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High-aspect ratio screen printable thick film paste compositions containing wax thixotropes

A technology of composition and paste, which is applied in the direction of printed circuit, oxide conductor, metal/alloy conductor, etc., can solve the problem of inability to form a high aspect ratio, achieve good dimensional stability of printed lines, reduce line resistivity, and good The effect of printability

Active Publication Date: 2014-02-19
SUN CHEM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Some of the problems encountered with thick film compositions known in the art include the inability to form high aspect ratio (height:width, i.e. tall) patterns, lines or fingers; resistance and limited current carrying capacity; and difficulty and / or expense of forming complex fine line patterns

Method used

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  • High-aspect ratio screen printable thick film paste compositions containing wax thixotropes
  • High-aspect ratio screen printable thick film paste compositions containing wax thixotropes
  • High-aspect ratio screen printable thick film paste compositions containing wax thixotropes

Examples

Experimental program
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Effect test

preparation example Construction

[0155] Preparation of Paste Compositions

[0156] The thick film paste compositions provided herein can be prepared using any method known in the art. In an exemplary method, the resin and thixotropic modifier are mixed with a solvent to ensure complete dissolution of the resin and activation of the thixotropic modifier. To the resulting mixture composition is added conductive particles such as silver particles, glass frit (such as containing SiO 2 , PbO, ZnO, B 2 o 3 and Al 2 o 3 lead borosilicate glass frit) and any other components of the paste (such as dispersants and metal oxides (such as zinc oxide), and wetting agents (such as modified dimethyl polysiloxane copolymer wetting wet agent)). Continue mixing until a substantially homogeneous paste is obtained.

[0157] After the composition has been thoroughly mixed to produce a substantially homogeneous paste, it is ground using any type of mill (such as a media mill, ball mill, two-roll mill, three-roll mill, bead m...

example 1

[0180] Preparation of Paste Compositions

[0181] A. General procedure

[0182] Each of the following Tables 1-5 describes the weight percent (wt %) of each component of thick film silver paste compositions 1-8 prepared using the following general procedure.

[0183] First mix the polymer resin (if included) and thixotropic modifier with the solvent Texanol at elevated temperature (e.g. >50°C) TM Ester alcohol (2,2,4-trimethyl-1,3-pentanediol mono(2-methyl-propionate); Sigma-Aldrich, St.Louis, MO MO)) to ensure complete dissolution of the resin and activation of the thixotropic modifier. The composition is then mixed with: silver particles (D 10 =1μm, D 50 =2.1μm, D 90 = 5.3 μm, Ames Goldsmith, South Glens Falls, New York); contains SiO 2 , PbO, ZnO, B 2 o 3 and Al 2 o 3 lead borosilicate glass frit (Viox Corporation, Seattle, WA); zinc oxide (particle size = Dispersants (Sun Chemical, Parsippany, NJ); and Modified Dimethicone Copolymer Wetting Agents (BYK Additives...

example 2

[0210] Properties of Silver Paste Compositions

[0211] A. Rheological properties

[0212] Using an AR2000ex viscometer (TA Instruments, Newcastle, DE) with a parallel plate set toothed bottom plate (TA Instruments, Newcastle, DE), at 1 s -1 and 10s -1 The viscosity of Pastes 1-3 and 8 was measured at a shear rate of . The shear thinning index (STI) is also calculated, i.e. at 1s -1 Viscosity measured under and in 10s -1Ratio of measured viscosities below. STI stands for shear thinning behavior, where the viscosity is high when the paste is at rest and low when the paste is under shear. For fine printed gridlines with high aspect ratios, the paste must exhibit shear thinning behavior, i.e. have low viscosity to extrude through the screen holes, but high viscosity to avoid broadening of the printed lines. The results are shown in Table 7 below.

[0213] Thixotropy or stress recovery time is the time required for a paste composition to return to resting viscosity after be...

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Abstract

Provided are high-aspect ratio printable thick film metal paste compositions that can be deposited onto a substrate using, for example, screening printing techniques; and methods of preparing and using thick film printable metal pastes; and methods of screen printing of the thick film metal paste compositions onto a substrate to produce printed circuits, conductive lines or features on the substrate and / or a conductive surface on a solar cell device. Also provided are printed substrates containing an electronic feature produced by the high-aspect ratio printable thick film metal paste compositions.

Description

[0001] related application [0002] This application claims priority to Diptarka Majumdar, Hsien Ker, Philippe Schottland and Michael McAllister, filed March 29, 2011, entitled "HIGH-ASP ECT RATIO SCREEN PRINTABLE THICK FILM PASTE COMPOSITI ONS CONTAINING WAX THIXOTROPES High aspect ratio screen printable thick film paste composition for adhesives)" U.S. Provisional Application Serial No. 61 / 468,621. [0003] With permission, the subject matter of the above provisional application is incorporated by reference in its entirety. technical field [0004] The present invention relates to thick film metal pastes, such as silver pastes, and methods of making and using thick film printable metal pastes that can be deposited onto substrates using, for example, screen printing deposition to Printed circuits, conductive lines or features are created on the substrate and / or a conductive surface is created on the front side of the solar cell device. Background technique [0005] The en...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22
CPCH01L31/022425Y02E10/50H05K1/097H01L29/45H01B1/22H05K1/092H01B1/02H01B1/08
Inventor D·马宗达H·克尔P·肖特兰德M·麦卡利斯特
Owner SUN CHEM CORP
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