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Scaling powder for lead-free solder paste

A lead-free solder paste and flux technology, applied in the direction of welding medium, welding equipment, welding/cutting medium/material, etc., can solve the problems of high halogen content, poor oxidation resistance, high adhesion, etc., and achieve good activity, Strong high temperature oxidation resistance, no halogen residue effect

Inactive Publication Date: 2013-05-22
郴州金箭焊料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a flux for lead-free solder paste to solve the problems of poor high-temperature oxidation resistance, high halogen content, and high adhesion in the prior art, which effectively ensures that the lead-free solder paste can be used in the soldering process. Has good oxidation resistance and thixotropic properties, although it is halogen-free, it still maintains good activity in a wide temperature range

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Flux for lead-free solder paste, the mass percentages of its components are: hydrogenated rosin 7.0%, polymerized rosin 28.0%, glycolic acid 2.0%, salicylic acid 2.0%, phytate 1.0%, hydrogenated castor oil 2.0% %, polyamide 1.0%, AEO-12 3.0%, benzothiazole 0.1%, ethanol 23.9%, diethylene glycol monobutyl ether 30.0%.

Embodiment 2

[0025] Flux for lead-free solder paste, the mass percentages of its components are: water white rosin 10.0%, polymerized rosin 30.0%, lactic acid 1.0%, tartaric acid 1.8%, phytic acid 0.7%, fatty acid glyceride 3.9%, ethyl Bisstearic acid amide 1.6%, AEO-14 2.2%, benzimidazole 0.8%, isopropanol 20.0%, ethylene glycol monobutyl ether 28.0%.

[0026] Example 2

[0027] Flux for lead-free solder paste, the mass percentages of its components are: water white rosin 7.5%, polymerized rosin 37.5%, glycolic acid 0.6%, tartaric acid 1.0%, phytate 0.4%, hydrogenated castor oil 6.0% , Ethylene bis stearic acid amide 2.0%, AEO-16 1.5%, triethylamine 1.5%, ethanol 12.0%, isopropanol 15.0%, ethylene glycol monopropyl ether 15.0%.

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PUM

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Abstract

The invention discloses scaling powder for lead-free solder paste. The scaling powder for the lead-free solder paste comprises, by weight, 35.0%-45.0% of colophony, 2.0%-5.0% of activating agent, 3.0%-8.0% of thixotropic agent, 1.5%-3.0% of surface active agent and 0.1%-1.5% of corrosion inhibitor, the other part is solvent. The scaling powder for the lead-free solder paste is wide in viscosity range, good in activity and strong in high temperature oxidation resistance, no halogen residues exist on a welded base plate, washing is not needed, insulation resistance is beyond 108 ohms, and the scaling powder for the lead-free solder paste can be widely applied to the field of welding of electronic materials.

Description

technical field [0001] The invention relates to a flux used in the technical field of soldering materials, in particular to a halogen-free flux used in lead-free solder paste. Background technique [0002] With the development of electronic information products in the direction of integration, miniaturization and high performance, surface mount technology (SMT) has gradually become the mainstream technology of electronic assembly. Among them, the use of solder paste has become a key process in the SMT process. The performance of solder paste To a large extent, it determines the quality of electronic products. Japan, the European Union and the United States have promulgated directives prohibiting the use of lead and its compounds, and have successively promoted the process of lead-free. The "Administrative Measures for the Prevention and Control of Pollution by Electronic Information Products" promulgated by my country has also been officially implemented. The process of lead...

Claims

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Application Information

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IPC IPC(8): B23K35/362
Inventor 李曼娇胡洁
Owner 郴州金箭焊料有限公司
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