Preparation method of bonded gold-silver alloy wire

A silver alloy and alloy technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems affecting the quality of bonding, gold wire collapse, interface corrosion, etc., and achieve good oxidation resistance and process design Reasonable, chemically stable effect

A silver alloy and alloy technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems affecting the quality of bonding, gold wire collapse, interface corrosion, etc., and achieve good oxidation resistance and process design Reasonable, chemically stable effect

CN102776405AActive Publication Date: 2012-11-14烟台招金励福贵金属股份有限公司
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  • Preparation method of bonded gold-silver alloy wire

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0059] The bonded gold-silver alloy wire in this embodiment is composed of metal materials with the following weight ratio: silver (Ag) 30wt%, palladium (Pd) 500ppm, calcium (Ca) 40ppm, cerium (Ce) 20ppm, beryllium (Be) 8ppm, The remaining content is Au.

[0060] Its preparation method comprises the following steps:

[0061] 1), material preparation: Weigh various raw materials according to the required weight

[0062] Take by weighing 3.50-3.505kg of gold with a purity of 99.999wt%, 1.495-1.50kg of silver with a purity of 99.99wt%, 250g of palladium flakes with a purity of 99.97wt%, 50g of commercially available calcium particles, 25g of commercially available cerium, and 25g of commercially available cerium. Beryllium sheet 12.5g.

[0063] 2) Alloy ingot melting

[0064] Equipment used: high vacuum melting furnace

[0065] The gold and silver are placed in a crucible in the furnace, and the silver is wrapped in gold leaf. Cover the furnace cover and vacuumize, when the ...

Embodiment 2

[0082] The difference between this embodiment and embodiment 1 is:

[0083] Materials: silver (Ag) 20wt%, palladium (Pd) 500ppm, calcium (Ca) 40ppm, cerium (Ce) 20ppm, beryllium (Be) 8ppm, and the rest is Au.

[0084] Subsequent processes are the same as in Example 1, and the model name of the bonded gold-silver alloy wire in this example is KA8.

[0085] In the above formula, the combined effect of cerium (Ce), calcium (Ca) and beryllium (Be) is to improve the mechanical strength of the alloy in the form of solid solution strengthening. In addition: cerium (Ce) improves the fatigue resistance of the material; calcium (Ca) improves the ductility and weldability of the material; beryllium (Be) increases the radian, which is for the special requirements of LED welding wire.

[0086] The physical properties of the final bonded gold-silver alloy wire product produced according to the above process steps and formula are shown in Table 1, and the mechanical properties are shown in ...

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Abstract

The invention relates to a preparation method of a bonded gold-silver alloy wire, and belongs to the technical field of bonded wire processing processes. The bonded gold-silver alloy wire comprises the following metal materials by weight: 20-30% of silver, 5-1000 ppm of palladium, 5-1000 ppm of calcium, 5-1000 ppm of beryllium, 5-1000 ppm of cerium and the balance of gold; the preparation method comprises the following steps: 1), preparing materials; 2) smelting an alloy ingot; 3) pulling and casting an alloy rod; 4) wire-drawing; 5) annealing; 6) coiling; and 7) packaging. The preparation method of the bonded gold-silver alloy wire, provided by the invention, has the advantages of reasonable and standard technical design, and simple operation, the produced bonded gold-silver alloy wire has the advantages of strong conductivity, stable chemical performance, good oxidation resistance, flowability and plasticity, higher breaking force and better elongation, and moderate cost, and requirements of semiconductor package industry and LED (Light Emitting Diode) illumination technology on the performances of the bonded gold-silver alloy wire can be completely satisfied.

Description

technical field [0001] The invention relates to a method for preparing bonding gold-silver alloy wire, and belongs to the technical field of bonding wire processing technology. Background technique [0002] Bonding wire is a fine metal wire inner lead for electrical connection between the input / output bonding point of the chip circuit and the inner contact point of the lead frame when semiconductor devices and integrated circuits are assembled. As a bonding inner lead, the bonding wire should have the following properties: high electrical conductivity, strong electrical conductivity, strong bonding with conductor materials, stable chemical properties, no harmful intermetallic compounds, good plasticity, easy welding, and It can maintain a certain shape and has a specified tensile strength and elongation. The bonding wires currently in use mainly include gold wires, aluminum-silicon wires, copper wires, and alloy wires, among which gold wires are widely used in IC inner lead...

Claims

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Application Information

Patent Timeline
14 Nov 2012
Publication
CN102776405A
IPC
C22C5/02; C22F1/14; H01L23/49; H01L21/48
CPC
H01L24/45; H01L2224/45144; H01L2224/45147; H01L24/43; H01L2224/43; H01L2224/43848; H01L2224/45; H01L2224/45139
Inventors
马晓霞; 李玉芹