Rubber conductive particle and preparation method thereof
A technology of conductive particles and rubber, which is applied in the field of electrical conductors, can solve problems such as high cost, high failure rate, and complex structure, and achieve the effects of less pollutants, firm combination, and wide application
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Example Embodiment
[0030] Example one:
[0031] The polyurethane rubber substrate 3 sheet is prepared by molding, and the upper surface 2 of the rubber substrate is cleaned with argon plasma in the coating machine. Then, the rubber substrate of this sheet is coated by vacuum sputtering. A layer of 316 stainless steel metal coating with a thickness of 5 μm is sputtered on the top surface 2 of the material. The polyurethane sheet deposited with one layer of stainless steel metal coating film is punched out into small cylindrical particles with a diameter of 3 mm. The small conductive particles on the surface are used as the conductive contact elements of the circuit board of the substrate, and the lower surface 4 of the rubber base material is compounded with the silicon rubber printed with numbers to prepare the buttons on the mobile phone. The preparation cost of such conductive particles is low.
Example Embodiment
[0032] Embodiment two:
[0033] The butyl rubber substrate 3 sheet is prepared by extrusion molding. The butyl rubber substrate 3 contains pigments, fillers, anti-aging agents, toughening agents, plasticizers, antistatic agents, crosslinking agents or couples. Coupling agent; clean the upper surface 2 of the rubber substrate of butyl rubber with corona treatment, and then first coat a copper film with a thickness of 10μm on the upper surface 2 of this rubber substrate by means of vacuum evaporation coating, and then A gold film with a thickness of 1μm is plated by vacuum ion plating process. The rubber substrate 3 sheet with the two-layer metal coating film 1 is cut into small polygonal particles with a diameter of 6 mm. The small conductive particles on the surface are used as the conductive contact element of the circuit board of the substrate, and the lower surface 4 of the rubber base material is compounded with the silicon rubber printed with numbers to prepare the buttons ...
Example Embodiment
[0034] Embodiment three:
[0035] The silicone rubber substrate 3 sheet is prepared by calendering. The silicone rubber substrate 3 contains pigments, fillers, anti-aging agents, toughening agents, plasticizers, antistatic agents, crosslinking agents or coupling agents; The upper surface 2 of the rubber substrate has a long geometric pattern. The upper surface 2 of the silicone rubber substrate is treated by spraying coupling agent, and then, the upper surface of the rubber substrate of this sheet is sprayed by metal thermal spraying. A layer of aluminum film with a thickness of 0.05mm is plated on it, and then a nickel film with a thickness of 0.01mm is plated by an electroless plating process. The rubber substrate 3 with two layers of metal coating 1 is laser-cut to produce small elliptical particles with a diameter of 10 mm. The small conductive particles on the surface are used as the conductive contact element of the circuit board of the substrate, and the lower surface 4 o...
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