Integrating method of working temperature controllable multi-chip component

A technology of multi-chip components and integration methods, applied in electrical components, electric solid-state devices, semiconductor devices, etc., can solve the problems of restricting the wide use of multi-chip components, heat dissipation design, difficult heat dissipation environment for heat dissipation methods, and high requirements for the use environment. , to achieve good temperature stability and regulation, good temperature protection function, and the effect of improving long-term reliability

Inactive Publication Date: 2013-01-16
GUIZHOU ZHENHUA FENGGUANG SEMICON
View PDF5 Cites 16 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The original technology mainly has the following problems: due to the high integration density and large integration capacity of the MCM multi-chip component integration, the heat generated is correspondingly increased, which brings many difficulties to the heat dissipation design, heat dissipation means, and heat dissipation environment during use. , the requirements for the use environment are relatively high, and the cost of supporting the use is greatly increased, which limits the wide use of multi-chip module products
Obviously, this technical solution has nothing to do with the integration of temperature-controlled multi-chip modules

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Integrating method of working temperature controllable multi-chip component
  • Integrating method of working temperature controllable multi-chip component
  • Integrating method of working temperature controllable multi-chip component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] Embodiment 1: the original integrated process such as Figure 4 As shown, the process is briefly described as follows:

[0018] ⑴ Casting: By changing the material type and ratio, the substrate with expected design requirements (such as thermal conductivity, dielectric constant, loss factor, insulation resistance, breakdown voltage, etc.) can be obtained. According to the design requirements, the proportioning of the slurry is completed, and the slurry is cast on the tape casting machine along the substrate film into a thin sheet; at this time, it becomes a raw porcelain material, which is rolled into a roll after pre-drying, and is ready for use;

[0019] ⑵Cutting pieces: The rolled green ceramic sheets after casting are inspected on the surface and cut into ceramic blocks of specified size, that is, blocks;

[0020] (3) Punching: In order to make the interconnection structure of each layer of LTCC, it is necessary to punch through holes or positioning holes of variou...

Embodiment 2

[0035] Example 2 Process flow of the present invention such as Figure 5 Shown; The present invention, on the basis of original flow process, increases thick-film thermistor slurry screen printing and sintering, LTCC substrate back side thick-film conductor slurry screen printing and curing, the preparation and processing of TEC substrate ceramic substrate The printing and sintering of thick film conduction tape, the preparation of N-type and P-type semiconductor grains required by TEC, the integration of PTCC and TEC, etc. The overall process flow is briefly described as follows:

[0036] (1) Casting: By changing the material type and ratio, the substrate with design requirements (such as thermal conductivity, dielectric constant, loss factor, insulation resistance, breakdown voltage, etc.) can be obtained. According to the design requirements, the proportioning of the slurry is completed, and the slurry is cast on the tape casting machine along the substrate film into a th...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses an integrating method of a working temperature controllable multi-chip component. Integrating technology of a thermal signal-acquiring thick film thermistor, micro thermoelectric refrigeration, thick film screen printing, thick film laser resistor trimming, and co-sintering ceramic at low temperature in multiple layers, is adopted by the method, wherein a multi-layer co-sintered ceramic substrate is formed by sintering multiple layers of ceramic, and each layer comprises a metalized through hole, a conduction band and a stop band; the thick film thermistor is buried in the second layer of a ceramic plate of the multi-layer co-sintered ceramic substrate, and the burying position faces an integrated circuit chip which is sensitive to temperature; the conduction band, the stop band, the integrated circuit chip, a small-capacity inducer and a micro element are integrated on the front surface of the substrate; and a semiconductor cooler is integrated on the back surface of the substrate and is respectively connected to a surface bonding area through the through hole from the two ends of an N type semiconductor and a P type semiconductor. By the component, devices work in a specific working temperature range for a long time, the temperature stability for long-term work of the devices can be ensured, and the long-term reliability of the devices is improved.

Description

technical field [0001] The present invention relates to a multi-chip module (abbreviated as MCM), and furthermore, to a thick-film multi-layer low-temperature co-fired ceramic multi-chip module (abbreviated as MCM-C), especially to a thick-film multi-layer low-temperature co-fired ceramic multi-chip with controllable operating temperature components. Background technique [0002] A device that mounts multiple semiconductor chips in the same package is a multi-chip module. In the original multi-chip module integration technology, the thick-film low-temperature multi-layer co-fired ceramic (LTCC for short) substrate is directly mounted on the base of the shell, and then the thick-film conductive paste is screen-printed and sintered on the LTCC substrate. Material or thick film resistor paste, laser trimming of sintered thick film resistors, mounting semiconductor chips, chip components, and then bonding with bonding wire (gold wire or silicon aluminum wire) to complete the en...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/50H01L21/48H01L23/15
Inventor 杨成刚苏贵东刘俊
Owner GUIZHOU ZHENHUA FENGGUANG SEMICON
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap