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High heat conductivity nanocomposite rubber

A nanocomposite, high thermal conductivity technology, applied in the field of new nanomaterials, can solve the problems of reduced mechanical properties, high production costs, poor thermal conductivity, etc.

Active Publication Date: 2015-05-27
东莞市思齐橡胶技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, most of the research on filling thermally conductive rubber adopts the method of physical filling, which has poor thermal conductivity, serious decline in mechanical properties, and high production costs.

Method used

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  • High heat conductivity nanocomposite rubber
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  • High heat conductivity nanocomposite rubber

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] Embodiment 1: In this embodiment, the high thermal conductivity nanometer rapid vulcanization composite EPDM rubber, the content ratio of each raw material component is as follows in parts by weight:

[0048] EPDM rubber 150-200 parts,

[0049] Anti-aging agent 1-4 parts,

[0050] 40-80 parts of carbon black,

[0051] 1-3 parts of sulfur,

[0052] Accelerator 1-3 parts,

[0053] 6-10 parts of plasticizer,

[0054] 40-80 parts of paraffin oil,

[0055] Organic active agent PEG4000, 3-8 parts

[0056] 6-12 parts of inorganic active agent,

[0057] 1-4 parts of dispersant,

[0058] And it is prepared by the following steps:

[0059] The first step, synthetic rubber: the above raw materials are synthesized into rubber through an internal mixer;

[0060] The second step, molding: the synthetic rubber is molded by an open mill;

[0061] The third step, vulcanization: Put the formed rubber into the mold in the vulcanizer, and the pressure range is 150-210kgf / ㎝ 2 , h...

Embodiment 2

[0062] Embodiment 2: The rubber dispersant is a reagent that promotes the uniform dispersion of material particles in the rubber medium to form a stable suspension. The rubber dispersant used in the embodiments of the present invention is one or more of the following reagents: triethylhexyl phosphoric acid, sodium lauryl sulfate, methyl amyl alcohol, cellulose derivatives, polyacrylamide, ancient Er gum, fatty acid polyethylene glycol ester.

Embodiment 3

[0064] The anti-aging agent used in one embodiment of the present invention is: 6-ethoxy-2,2,4-trimethyl-1,2-dihydroquinoline. Its trade name is antiaging agent AW. Antiaging agent AW is a brown viscous liquid, and the pure product is a light brown viscous liquid. Non-toxic, the specific gravity is 1.029~1.030 (25°C), and the boiling point is 169°C. Soluble in benzene, acetone, dioxyethane, carbon tetrachloride, solvent gasoline and ethanol; insoluble in water. Stable in storage. It is a special anti-ozone anti-aging agent, and it also has a protective effect on flex cracking and thermal oxygen aging. Especially suitable for products used under dynamic conditions. No frost, polluting, not suitable for light-colored products. When the amount is 1-2 parts, it has little effect on vulcanization, and when it is increased to 3 parts, it will significantly promote vulcanization, and the amount of promotion should be appropriately reduced during use.

[0065] The anti-aging age...

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Abstract

The invention discloses a high heat conductivity nanocomposite rubber. The raw materials comprise one or more of the following components: ethylene-propylene-diene-terpolymer (EPDM) rubber, anti-aging agents, carbon black, sulfur, accelerants, plasticizers, paraffin oil, an organic active agent PEG4000, inorganic active agents and dispersing agents. The nanocomposite rubber has the beneficial effects that the heat conductivity of the composite material is greatly improved by using the mixed fillers; granules and whiskers with certain length-diameter ratios are utilized to form a continuous heat conduction network chain; the fillers in different grain sizes are selected and combined to achieve higher filling density; a coupling agent is utilized to improve the interfaces of the fillers and the matrix to reduce the heat resistance on the interfaces; the heat conductivity is improved by filling the rubber with nano materials; molecule interaction forces between the thermoplastic rubber and the fillers are improved by utilizing unique molecular design; and a heat channel is formed through efficient contact between the fillers, thus greatly improving the heat conductivity.

Description

technical field [0001] The invention relates to the technical field of new nanometer materials, in particular to a kind of nanometer composite rubber with high thermal conductivity. Background technique [0002] Now, as electronic products tend to be more and more miniaturized, composite rubber substrates that are easy to integrate and miniaturize and have good flexibility are widely used, but because of the high integration of integrated circuits and the multilayering of laminates, there will inevitably be Therefore, the requirements for the thermal conductivity of these materials have become a top priority. [0003] Ethylene-propylene-diene rubber (EPDM) is a terpolymer of ethylene, propylene and diene monomers. The introduction of diene is to realize vulcanization. The types of diene are: dicyclopentadiene (DCPD), 1,4 Hexadiene. EPDM is tougher than ordinary ethylene propylene rubber. [0004] In recent years, people have filled polymers with non-conductive metal oxide...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L23/16C08K13/04C08K7/04C08K3/22C08K3/34C08K3/38C08K3/28C08K3/30B29C35/02
Inventor 曾晶尚朋丘新涛
Owner 东莞市思齐橡胶技术有限公司