Preparation technology of copper-clad laminate based on halogen-free flame-retardant resin compositions

A technology of copper-clad laminates and flame-retardant resins, applied in lamination, lamination devices, layered products, etc., can solve the problem of affecting the service life of plates and finished products, failing to meet the requirements of lead-free soldering, and reducing flame retardancy Solve the problems such as the moisture absorption performance of the agent, and achieve the effect of high CTI performance, high reliability and excellent processability

Active Publication Date: 2013-07-03
SHAANXI SHENGYI TECH
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  • Abstract
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AI Technical Summary

Problems solved by technology

However, the special structure of the P=O group in the phosphorus-containing epoxy resin and phosphate-based flame-retardant substances leads to the formulation having strong hygroscopicity and hydrolysis. Therefore, the introduction of such materials in the formulation makes Under the conditions of strong alkali or high temperature and high humidity (such as in the process of PCB processing), it is very easy to cause delamination and explosion, which seriously affects the service life of the board and the finished product
In addition, the presence of these hygroscopic substances can also lead to a reduction in the service life of electrical equipment produced with copper clad laminates
[0004] At present, in order to solve the problem of high hygroscopicity and explosive board of halogen-free boards, phosphazen

Method used

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  • Preparation technology of copper-clad laminate based on halogen-free flame-retardant resin compositions

Examples

Experimental program
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Effect test

Embodiment 1

[0027] A preparation process of a copper-clad laminate based on a halogen-free flame-retardant resin composition, comprising the following steps:

[0028] 1) Production of fabric glue: 70 parts of bisphenol A epoxy resin, 30 parts of o-cresol novolac epoxy resin, 2.8 parts of dicyandiamide, 30 parts of phenolic tripolyphosphazene, 35 parts of boehmite, 2 - 0.2 parts of ethyl-4 methylimidazole and 95 parts of DMF, prepared into a glue;

[0029] 2) Preparation of glue A: 20 parts of water-soluble phenolic resin, 80 parts of phenoxytripolyphosphazene, 750 parts of acetone and 80 parts of water, prepared into glue;

[0030] 3) Preparation of glue B: 30 parts of bisphenol A epoxy resin, 20 parts of o-cresol novolac epoxy resin, 50 parts of phosphorus-containing epoxy resin, 25 parts of bisphenol F benzoxazine resin, cardanol modified 10 parts of phenolic resin, 5 parts of phenoxytripolyphosphazene, 100 parts of aluminum hydroxide, 0.2 parts of 2-ethyl-4 methylimidazole and 105 par...

Embodiment 2

[0034] 1) Production of fabric glue: 70 parts of bisphenol A epoxy resin, 30 parts of o-cresol novolac epoxy resin, 2.8 parts of dicyandiamide, 30 parts of phenolic tripolyphosphazene, 30 parts of boehmite, 2 - 0.1 part of ethyl-4 methylimidazole and 90 parts of DMF, prepared into a glue;

[0035] 2) Preparation of glue A: 20 parts of water-soluble phenolic resin, 80 parts of phenoxytripolyphosphazene, 750 parts of acetone and 80 parts of water, prepared into glue;

[0036] 3) Production of glue B: 70 parts of bisphenol A epoxy resin, 30 parts of o-cresol novolak epoxy resin, 25 parts of bisphenol F benzoxazine resin, 10 parts of cardanol modified phenolic resin, phenoxy 35 parts of tripolyphosphazene, 70 parts of aluminum hydroxide, 0.2 part of 2-ethyl-4 methylimidazole and 105 parts of acetone are prepared into glue;

[0037] 4) Use 7628 glass cloth to impregnate the fabric glue, and bake it in an oven (oven temperature 175°C) for 2-8 minutes, remove the solvent to prepare ...

Embodiment 3

[0040] 1) Production of fabric glue: 60 parts of bisphenol A epoxy resin, 40 parts of o-cresol novolac epoxy resin, 2.8 parts of dicyandiamide, 15 parts of phenolic tripolyphosphazene, 35 parts of boehmite, 2 - 0.3 parts of ethyl-4 methylimidazole and 88 parts of DMF, prepared into glue;

[0041] 2) Preparation of glue A: 50 parts of water-soluble phenolic resin, 50 parts of phenoxytripolyphosphazene, 750 parts of acetone and 80 parts of water, prepared into glue;

[0042] 3) Production of glue B: 40 parts of bisphenol A epoxy resin, 20 parts of o-cresol novolac epoxy resin, 40 parts of phosphorus-containing epoxy resin, 35 parts of bisphenol F benzoxazine resin, tung oil modified phenolic resin 20 parts of resin, 30 parts of phenoxytripolyphosphazene, 70 parts of aluminum hydroxide, 0.2 parts of 2-ethyl-4 methylimidazole and 105 parts of acetone are prepared into glue;

[0043] 4) Use 7628 glass cloth to impregnate the fabric glue, and bake it in an oven (oven temperature 17...

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Abstract

A preparation technology of a copper-clad laminate based on halogen-free flame-retardant resin compositions comprises the following steps: a fabric glue solution, a glue solution A and a glue solution B are sequentially manufactured; the fabric glue solution is impregnated by 7628 or 2116 glass fabric; solvent is removed in a drying oven to prepare a fabric prepreg; the glue solution A and the glue solution B are sequentially impregnated by wood pulp paper; baking is carried out in the drying oven to prepare a core material prepreg; and finally, two fabric prepregs are respectively pasted on both sides of each of 1-12 core material prepregs, an electrodeposited copper foil is pasted on one side or two sides of each core material prepreg, and the core material prepregs are overlapped and subjected to hot-forming. The copper-clad laminate prepared by adopting the preparation technology has the advantages of low hygroscopicity, high heat resistance, high reliability, high CTI (Comparative Tracking Index), halogen-free and flame-retardant performance, and excellent machinability, and meets the lead-free demand.

Description

technical field [0001] The invention relates to the technical field of manufacturing and processing copper-clad laminates of electronic materials, in particular to a preparation process of a copper-clad laminate based on a halogen-free flame-retardant resin composition. Background technique [0002] CEM-1 type copper clad laminate is made of glass fiber cloth and bleached wood pulp paper as the reinforced base material, which are respectively impregnated with epoxy resin glue to make the fabric and core material, and then covered with copper foil by hot pressing. It has excellent heat resistance, low water absorption, excellent processability, good electrical insulation and mechanical strength, and has the characteristics of low cost and high cost performance. It is mainly suitable for OA equipment, power substrates, LCD TVs, game machines, Household appliances, etc. However, traditional copper-clad laminates for printed circuits mainly use halogen elements for flame retard...

Claims

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Application Information

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IPC IPC(8): B32B37/12B32B37/06B32B37/10B32B15/092B32B15/098B32B15/20B32B17/04
Inventor 武伟
Owner SHAANXI SHENGYI TECH
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