A preparation process of copper-clad laminate based on halogen-free flame-retardant resin composition

A technology of copper clad laminate and flame retardant resin, applied in the direction of lamination, lamination device, layered products, etc., can solve the problem of affecting the service life of plates and finished products, can not meet the requirements of lead-free welding, reduce flame retardant The hygroscopic performance of the agent can be solved, and the effect of high CTI performance, high reliability and excellent processability can be achieved.

Active Publication Date: 2016-02-03
SHAANXI SHENGYI TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the special structure of the P=O group in the phosphorus-containing epoxy resin and phosphate-based flame-retardant substances leads to the formulation having strong hygroscopicity and hydrolysis. Therefore, the introduction of such materials in the formulation makes Under the conditions of strong alkali or high temperature and high humidity (such as in the process of PCB processing), it is very easy to cause delamination and explosion, which seriously affects the service life of the board and the finished product
In addition, the presence of these hygroscopic substances can also lead to a reduction in the service life of electrical equipment produced with copper clad laminates
[0004] At present, in order to solve the problem of high hygroscopicity and explosive board of halogen-free boards, phosphazene flame retardants (see patent CN102020230A) are used. Because of the special chemical structure, P atoms are wrapped in the middle of other atoms. Greatly reduces the hygroscopic properties of flame retardants
However, in order to achieve flame retardancy, this application uses a large amount of phenoxyphosphazene flame retardant in combination with N-type phenolic resins and phosphate esters. Due to the large amount of phenoxyphosphazene flame retardants, it is easy to precipitate, and melamine-modified phenolic Resin and phosphate ester cured products have low heat resistance and high water absorption
As a result, the board is still lacking in heat resistance and moisture absorption performance, especially it cannot meet the current lead-free soldering requirements, and the storage time of the board is short

Method used

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  • A preparation process of copper-clad laminate based on halogen-free flame-retardant resin composition
  • A preparation process of copper-clad laminate based on halogen-free flame-retardant resin composition
  • A preparation process of copper-clad laminate based on halogen-free flame-retardant resin composition

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Experimental program
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Effect test

Embodiment 1

[0027] A preparation process of a copper-clad laminate based on a halogen-free flame-retardant resin composition, comprising the following steps:

[0028] 1) Production of fabric glue: 70 parts of bisphenol A epoxy resin, 30 parts of o-cresol novolac epoxy resin, 2.8 parts of dicyandiamide, 30 parts of phenolic tripolyphosphazene, 35 parts of boehmite, 2 - 0.2 parts of ethyl-4 methylimidazole and 95 parts of DMF, prepared into glue;

[0029] 2) Preparation of glue A: 20 parts of water-soluble phenolic resin, 80 parts of phenoxytripolyphosphazene, 750 parts of acetone and 80 parts of water, prepared into glue;

[0030] 3) Preparation of glue B: 30 parts of bisphenol A epoxy resin, 20 parts of o-cresol novolac epoxy resin, 50 parts of phosphorus-containing epoxy resin, 25 parts of bisphenol F benzoxazine resin, cardanol modified 10 parts of non-reactive phenolic resin, 5 parts of phenoxytripolyphosphazene, 100 parts of aluminum hydroxide, 0.2 parts of 2-ethyl-4 methylimidazole ...

Embodiment 2

[0034] 1) Production of fabric glue: 70 parts of bisphenol A epoxy resin, 30 parts of o-cresol novolac epoxy resin, 2.8 parts of dicyandiamide, 30 parts of phenolic tripolyphosphazene, 30 parts of boehmite, 2 - 0.1 part of ethyl-4 methylimidazole and 90 parts of DMF, prepared into a glue;

[0035] 2) Preparation of glue A: 20 parts of water-soluble phenolic resin, 80 parts of phenoxytripolyphosphazene, 750 parts of acetone and 80 parts of water, prepared into glue;

[0036] 3) Preparation of glue B: 70 parts of bisphenol A epoxy resin, 30 parts of o-cresol novolak epoxy resin, 25 parts of bisphenol F benzoxazine resin, 10 parts of cardanol modified phenolic resin, phenoxy 35 parts of tripolyphosphazene, 70 parts of aluminum hydroxide, 0.2 part of 2-ethyl-4 methylimidazole and 105 parts of acetone were prepared into a glue;

[0037] 4) Use 7628 glass cloth to impregnate the fabric glue, and bake it in an oven (oven temperature 175°C) for 2-8 minutes, remove the solvent to prep...

Embodiment 3

[0040] 1) Production of fabric glue: 60 parts of bisphenol A epoxy resin, 40 parts of o-cresol novolac epoxy resin, 2.8 parts of dicyandiamide, 15 parts of phenolic tripolyphosphazene, 35 parts of boehmite, 2 - 0.3 parts of ethyl-4 methylimidazole and 88 parts of DMF, prepared into a glue;

[0041] 2) Preparation of glue A: 50 parts of water-soluble phenolic resin, 50 parts of phenoxytripolyphosphazene, 750 parts of acetone and 80 parts of water were prepared into glue;

[0042] 3) Preparation of glue B: 40 parts of bisphenol A epoxy resin, 20 parts of o-cresol novolac epoxy resin, 40 parts of phosphorus-containing epoxy resin, 35 parts of bisphenol F benzoxazine resin, tung oil modified 20 parts of phenolic resin, 30 parts of phenoxytripolyphosphazene, 70 parts of aluminum hydroxide, 0.2 part of 2-ethyl-4 methylimidazole and 105 parts of acetone are prepared into glue;

[0043] 4) Use 7628 glass cloth to impregnate the fabric glue, and bake it in an oven (oven temperature 17...

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Abstract

A preparation process for a copper-clad laminate based on a halogen-free flame-retardant resin composition. Firstly, fabric glue is made, then glue A is made, then glue B is made, and then 7628 or 2116 glass cloth is used. Impregnate the fabric glue, remove the solvent in an oven to prepare a fabric prepreg, use wood pulp paper to impregnate glue A and glue B in sequence, bake in an oven to prepare a core prepreg, and finally put 1-12 pieces of core material Prepreg, one piece of fabric prepreg is pasted on each side, and one electrolytic copper foil is pasted on one or both sides. After lamination, hot pressing is formed. The copper clad laminate made has low moisture absorption, high heat resistance and high reliability. , high CTI, halogen-free flame retardancy, and has excellent processability, and can be applied to lead-free requirements.

Description

technical field [0001] The invention relates to the technical field of manufacturing and processing copper-clad laminates of electronic materials, in particular to a preparation process of a copper-clad laminate based on a halogen-free flame-retardant resin composition. Background technique [0002] CEM-1 type copper clad laminate is made of glass fiber cloth and bleached wood pulp paper as the reinforced base material, which are respectively impregnated with epoxy resin glue to make the fabric and core material, and then covered with copper foil by hot pressing. It has excellent heat resistance, low water absorption, excellent processability, good electrical insulation and mechanical strength, and has the characteristics of low cost and high cost performance. It is mainly suitable for OA equipment, power substrates, LCDTVs, game machines, and household appliances. electrical appliances etc. However, traditional copper-clad laminates for printed circuits mainly use halogen ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B37/12B32B37/06B32B37/10B32B15/092B32B15/098B32B15/20B32B17/04
Inventor 武伟
Owner SHAANXI SHENGYI TECH
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