Low-viscosity high-heat-conductivity organic silicon electronic pouring sealant and preparation method thereof

A silicone, high thermal conductivity technology, applied in chemical instruments and methods, adhesives, other chemical processes, etc., can solve the problem that the heat of electronic equipment cannot be dissipated in time, affects the reliability and life of electronic components, and uses a large amount of thermally conductive fillers, etc. problem, to achieve the effect of small distance, good mechanical properties and good fluidity

Active Publication Date: 2013-06-12
GUANGZHOU GLORYSTAR CHEM
View PDF4 Cites 30 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, typical unfilled silicone rubber has poor thermal conductivity, and its thermal conductivity is only 0.2W m -1 ·K -1 Left and right, used as potting glue, often leads to the heat generated by electronic equipment cannot be dissipated in time, which greatly affects the reliability and life of electronic components
[0003] At present, in terms of improving thermal conductivity, silicone rubber is generally filled with thermally conductive fillers with good insulating properties, such as alumina, silicon carbide whiskers, boron nitride, etc., but generally the amount of thermally conductive filler used is large, and the price of the filler used Expensive, and the thermal conductivity is generally difficult to break through 1.5W m -1 ·K -1 , or although electronic potting adhesives with slightly better thermal conductivity can be prepared, the viscosity tends to increase significantly, which makes the fluidity o...

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Low-viscosity high-heat-conductivity organic silicon electronic pouring sealant and preparation method thereof
  • Low-viscosity high-heat-conductivity organic silicon electronic pouring sealant and preparation method thereof
  • Low-viscosity high-heat-conductivity organic silicon electronic pouring sealant and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] 1) Preparation of base material: 100 parts by weight of branched vinyl polydimethylsiloxane, 80 parts by weight of spherical alumina with a particle size of 1.6 μm, and 40 parts by weight of flame retardant were added to vacuum kneading In the machine, under the conditions of 110°C and vacuum degree of 0.06-0.1MPa, add 0.2 parts by weight of the complex coupling agent diluted with ethanol alcohol solution with water to it dropwise while stirring, then dehydrate and blend for 2 hours, and cool Finally, grind 3 times with a three-roll machine to obtain the base material;

[0031] Wherein, the branched-chain vinyl polydimethylsiloxane is a branched-chain type with viscosities of 1000mPa·s (vinyl content 0.5wt%) and 200mPa·s (vinyl content 0.1wt%) A combination of vinyl polydimethylsiloxane in a mass ratio of 3:2; the flame retardant is a combination of melamine cyanurate and aluminum hydroxide in a mass ratio of 1:2; the compound type The coupling agent is a combination o...

Embodiment 2

[0036]1) Preparation of base material: Add 100 parts by weight of linear vinyl polydimethylsiloxane, 200 parts by weight of spherical alumina with a particle size of 5 μm, and 100 parts by weight of flame retardant into a vacuum kneader At 130°C and a vacuum of 0.06 to 0.1 MPa, 0.8 parts by weight of a complex coupling agent diluted with ethanol alcohol solution in water was added dropwise while stirring, and then dehydrated and blended for 5 hours. After cooling, Obtain the base material by grinding 4 times with a three-roll machine;

[0037] Wherein, the linear vinyl polydimethylsiloxane is a linear polydimethylsiloxane with a viscosity of 1000mPa·s (vinyl content is 1.0wt%) and 500mPa·s (vinyl content is 0.5wt%) A combination of vinyl polydimethylsiloxane in a mass ratio of 3:5; the flame retardant is a combination of melamine cyanurate and aluminum hydroxide in a mass ratio of 1:5; the compound type The coupling agent is a combination of aluminate, KH570 and KH550 with a ...

Embodiment 3

[0042] 1) Preparation of base material: Add 100 parts by weight of linear vinyl polydimethylsiloxane, 160 parts of spherical alumina with a particle size of 3 μm, and 70 parts by weight of flame retardant into a vacuum kneader , under the conditions of 120°C and vacuum degree of 0.06-0.1MPa, 0.5 parts by weight of compound coupling agent diluted with ethanol alcohol solution of water was added dropwise to it while stirring, and then dehydrated and blended for 4 hours, cooled and used The three-roll machine grinds 3 times to obtain the base material;

[0043] Wherein, the linear vinyl polydimethylsiloxane is linear vinyl polydimethylsiloxane with viscosities of 1000mPa·s (vinyl content 0.8%) and 400mPa·s (vinyl content 0.3%) respectively. A combination of polydimethylsiloxane in a mass ratio of 3:4; the flame retardant is a combination of melamine cyanurate and aluminum hydroxide in a mass ratio of 1:3; the complex coupling The agent is a combination of aluminate, KH570 and KH...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Particle sizeaaaaaaaaaa
Viscosityaaaaaaaaaa
Viscosityaaaaaaaaaa
Login to view more

Abstract

The invention provides low-viscosity high-heat-conductivity organic silicon electronic pouring sealant and a preparation method thereof. The method comprises the following steps of: mixing high viscosity and low viscosity of vinyl polydimethylsiloxane; adding aluminum oxide with particle size of 1-5 microns as heat conduction filler; further adding a compound coupling agent formed by combining aluminic acid ester, KH570 (gamma-methylacryloyloxypropyl trimethoxysilane) and KH550 (gamma-aminopropyl triethoxysilane) and a compound flame retardant formed by combining melamine cyanurate and aluminum hydroxide into a base material system; and preparing the electronic pouring sealant according to a proper proportion. The prepared pouring sealant has high heat conductivity up to 2.5-3.0W.m<-1>.K<-1>, low viscosity of 2000-3000mPa.s, perfect fluidity and good flame retardance effect; and the production cost is low.

Description

technical field [0001] The invention relates to the technical field of electronic potting glue, in particular to a low-viscosity, high-thermal-conductivity organic silicon electronic potting glue and its preparation technology. Background technique [0002] High-tech fields such as electronic components, large integrated circuit boards, and LEDs are gradually achieving high performance, high reliability, and miniaturization. Excellent high and low temperature resistance, mechanical properties, electrical insulation properties, but also good thermal conductivity, flame retardancy and fluidity. Currently used potting materials such as epoxy resin, polyurethane and silicone rubber are widely used. Silicone rubber can be used as the material of choice for potting electronic and electrical assemblies because it can maintain elasticity for a long time in a wide temperature range, and has good electrical properties and chemical stability. However, typical unfilled silicone rubber...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): C09J183/07C09J11/04C09J11/06C09K3/10
Inventor 胡新嵩罗伟何宗业林世凯陈耀根陈坚毅
Owner GUANGZHOU GLORYSTAR CHEM
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap