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Photosensitive solder resist composite, application thereof and printed circuit board (PCB) containing same

A technology of photosensitive solder resist and composition, which is applied in the secondary treatment of printed circuits, photosensitive materials used in optomechanical equipment, optics, etc., can solve the problems of poor heat resistance, achieve good hardness and light aging resistance, and good The effect of heat resistance

Active Publication Date: 2013-02-27
惠州市容大感光科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But it has the problem of poor heat resistance

Method used

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  • Photosensitive solder resist composite, application thereof and printed circuit board (PCB) containing same
  • Photosensitive solder resist composite, application thereof and printed circuit board (PCB) containing same
  • Photosensitive solder resist composite, application thereof and printed circuit board (PCB) containing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0074] Synthesis example 1 (preparation of alkali-soluble photosensitive resin A1 obtained by TGIC)

[0075] In a 1L reactor equipped with a thermometer, stirrer, reflux condenser and dropping funnel, add 150 grams of TGIC (epoxy equivalent 102, purchased from Changzhou Niutang Chemical Factory Co., Ltd.), add 300 grams of TGIC under stirring Diethylene glycol monoethyl ether acetate is used as a solvent, 0.5 g of hydroquinone as a polymerization inhibitor and 2 g of triphenylphosphine as a reaction catalyst. The mixture was heated to 95°C, and after TGIC was completely dissolved, 104 g of acrylic acid was slowly added dropwise, and then reacted at 95°C-100°C for 15 hours until the detected acid value of the mixture was less than 5 mg KOH / g. After the temperature in the reactor dropped to 85°C-90°C, 100 grams of tetrahydrophthalic anhydride was added and reacted for 6 hours to obtain light yellow transparent liquid resin A1 with an acid value of 58 mgKOH / g and a solid content ...

Embodiment 2

[0076] Synthesis Example 2 (preparation of epoxy resin of the present invention)

[0077] Add 150 grams of diethylene glycol monoethyl ether acetate as a solvent in a 1L reactor equipped with a thermometer, stirrer, reflux condenser and dropping funnel, and heat to 80-82 ° C; under stirring and nitrogen protection Next, add 10 grams of azobisisobutyronitrile peroxide, keep the temperature at 80-82 ° C, drop the mixture of glycidyl methacrylate and methyl methacrylate (140:60 by weight) within two hours 200 grams, followed by insulation and stirring for two hours, then the temperature was raised to 120°C for one hour. The temperature was lowered to obtain a polymer solution (M-1) with a weight average molecular weight of 20,000, a solid epoxy equivalent of 200, and a solid content of 58.3%.

Embodiment 1-8 and comparative example 1-4

[0081] Mix the resin A1 and resin A2 obtained in the above synthesis example according to the formulations in Table 1, Table 1' and Table 2 respectively, first use a disperser (U400\80-220 high-speed disperser) to disperse at high speed for 15 minutes, and then use A three-roll mill (S-65 three-roll mill) was ground three times to obtain photosensitive solder resist compositions. The numbers in the table represent parts by weight.

[0082] Table 1

[0083] Material

Example 1

Example 2

Example 3

Example 4

Resin A1

45

45

45

45

M-1

15

15

15

15

Irgacure TPO

3

3

-

3

Irgacure 819

-

-

3

3

Irgacure 907

-

-

-

-

ITX

-

3

-

-

Rutile Titanium Dioxide

36

36

36

36

DPHA

4

4

4

4

Diethylene glycol ethyl ether acetate

5

5

5

5

Melamine

1

1

1

1 ...

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Abstract

The invention relates to a photosensitive solder resist composite. The photosensitive solder resist composite comprises (A) 100 parts by weight of alkali-soluble photosensitive resin with a triazine ring structure in molecule and the following components in parts by weight based on the 100 parts by weight of alkali-soluble photosensitive resin: (B) 5 to 70 parts of epoxy resin free of aromatic rings in molecule, (C) 1 to 30 parts of photoinitiator containing at least one type of acylphosphine oxide photoinitiators, (D) 30 to 200 parts of titanium dioxide, and (E) 3 to 100 parts of organic solvent and / or 50 parts or less of photopolymerizable monomer as diluent. The photosensitive solder resist composite provided by the invention has excellent thermal resistance, hardness and photoaging resistance. In addition, the invention also relates to the application of the photosensitive solder resist composite in a PCB, and the PCB containing the solder resist composite.

Description

technical field [0001] The invention relates to a photosensitive solder resist composition, its use for printed circuit boards, and a printed circuit board comprising the photosensitive solder resist composition as a layer of permanent solder resist film. technical background [0002] The photosensitive solder resist composition is a protective composition covering the outer layer of the printed circuit board. One of its functions is to resist soldering and prevent unnecessary solder from adhering to the printed circuit board, even if the circuit board covered by the printed circuit board The board surface will not be attached by tin in the subsequent tin spraying, reflow soldering and wave soldering processes, thereby effectively preventing short circuits between lines and realizing a high degree of automation in the production process. [0003] In addition, using a solder resist film prepared from a photosensitive solder resist composition on the surface of a printed circu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004G03F7/027H05K3/28
Inventor 付强杨遇春刘启升
Owner 惠州市容大感光科技有限公司
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