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Epoxy resin-POSS hybrid resin and preparation method of its composite material

An epoxy resin and hybrid resin technology, applied in chemical instruments and methods, synthetic resin layered products, layered products, etc., can solve the problems of high cross-linking degree of cured products and incomplete reaction of active groups, and achieve Good overall performance, avoid incomplete reaction, improve the effect of glass transition temperature

Inactive Publication Date: 2015-05-13
BEIJING UNIV OF CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention provides a kind of preparation method of the epoxy resin nano-composite material that takes monoisocyanate silsesquioxane as modifier, the method can make cage silsesquioxane grafted onto the molecular chain of epoxy resin, On the one hand, it is dispersed in the resin matrix at the molecular level, has good reactivity, can greatly improve the compatibility between nanoparticles and the resin matrix, and avoids the POSS agglomeration phenomenon caused by traditional physical blending methods. The functional group reaction is easier to control the molecular structure, avoiding the incomplete reaction of the active group and the excessive crosslinking of the cured product that may be caused by the chemical modification of the multifunctional POSS

Method used

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  • Epoxy resin-POSS hybrid resin and preparation method of its composite material
  • Epoxy resin-POSS hybrid resin and preparation method of its composite material
  • Epoxy resin-POSS hybrid resin and preparation method of its composite material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] Embodiment one: 50g brominated bisphenol A type epoxy resin is dissolved in 12.5g acetone, is made into the resin glue solution of 80wt%, gets 0.5g heptaphenyl monoisocyanate group cage type silsesquioxane and is dissolved in 5g After fully dissolving in chloroform, mix it into the resin glue solution, add 0.1 g of dibutyltin dilaurate solution of 20 wt% catalyst, stir evenly, and react at 60°C for 5 hours to obtain a hybrid resin. Add 12.5g of 10% mass fraction of dicyandiamide in N,N-dimethylformamide solution, add 7.5g of 1% mass fraction of 2-methylimidazole in acetone solution, and stir for 12 hours. Take six pieces of glass fiber cloth and dip them into the resin one by one, soak them fully, and cure the glued glass fiber cloth in an oven at 170°C for 6 minutes to obtain a prepreg. Put it into a hot press without slipping each layer, pressurize to 3.5Mpa, keep the pressure stable until the board is taken out, keep it at 140°C for 1 hour, raise the temperature to 2...

Embodiment 2

[0015] Embodiment two: 50g brominated bisphenol A type epoxy resin is dissolved in 12.5g acetone, is made into the resin glue solution of 80wt%, gets 1.5g heptaphenyl monoisocyanate group cage type silsesquioxane and dissolves in 15g After fully dissolving in chloroform, mix it into the resin glue solution, add 0.3 g of dibutyltin dilaurate solution with 20 wt% catalyst, stir evenly, and react at 60°C for 5 hours to obtain a hybrid resin. Add 12.5g of 10% mass fraction of dicyandiamide in N,N-dimethylformamide solution, add 7.5g of 1% mass fraction of 2-methylimidazole in acetone solution, and stir for 12 hours. Take six pieces of glass fiber cloth and dip them into the resin one by one, soak them fully, and cure the glued glass fiber cloth in an oven at 170°C for 6 minutes to obtain a prepreg. Put it into a hot press without slipping each layer, pressurize to 3.5Mpa, keep the pressure stable until the board is taken out, keep it at 140°C for 1 hour, raise the temperature to 2...

Embodiment 3

[0016] Embodiment three: 50g brominated bisphenol A type epoxy resin is dissolved in 12.5g acetone, is made into the resin glue solution of 80wt%, gets 2.5g heptaphenyl monoisocyanate group cage type silsesquioxane and is dissolved in 25g After fully dissolving in chloroform, mix it into the resin glue solution, add 0.5 g of a 20 wt % dibutyltin dilaurate solution as a catalyst, stir evenly, and react at 60° C. for 5 hours to obtain a hybrid resin. Add 12.5g of 10% mass fraction of dicyandiamide in N,N-dimethylformamide solution, add 7.5g of 1% mass fraction of 2-methylimidazole in acetone solution, and stir for 12 hours. Take six pieces of glass fiber cloth and dip them into the resin one by one, soak them fully, and cure the glued glass fiber cloth in an oven at 170°C for 6 minutes to obtain a prepreg. Put it into a hot press without slipping each layer, pressurize to 3.5Mpa, keep the pressure stable until the board is taken out, keep it at 140°C for 1 hour, raise the temper...

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Abstract

Disclosed are an epoxy resin-POSS hybrid resin and a preparation method of its composite material. The epoxy resin-POSS hybrid resin is applied in an advanced electronic packaging baseplate material. At present, it is very hard to greatly raise comprehensive properties of resin simply through molecular design of epoxy resin, and some performance is raised at the expense of other performance. Traditional POSS modified epoxy resin is mainly prepared by two modes of physical blending and participation copolymerization. Through grafting modified epoxy resin, unique mono-isocyanate polyhedral oligomeric silsesquioxane is adopted to be dispersed on main chain of resin molecules at the molecular level instead of participating in copolymerization as a crosslinking point, so as to obtain high heat-resistant and low dielectric resin for advanced electronic packaging baseplates. The cured hybrid resin has smaller intermolecular distance and lower segment slip capability, and thermal performance, dielectric properties, moisture absorption resistance and mechanical properties of a resin-based composite material copper-clad plate are raised in different degrees.

Description

technical field [0001] The invention relates to a preparation method of an epoxy resin nano-hybrid resin and a composite material thereof, belonging to the field of organic polymer materials. Background technique [0002] With the rapid development of science and technology, human beings have fully entered the information age, and the trend of miniaturization and functional integration of electronic equipment has put forward higher requirements for the performance of printed circuit boards used inside them. In PCB, there are two formulas as follows: (υ is the signal transmission rate, c is the speed of light, ε is the dielectric constant), P=Rf tanδε 1 / 2 (P is the signal transmission loss in the circuit, R is the proportional constant, f is the transmission frequency, tanδ is the dielectric loss, ε is the dielectric constant), indicating that the dielectric constant and dielectric loss are important parameters of the circuit system, and the dielectric constant The smaller...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B37/06B32B27/06B32B27/38B32B17/04B32B15/092C08L63/00C08K7/14C08G59/14C08G59/50
Inventor 李齐方卢鹏
Owner BEIJING UNIV OF CHEM TECH
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