Process of ultrasonic wave electroplating of copper foil

An ultrasonic and copper foil technology, applied in the process of ultrasonic electroplating copper foil, can solve the problems of affecting the corrosion resistance of the coating, easy to produce burrs and pinholes, and large porosity of the tin layer, so as to reduce the porosity and reduce the burr. and pinholes, the effect of improving the brightness

Inactive Publication Date: 2014-03-19
江西省首诺铜业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the process of tinning copper foil with ordinary tin plating solution, the general electroplating method, the hydrogen gas on the surface of the cathode is difficult to discharge, the surface is prone to burrs and pinholes, the tin plating layer has a large porosity, and it is easy to change color in the air. Corrosion resistance of the overall coating of the product

Method used

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  • Process of ultrasonic wave electroplating of copper foil

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Effect test

Embodiment 1

[0010] A kind of technique of ultrasonic electroplating copper foil, its steps are as follows: 1, preparation electroplating solution, by 65g / L stannous chloride, 100ml / L sulfuric acid, 5g / L sodium ethylene sulfonate, 3g / L butynediol, 2g Ascorbic acid, 5g / L cerium carbonate, and the balance is distilled water to formulate the electroplating solution, and adjust the pH to 3 with ammonia water. 2. Pre-plating treatment, the copper foil 4 moves through the cleaning tank 1 at a speed of 10m / h, and is cleaned with deionized water in the cleaning tank 1, and 20KHz ultrasonic waves are added during cleaning, and the surface of the copper foil 4 is removed by ultrasonic cleaning with deionized water grease and impurities. 3. After the pre-plating treatment is completed, the copper foil 4 continues to move forward at a speed of 10m / h, and enters the tin plating tank 2 filled with electroplating solution through the pulley 5. The copper foil 4 is connected to the cathode of the DC power...

Embodiment 2

[0012] A kind of technique of ultrasonic electroplating copper foil, its steps are as follows: 1, preparation electroplating solution, by 65g / L stannous chloride, 100ml / L sulfuric acid, 5g / L sodium ethylene sulfonate, 3g / L butynediol, 2g Ascorbic acid, 5g / L cerium carbonate, and the balance is distilled water to formulate the electroplating solution, and adjust the pH to 4 with ammonia water. 2. Pre-plating treatment, the copper foil 4 moves through the cleaning tank 1 at a speed of 20m / h, and is cleaned with deionized water in the cleaning tank 1, and 40KHz ultrasonic waves are added during cleaning, and the surface of the copper foil 4 is removed by ultrasonic cleaning with deionized water grease and impurities. 3. After the pre-plating treatment is completed, the copper foil 4 continues to move forward at a speed of 20m / h, and enters the tin plating tank 2 filled with electroplating solution through the pulley 5. The copper foil 4 is connected to the cathode of the DC power...

Embodiment 3

[0014] A kind of technique of ultrasonic electroplating copper foil, its steps are as follows: 1, preparation electroplating solution, by 65g / L stannous chloride, 100ml / L sulfuric acid, 5g / L sodium ethylene sulfonate, 3g / L butynediol, 2g Ascorbic acid, 5g / L cerium carbonate, and the balance is distilled water to formulate the electroplating solution, and adjust the pH to 3 with ammonia water. 2. Pre-plating treatment, the copper foil 4 moves through the cleaning tank 1 at a speed of 15m / h, and is cleaned with deionized water in the cleaning tank 1, and 30KHz ultrasonic waves are added during cleaning, and the surface of the copper foil 4 is removed by ultrasonic cleaning with deionized water grease and impurities. 3. After the pre-plating treatment is completed, the copper foil 4 continues to move forward at a speed of 15m / h, and enters the tin plating tank 2 filled with electroplating solution through the pulley 5. The copper foil 4 is connected to the cathode of the DC power...

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Abstract

The invention discloses a process of ultrasonic wave electroplating of copper foil. An electroplating solution is prepared, and cerous oxalate is added into the electroplating solution; ultrasonic cleaning with deionized water is carried out before electroplating; during electroplating, the cathode current density is 2.5A/dm3; the electroplating solution is oscillated and stirred by ultrasonic wave of 700-1200 w and 20-35 KHz. The process of the invention adopts ultrasonic wave stirring, which increases the current density, reduces concentration polarization, improves brightness, enables easy escape of hydrogen at the cathode surface, reduces burrs and pin holes, and obtains an electroplating layer with finer and uniform crystal particles.

Description

technical field [0001] The invention relates to an electroplating process, in particular to an ultrasonic electroplating copper foil process. Background technique [0002] Tin plating has good solderability, corrosion resistance and oxidation resistance, and is widely used in electronic components. Tinned copper foil is widely used in high-end link lines, high-definition TVs, tablet computers, etc. because of its high conductivity, excellent shielding effect, no oxidation, long retention time, easy soldering, and no oxidation at the soldering point. In the process of tinning copper foil with ordinary tin plating solution, the general electroplating method, the hydrogen gas on the surface of the cathode is difficult to discharge, the surface is prone to burrs and pinholes, the tin plating layer has a large porosity, and it is easy to change color in the air, affecting The corrosion resistance of the overall coating of the product. Contents of the invention [0003] The ob...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/20C25D7/06
Inventor 何荣贵代英何东霖韩浩彬孙小孟曾元福
Owner 江西省首诺铜业有限公司
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