Selective ITO (tin indium oxide) etching solution

A technology of indium tin oxide and indium tin oxide film, applied in the direction of surface etching composition, chemical instrument and method, can solve the problems of corrosion of ITO copper film, poor effect, slow etching rate, etc., and achieve complete etching and etching. Fast and effective rate, uniform etching effect

Active Publication Date: 2014-05-21
KUNSHAN CITY BANMING ELECTRONICS SCI & TECH
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  • Summary
  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

Among them, although the etching rate of the aqua regia system is very fast, it has a strong corrosion effect on the copper film on the upper layer of ITO, and is easy to cause damage to the ITO below the copper layer; while the oxalic acid system has a very slow etching rate on the crystalline ITO. It is mainly used for the etching of amorphous ITO, and it is easy to produce precipitation during use, and the application range is small and the effect is not good; although the etching rate of the ferric chloride system is also very fast, it also faces the problems encountered by the aqua regia system. The problem is that it will also have a strong oxidation effect on the metal, which will cause serious corrosion of the copper film on the upper layer of ITO; while the hydroiodic acid system has good etching performance, but its stability is poor, and it is easy to dissociate iodine, and because of its high price and high toxicity, its App is restricted
[0005] In addition, the aqueous solution system composed of hydrochloric acid and acetic acid is favored by operators due to its advantages such as stable rate and no residue formation when used as an ITO etching solution, but this system still has great corrosion on the copper layer and is prone to side corrosion. Problems such as incomplete etching

Method used

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  • Selective ITO (tin indium oxide) etching solution
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  • Selective ITO (tin indium oxide) etching solution

Examples

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specific Embodiment 1

[0030] Add 450g of hydrochloric acid with a mass concentration of 36% (including 162g of hydrochloric acid), 30g of acetic acid, 10g of hexamethylenediamine, and 10.01g of Rongqiang HA-110.01g, add deionized water to make 1000g of etching solution, and spray and etch at 40°C for 120 seconds. Among them, Rongqiang HA-11 is fatty alcohol polyoxyethylene polyoxypropylene ether compound. Compare and test the line resistance before and after etching, take the resistance between two points on different non-film-covered lines as the initial value for many times, and the etching is completed when the resistance is infinite. The resulting circuit diagram is as figure 1 shown.

specific Embodiment 2

[0031] Add 600g of hydrochloric acid with a mass concentration of 36% (including 216g of hydrochloric acid), 30g of acetic acid, 20g of 2-hexylbenzimidazole, and 160.1g of Rongqiang RQ-160.1g, add deionized water to make 1000g of etching solution, and spray etch at 40°C 120 seconds and 20 minutes. Wherein RQ-16 is fatty alcohol ether nonionic surfactant polymer. Compare and test the line resistance before and after etching, take the resistance between two points on different non-film-covered lines as the initial value for many times, and the etching is completed when the resistance is infinite. The resulting circuit diagram is as figure 2 with image 3 shown.

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Abstract

The invention provides a selective ITO (tin indium oxide) etching solution. The etching solution is used for etching crystal and non-crystal ITO film layers, and is especially applicable to an ITO film of which the lower layer is a film substrate of organic polymers such as PET and the like and the upper layer is a monolayer or multilayer covering film consisting of copper or high-molecular compounds. The selective ITO etching solution is composed of the following components in percentage by weight: 15-25% of hydrochloric acid, 1-10% of acetic acid, 0.5-5% of a copper corrosion inhibitor, 5-500 ppm of a surfactant, and the balance of deionized water, wherein the copper corrosion inhibitor is at least one of a long-chain water-soluble amine compound and a triazole compound; the surfactant is a non-ionic surfactant. The etching solution is high in etching speed, effective, stable, free of residues and uniform in etching, and can be used for etching ITO completely, the edge of an ITO line is clear and has no lateral erosion, and the etching solution has no corrosion effect on copper layers.

Description

technical field [0001] The invention relates to an etching solution suitable for transparent conductive films in touch screen panels, in particular to a selective indium tin oxide (ITO) etching solution, especially suitable for the lower layer of the ITO film is polyethylene terephthalate ( PET) and other organic polymer film substrates, and the upper layer of the ITO film is a single-layer or multi-layer covering film composed of copper or polymer compounds, which belongs to the field of fine chemicals. Background technique [0002] Indium tin oxide (ITO) conductive film has many excellent physical properties such as low resistivity, high visible light transmittance, high infrared reflection, good adhesion to the substrate, anti-scratch, and good chemical stability, etc. It is easy to prepare and form electrode patterns, and has been widely used as transparent electrodes on LCD, PDP, FED, OLED / PLED and other flat panel displays. [0003] In order to prepare the required el...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K13/06
Inventor 李建陈修宁贺承相王淑萍黄京华黄志齐
Owner KUNSHAN CITY BANMING ELECTRONICS SCI & TECH
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