Integrating method of working temperature controllable multi-chip component

Abstract

The invention discloses an integrating method of a working temperature controllable multi-chip component. Integrating technology of a thermal signal-acquiring thick film thermistor, micro thermoelectric refrigeration, thick film screen printing, thick film laser resistor trimming, and co-sintering ceramic at low temperature in multiple layers, is adopted by the method, wherein a multi-layer co-sintered ceramic substrate is formed by sintering multiple layers of ceramic, and each layer comprises a metalized through hole, a conduction band and a stop band; the thick film thermistor is buried in the second layer of a ceramic plate of the multi-layer co-sintered ceramic substrate, and the burying position faces an integrated circuit chip which is sensitive to temperature; the conduction band, the stop band, the integrated circuit chip, a small-capacity inducer and a micro element are integrated on the front surface of the substrate; and a semiconductor cooler is integrated on the back surface of the substrate and is respectively connected to a surface bonding area through the through hole from the two ends of an N type semiconductor and a P type semiconductor. By the component, devices work in a specific working temperature range for a long time, the temperature stability for long-term work of the devices can be ensured, and the long-term reliability of the devices is improved.

Description

technical field [0001] The present invention relates to a multi-chip module (abbreviated as MCM), and furthermore, to a thick-film multi-layer low-temperature co-fired ceramic multi-chip module (abbreviated as MCM-C), especially to a thick-film multi-layer low-temperature co-fired ceramic multi-chip with controllable operating temperature components. Background technique [0002] A device that mounts multiple semiconductor chips in the same package is a multi-chip module. In the original multi-chip module integration technology, the thick-film low-temperature multi-layer co-fired ceramic (LTCC for short) substrate is directly mounted on the base of the shell, and then the thick-film conductive paste is screen-printed and sintered on the LTCC substrate. Material or thick film resistor paste, laser trimming of sintered thick film resistors, mounting semiconductor chips, chip components, and then bonding with bonding wire (gold wire or silicon aluminum wire) to complete the en...

AI Technical Summary

Problems solved by technology

[0003] The original technology mainly has the following problems: due to the high integration density and large integration capacity of the MCM multi-chip component integration, the heat generated is correspondingly increased, which brings many difficulties to the heat dissipation design, heat dissipation means, and heat dissipation environment during use. , the requirements for the use environment are relatively high, and the cost of supporting the use is greatly increased, which limits the wide use of multi-chip module products

Obviously, this technical solution has nothing to do with the integration of temperature-controlled multi-chip modules

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