High-aspect ratio screen printable thick film paste compositions containing wax thixotropes
A technology of composition and paste, which is applied in the direction of printed circuit, oxide conductor, metal/alloy conductor, etc., can solve the problem of inability to form a high aspect ratio, achieve good dimensional stability of printed lines, reduce line resistivity, and good The effect of printability
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[0155] Preparation of Paste Compositions
[0156] The thick film paste compositions provided herein can be prepared using any method known in the art. In an exemplary method, the resin and thixotropic modifier are mixed with a solvent to ensure complete dissolution of the resin and activation of the thixotropic modifier. To the resulting mixture composition is added conductive particles such as silver particles, glass frit (such as containing SiO 2 , PbO, ZnO, B 2 o 3 and Al 2 o 3 lead borosilicate glass frit) and any other components of the paste (such as dispersants and metal oxides (such as zinc oxide), and wetting agents (such as modified dimethyl polysiloxane copolymer wetting wet agent)). Continue mixing until a substantially homogeneous paste is obtained.
[0157] After the composition has been thoroughly mixed to produce a substantially homogeneous paste, it is ground using any type of mill (such as a media mill, ball mill, two-roll mill, three-roll mill, bead m...
example 1
[0180] Preparation of Paste Compositions
[0181] A. General procedure
[0182] Each of the following Tables 1-5 describes the weight percent (wt %) of each component of thick film silver paste compositions 1-8 prepared using the following general procedure.
[0183] First mix the polymer resin (if included) and thixotropic modifier with the solvent Texanol at elevated temperature (e.g. >50°C) TM Ester alcohol (2,2,4-trimethyl-1,3-pentanediol mono(2-methyl-propionate); Sigma-Aldrich, St.Louis, MO MO)) to ensure complete dissolution of the resin and activation of the thixotropic modifier. The composition is then mixed with: silver particles (D 10 =1μm, D 50 =2.1μm, D 90 = 5.3 μm, Ames Goldsmith, South Glens Falls, New York); contains SiO 2 , PbO, ZnO, B 2 o 3 and Al 2 o 3 lead borosilicate glass frit (Viox Corporation, Seattle, WA); zinc oxide (particle size = Dispersants (Sun Chemical, Parsippany, NJ); and Modified Dimethicone Copolymer Wetting Agents (BYK Additives...
example 2
[0210] Properties of Silver Paste Compositions
[0211] A. Rheological properties
[0212] Using an AR2000ex viscometer (TA Instruments, Newcastle, DE) with a parallel plate set toothed bottom plate (TA Instruments, Newcastle, DE), at 1 s -1 and 10s -1 The viscosity of Pastes 1-3 and 8 was measured at a shear rate of . The shear thinning index (STI) is also calculated, i.e. at 1s -1 Viscosity measured under and in 10s -1Ratio of measured viscosities below. STI stands for shear thinning behavior, where the viscosity is high when the paste is at rest and low when the paste is under shear. For fine printed gridlines with high aspect ratios, the paste must exhibit shear thinning behavior, i.e. have low viscosity to extrude through the screen holes, but high viscosity to avoid broadening of the printed lines. The results are shown in Table 7 below.
[0213] Thixotropy or stress recovery time is the time required for a paste composition to return to resting viscosity after be...
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