Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Preparation method of LED (light emitting diode) chip compounding-special conducting adhesive

A technology of LED chips and conductive adhesives, applied in the direction of conductive adhesives, adhesives, adhesive additives, etc., can solve the problems of poor conductivity and stability, lack of chemical modification technology, and large resource consumption, and achieve stability and Improved electrical conductivity, simple process, and high bonding strength

Inactive Publication Date: 2018-05-25
CHENDU NEW KELI CHEM SCI CO LTD
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] In view of the poor conductivity and stability of the currently widely used conductive adhesive for LED chips, there are also disadvantages such as high production costs, harsh process conditions, and large resource consumption, and there is currently a lack of effective chemical modification technology. The invention proposes a method for preparing conductive adhesive specially used for compounding LED chips, thereby effectively improving the performance of the conductive adhesive, simplifying the preparation process, and reducing production costs

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Preparation method of LED (light emitting diode) chip compounding-special conducting adhesive
  • Preparation method of LED (light emitting diode) chip compounding-special conducting adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] The weight parts of the raw material components of the composite conductive adhesive are:

[0041] 88 parts of thiophene, 5 parts of epoxy acrylic resin, 0.5 parts of silane coupling agent, 8 parts of trimethyl hydroxyethyl ammonium chloride, 0.5 parts of catalyst, 3 parts of copper sulfate pentahydrate; Ethoxysilane; the catalyst is nickel chloride;

[0042] The preparation process of composite conductive adhesive is as follows:

[0043](1) Dissolve thiophene in petroleum ether, use petroleum ether as eluent, pass through a silica gel chromatography column, and then rotary evaporate to remove petroleum ether, add the obtained purified thiophene to an aqueous solution of ethanol, and add a silane coupling agent, slowly Ultrasonic dispersion is carried out while stirring; in the aqueous ethanol solution, the mass concentration of ethanol is 50%; the addition amount of the aqueous ethanol solution is 3 times the mass of thiophene; the ultrasonic dispersion adopts an ultr...

Embodiment 2

[0048] The weight parts of the raw material components of the composite conductive adhesive are:

[0049] 85 parts of thiophene, 10 parts of epoxy acrylic resin, 1 part of silane coupling agent, 9 parts of trimethyl hydroxyethyl ammonium chloride, 1 part of catalyst, 4 parts of copper sulfate pentahydrate; the silane coupling agent is vinyl trimethoxy base silane; catalyst is zinc chloride;

[0050] The preparation process of composite conductive adhesive is as follows:

[0051] (1) Dissolve thiophene in petroleum ether, use petroleum ether as eluent, pass through a silica gel chromatography column, and then rotary evaporate to remove petroleum ether, add the obtained purified thiophene to an aqueous solution of ethanol, and add a silane coupling agent, slowly Ultrasonic dispersion is carried out while stirring; in the ethanol aqueous solution, the mass concentration of ethanol is 40%; the addition amount of the ethanol aqueous solution is 4 times the mass of thiophene; ultra...

Embodiment 3

[0056] The weight parts of the raw material components of the composite conductive adhesive are:

[0057] 88 parts of thiophene, 8 parts of epoxy acrylic resin, 0.8 parts of silane coupling agent, 8 parts of trimethyl hydroxyethyl ammonium chloride, 0.6 parts of catalyst, 2.6 parts of copper sulfate pentahydrate; the silane coupling agent is vinyl tri( Methoxyethoxy) silane; the catalyst is zinc powder;

[0058] The preparation process of composite conductive adhesive is as follows:

[0059] (1) Dissolve thiophene in petroleum ether, use petroleum ether as eluent, pass through a silica gel chromatography column, and then rotary evaporate to remove petroleum ether, add the obtained purified thiophene to an aqueous solution of ethanol, and add a silane coupling agent, slowly Ultrasonic dispersion is carried out while stirring; in the ethanol aqueous solution, the mass concentration of ethanol is 70%; the addition amount of the ethanol aqueous solution is twice the mass of thiop...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a preparation method of an LED chip compounding-special conducting adhesive. The method comprises performing petroleum ether elution and silica gel chromatography on thiophene,adding in silane coupling agent for ultrasonic dispersion, adding and magnetically stirring in trimethyl-ethoxyl-ammonium chloride and catalysts, and performing washing and chromatography after reaction is completed to obtain ammonium salt-grafted polythiophene; adding the ammonium salt-grafted polythiophene into water for chelation reaction with cupric sulfate pentahydrate crystal, and performingfiltering, washing and drying processes to obtain the LED chip compounding-special conducting adhesive. According to the preparation method of the LED chip compounding-special conducting adhesive, bypolymerizing, grafting and modifying the thiophene, surface-grafting ammonium salt and chelating cupric ions through ammonium, the LED chip compounding-special conducting adhesive can greatly improvestability and conductivity and meanwhile achieve high bonding strength and short curing time; the preparation method of the LED chip compounding-special conducting adhesive is simple in process, widein raw material source, low in production cost and easy to industrialize.

Description

technical field [0001] The invention relates to the field of LED materials, in particular to the preparation of conductive adhesive through modification of polythiophene, in particular to a preparation method of conductive adhesive specially used for compounding LED chips. Background technique [0002] Conductive adhesive is an adhesive that can effectively bond various materials and has conductive properties. With the rapid development of electronic components in the direction of miniaturization, miniaturization and integration, it is necessary to continuously develop new connecting materials, which promotes the rapid development of conductive adhesives. In addition to satisfying the electrical conductivity and bonding performance, the conductive adhesive also has many advantages: good environmental friendliness; mild process conditions, can be cured at low temperature or room temperature, avoiding material deformation and component damage caused by high temperature during ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C09J165/00C09J11/08C08G61/12C09J9/02
CPCC08G61/126C08L2203/206C09J9/02C09J11/08C09J165/00C08L63/10
Inventor 陈庆司文彬
Owner CHENDU NEW KELI CHEM SCI CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com