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Composition of high-insulation heat conduction copper-clad plate and preparation method thereof

A technology of insulation and heat conduction, copper clad laminate, applied in chemical instruments and methods, lamination, layered products, etc., can solve the problems of low electrical insulation, brittle adhesive layer, low thermal conductivity, etc., to achieve excellent electrical insulation, It is not easy to peel, and the adhesive layer has good toughness

Inactive Publication Date: 2015-07-15
XIAN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The main problems of this type of thermally conductive copper clad laminate are low thermal conductivity (≤1W / m K), low electrical insulation (volume resistivity≤10 13 Ω.cm), and the glue layer is brittle

Method used

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  • Composition of high-insulation heat conduction copper-clad plate and preparation method thereof
  • Composition of high-insulation heat conduction copper-clad plate and preparation method thereof
  • Composition of high-insulation heat conduction copper-clad plate and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] In this embodiment, the high electrical insulation heat-conducting copper-clad laminate glue formula is mixed with the following raw material formulas in terms of mass ratio to make the glue liquid raw materials:

[0043] F-44 epoxy resin 10%; E-51 epoxy resin 23%; carboxy-terminated polybutadiene liquid rubber (CTPB) 2.5%; benzyl dimethylamine (BDMA) 0.2%; dicyandiamide (DICY) 1.3 %; Silane coupling agent (KH-560) 0.6%; Wetting and dispersing agent (S-900) 0.2%; Leveling agent (BYK-500) 0.2%; Silicon nitride powder 25%; Aluminum oxide powder 23%; Antimony oxide powder 14%;

[0044] In addition, there are appropriate amounts of acetone, ethyl acetate, and N,N-dimethylformamide (DMF) as intermediate auxiliary agents. Since the auxiliary agents will evaporate due to high temperature in the preparation process, it is not necessary to included in the total.

[0045] According to the mass ratio of the above components, the specific process for preparing a thermally conduct...

Embodiment 2

[0060] According to the mass percentage, prepare the following raw material formula:

[0061] F-44 epoxy resin 15%; E-51 epoxy resin 20%; carboxyl-terminated polybutadiene liquid rubber 3.5%; benzyl dimethylamine 0.3%; bis-nitrile amine 1.7%; silane coupling agent 0.7%; Wetting and dispersing agent 0.3%; leveling agent 0.5%; silicon nitride powder 25%; alumina powder 21%; antimony oxide powder 12%.

[0062] The wetting and dispersing agent is S-900. The silane coupling agent is KH-560. The leveling agent is BYK-500.

[0063] Then proceed according to the following process steps:

[0064] (1) Preparation of modified matrix resin

[0065] 1) Add corresponding F-44 epoxy resin, E-51 epoxy resin, carboxyl-terminated polybutadiene liquid rubber, and benzyldimethylamine into a three-necked large flask with stirring equipment according to the mass ratio of raw materials , put the three-necked beaker containing the reaction raw materials into an oil bath; turn on the stirring dev...

Embodiment 3

[0078] According to the mass percentage, prepare the following raw material formula:

[0079] F-44 epoxy resin 10%; E-51 epoxy resin 21.5%; carboxyl-terminated polybutadiene liquid rubber 3%; benzyl dimethylamine 0.2%; bis-nitrile amine 1.3%; silane coupling agent 0.6%; Wetting and dispersing agent 0.2%; leveling agent 0.2%; silicon nitride powder 28%; alumina powder 21%; antimony oxide powder 14%.

[0080] The wetting and dispersing agent is S-900. The silane coupling agent is KH-560. The leveling agent is BYK-500.

[0081] Then proceed according to the following process steps:

[0082] (1) Preparation of modified matrix resin

[0083] 1) Add corresponding F-44 epoxy resin, E-51 epoxy resin, carboxyl-terminated polybutadiene liquid rubber, and benzyldimethylamine into a three-necked large flask with stirring equipment according to the mass ratio of raw materials , put the three-necked beaker containing the reaction raw materials into the oil bath; turn on the stirring eq...

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Abstract

The invention discloses a composition of a high-insulation heat conduction copper-clad plate and a preparation method thereof. The raw materials of the copper-clad plate consist of E-51 and F-44 epoxy resin, carbo-xyl-terminated liquid polybutadiene rubber, benzyl dimethylamine, dicyandiamide, silicon nitride powder, aluminium oxide powder and antimony oxide powder, and the auxiliary materials of the copper-clad plate consist of a KH-560 silane coupling agent and various auxiliaries. The copper-clad plate is prepared through processes such as mixing, reaction prepolymerization, solvent diluting, inorganic particle mixing, low-speed and high-speed stirring, non-woven fabric and glass fabric gumming, drying, laminating and hot pressing. A copper-clad plate product is provided with a copper cladding layer and an electronic grade non-woven fabric and glass fabric reinforcement high-insulation heat conduction resin layer. The prepared copper-clad plate product has the advantages of excellent electric insulativity, dielectric constant, small dielectric loss, high breakdown voltage, high-insulation occasion application, good hot dip soldering performance, good gumming toughness and the like.

Description

technical field [0001] The invention belongs to the technical field of chemical product manufacturing, and relates to a copper-clad laminate, in particular to a composition of a high-insulation and heat-conducting copper-clad laminate and a preparation process thereof. Background technique [0002] At present, there are thermally conductive aluminum-based copper-clad laminates in the market, such as Changzhou Chaoshun Electronic Technology, Xianyang Hangming Electronic Technology, Taiwan Clear Technology, and Zhuhai Quanbao Electronics Company. These products mainly use surface electro-oxidized The aluminum plate is used as the substrate, and the components have great advantages when they are assembled with surface-mounted parts; however, when assembling some electronic devices as connectors, due to the non-electrical insulation of the aluminum plate in the thickness direction of the substrate, short circuits between devices will be caused. Holes on the substrate need to be ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/02C08L13/00C08K13/02C08K5/17C08K5/315C08K3/34C08K3/22B32B15/092B32B27/04B32B27/20B32B37/10
Inventor 周文英
Owner XIAN UNIV OF SCI & TECH