Photosensitive solder resist composite, application thereof and printed circuit board (PCB) containing same
A technology of photosensitive solder resist and composition, which is applied in the secondary treatment of printed circuits, photosensitive materials used in optomechanical equipment, optics, etc., can solve the problems of poor heat resistance, achieve good hardness and light aging resistance, and good The effect of heat resistance
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Examples
Embodiment 1
[0074] Synthesis Example 1 (Preparation of alkali-soluble photosensitive resin A1 obtained from TGIC)
[0075] Add 150 grams of TGIC (epoxy equivalent 102, purchased from Changzhou Niutang Chemical Factory Co., Ltd.) into a 1L reactor equipped with a thermometer, agitator, reflux condenser and dropping funnel, and add 300 grams under stirring Diethylene glycol monoethyl ether acetate was used as a solvent, 0.5 g of hydroquinone was used as a polymerization inhibitor, and 2 g of triphenylphosphine was used as a reaction catalyst. The mixture was heated to 95° C., after TGIC was completely dissolved, 104 g acrylic acid was slowly added dropwise, and then reacted at 95° C.-100° C. for 15 hours until the detected acid value of the mixture was less than 5 mg KOH / g. After the temperature in the reactor dropped to 85°C-90°C, 100 g of tetrahydrophthalic anhydride was added and reacted for 6 hours to obtain a light yellow transparent liquid resin A1 with an acid value of 58 mgKOH / g and a ...
Embodiment 2
[0076] Synthesis Example 2 (Preparation of epoxy resin of the present invention)
[0077] In a 1L reactor equipped with a thermometer, stirrer, reflux condenser and dropping funnel, add 150 g of diethylene glycol monoethyl ether acetate as a solvent, and heat to 80-82°C; under stirring and nitrogen protection Add 10 grams of azobisisobutyronitrile peroxide, keep the temperature at 80-82℃, and drop in the mixture of glycidyl methacrylate and methyl methacrylate (weight ratio 140:60) within two hours 200 grams, then keep stirring for two hours, and raise the temperature to 120°C for one hour. The temperature was lowered to obtain a polymer solution (M-1) with a weight average molecular weight of 20000, a solid epoxy equivalent of 200, and a solid content of 58.3%.
Embodiment 1-8 and comparative example 1-4
[0081] Mix the resin A1 and resin A2 obtained in the above synthesis example according to the formulas in Table 1, Table 1'and Table 2, and disperse at high speed for 15 minutes with a disperser (U400\80-220 high-speed disperser), and then use Three-roll grinder (S-65 three-roll grinder) grinds 3 times to obtain photosensitive solder resist compositions respectively. The numbers in the table indicate parts by weight.
[0082] Table 1
[0083] Material
Example 1
Example 2
Example 3
Example 4
Resin A1
45
45
45
45
M-1
15
15
15
15
Irgacure TPO
3
3
-
3
Irgacure 819
-
-
3
3
Irgacure 907
-
-
-
-
ITX
-
3
-
-
36
36
36
36
DPHA
4
4
4
4
Diethylene glycol ethyl ether acetate
5
5
5
5
1
1
1
1
R972
1.2
1.2
1.2
1.2
KS-66
1
1
1
1
[0084] Irgacure TPO: photoinitiator (2,4,6-trimethylbenzoyl diphenyl phosphine oxide), purchased from Jiangsu Huatai Company
[0085] Irgacure 819: photoinitiator (bis(2,4,6-trimethylbenzoyl)phenyl phosphine o...
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