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Surface treatment process for reducing roughness of electrolytic copper foil

An electrolytic copper foil and surface treatment technology, applied in metal material coating process, printed circuit components, etc., can solve the problems of increased glue thickness, insufficient surface roughness, and reduced MIT performance, so as to reduce the surface roughness. , Excellent resistance to normal temperature, good corrosion resistance and etching effect

Active Publication Date: 2012-07-18
SHANDONG JINBAO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

LP copper foil for FPC, the tensile strength and elongation can generally be made relatively high, but the surface roughness is not low enough, which increases the thickness of the glue in FPC products, resulting in a sharp decline in MIT performance.

Method used

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  • Surface treatment process for reducing roughness of electrolytic copper foil
  • Surface treatment process for reducing roughness of electrolytic copper foil
  • Surface treatment process for reducing roughness of electrolytic copper foil

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] A surface treatment process for reducing the roughness of electrolytic copper foil in this embodiment, the process flow is:

[0034] LP wool foil—pickling—microetching—nickel plating—zinc alloy—passivation—silane coupling agent—drying—VLP copper foil.

[0035] Using LP wool foil, the surface is first pickled to remove the oxide layer; then a micro-etching solution composed of hydrochloric acid-copper sulfate is sprayed on the rough surface of the copper foil, and the "peaks" are reacted into tiny nodular particles; A layer of nickel-zinc alloy, a layer of chromium-zinc alloy; finally, a layer of silane coupling agent is applied and then dried.

[0036] The specific process steps are as follows:

[0037] 1) Pickling: Dilute industrial pure concentrated sulfuric acid to dilute sulfuric acid with a concentration of 10% by volume, pump it into the pickling tank, put the copper foil into the pickling solution and soak for 3S;

[0038] The purpose of pickling is to remove t...

Embodiment 2

[0050] A surface treatment process for reducing the roughness of electrolytic copper foil, the specific treatment conditions are as follows:

[0051] 1) Pickling: Dilute industrial pure concentrated sulfuric acid to dilute sulfuric acid with a concentration of 12% by volume, pump it into the pickling tank, put the copper foil into the pickling solution and soak for 1S;

[0052] 2) Micro-etching: Dissolve copper sulfate pentahydrate in hot water (40°C), add industrially pure concentrated hydrochloric acid, mix well and etch the rough surface (crystal growth surface) sprayed on the copper foil; the specific process conditions are : CuSO 4 240 g / L, HCl 30g / L, temperature 40°C, time 25s;

[0053] 3) Nickel-zinc alloy plating: Dissolve nickel sulfate and zinc sulfate in water respectively and mix them, add industrially pure concentrated sulfuric acid, mix well and pump them into the nickel-zinc alloy plating tank for electroplating; the specific process conditions are: Zn 2+ 1....

Embodiment 3

[0058] A surface treatment process for reducing the roughness of electrolytic copper foil, the specific treatment conditions are as follows:

[0059] (1) Pickling: 15% sulfuric acid, time 1S;

[0060] (2) Microetching: CuSO 4 200 g / L, HCl 70g / L, temperature 35°C, time 40s;

[0061] (3) Nickel-zinc alloy: Zn 2+ 2.0 g / L, Ni 2+ 7 g / L, H 2 SO 4 150g / L, temperature 45℃, current density 6.7A / dm 2 , time 1S.

[0062] (4) Passivation: Cr 6+ 5g / L, Zn 2+ 0.2 g / L, K 4 P 2 o 7 80 g / L, 10.5, temperature is 32°C, current density is 6.8 A / dm 2 ; Processing time 3s.

[0063] (5) Silane coupling agent: KH560 5g / L, temperature 35°C, treatment time 1.5s.

[0064] (6) Drying: the temperature is 240°C, and the processing time is 5s.

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Abstract

The invention relates to a surface treatment process for reducing roughness of an electrolytic copper foil, belonging to the technical field of electrolytic copper foil production processes. The surface treatment process comprises the following steps of: carrying out treatment steps of acid washing, micro etching, nickel-zinc alloy plating, passivating, coupling, drying and the like on the electrolytic copper foil with surface roughness (Rz) of 3-5 microns to form a VLP (Very Low Profile) copper foil, wherein the surface roughness (Rz) is reduced to 0.5-1.5 micron. The surface treatment process disclosed by the invention has the advantages that: the treated copper foil surface is reddish-brown and has excellent corrosion resistance, etching property and excellent normal-temperature and high-temperature oxidation resistance so as to be suitable for flexible copper-clad plates.

Description

[0001] technical field [0002] The invention relates to a surface treatment process for reducing the roughness of electrolytic copper foil, and belongs to the technical field of high-precision electrolytic copper foil production technology. Background technique [0003] At present, electrolytic copper foil is one of the main raw materials for PCB production. Its production process includes calendering method and electrolytic method. Calendered copper foil has great advantages in elongation and bending resistance. Manufacturers of printed circuit boards (FPC) use only rolled copper foil. In recent years, with the improvement of electrolytic copper foil production technology, some Japanese copper foil manufacturers have developed a variety of high-quality electrolytic copper foils that can meet the requirements of FPC. Due to the improvement of electrolytic copper foil manufacturing technology and price advantages, electrolytic copper foil is more and more used in FPC. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D7/06C23G1/10C23F1/18C25D3/56C23C22/33H05K1/02
Inventor 杨祥魁徐树民刘建广马学武宋召霞徐策王涛
Owner SHANDONG JINBAO ELECTRONICS
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