N-octadecane phase change micro-emulsion as well as preparation method and application thereof

Abstract

The invention discloses an n-octadecane phase change micro-emulsion. The micro-emulsion comprises water and the following components in mass fraction: 5-40% of n-octadecane, 2-20% of surfactant, 0-20% of fatty alcohols and 0-3% of inorganic salts. The preparation method comprises the following steps of: firstly mixing n-octadecane, the surfactant, fatty alcohol and the inorganic salts according to the ratio of the mass fraction, then adding the remained water at 30-40 DEG C, stirring uniformly and standing to obtain the n-octadecane phase change micro-emulsion. The n-octadecane phase change micro-emulsion can be applied to a microelectronic system thermal management, and is used for micro-channel efficient heat dissipation cooling working medium in a thermal management system. The micro-emulsion and the application thereof have the advantages of high latent heat of phase change, wide applicable temperature range, good stability and the like.

Description

technical field [0001] The invention relates to a microemulsion and its preparation method and application, in particular to a phase change microemulsion and its preparation method and application. Background technique [0002] The rapid development of microelectronics technology promotes the high integration of various functional modules, the temperature of the chip continues to rise, the heat flux of the chip increases sharply, and the heat dissipation problem caused by it becomes increasingly prominent. Micro-channel heat sink is a new high-efficiency liquid cooling heat dissipation technology, which is gradually being applied in the thermal management technology of large-scale integrated circuits and high-power chips. Heat, so as to achieve cooling effect. At present, the cooling medium used for heat dissipation in microchannels is mainly water. Although water has a larger specific heat compared with general cooling fluids, its thermal conductivity and specific heat cap...

AI Technical Summary

Problems solved by technology

At present, the cooling medium used for heat dissipation in microchannels is mainly water. Although water has a larger specific heat compared with general cooling fluids, its thermal conductivity and specific heat capacity are still low under the conditions of high heat flux density and limited pump work. It looks too small, the heat dissipation efficiency is limited, and the consumption is very large, which still cannot meet the actual needs

In order to improve the apparent specific heat of the cooling medium, the method currently used is to disperse organic solid-liquid phase change materials in the base liquid to prepare phase change microcapsule suspensions, phase change emulsions, etc., but the phase change microcapsule suspension The microcapsule particles and phase change particles of liquid and phase change emulsion are at the micron level, the fluid viscosity is high, and when used in microchannels, the flow resistance is large, and even stick to dirt, block microchannels, and consume a lot of pump power

Moreover, the microcapsule particles are organic materials with low thermal conductivity, which makes the temperature of the fluid center low, and some phase transitions do not occur, which reduces the heat transfer enhancement effect; the emulsion is a thermodynamically unstable system, which undergoes several solid-liquid phase transitions Demulsification and delamination are prone to occur after circulation, resulting in product failure

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