technical field

[0001] The invention relates to a preparation process of a high-melting point metal and a metal composite material, belonging to the technical field of metallurgy, in particular to a preparation method of a novel tungsten-copper-zinc alloy material. Background technique

[0002] The tungsten-based composite material involved in the present invention is a tungsten-copper-zinc alloy material. Tungsten-copper composite materials have both the high density and low thermal expansion coefficient of tungsten and the high electrical and thermal conductivity of copper. Its thermal conductivity, electrical conductivity and thermal expansion coefficient can be designed by adjusting the content of tungsten-copper components, so it is widely used in microwave devices, Integrated circuit packaging materials, electrical contact materials, and armor-breaking materials in the military industry.

[0003] The technical process for preparing tungsten-copper composite materials ...

Claims

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