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Hot-melt adhesive film for plywood and preparation method thereof

A technology of hot-melt adhesives and plywood, applied in adhesives, aldehyde/ketone condensation polymer adhesives, adhesive types, etc., can solve the problems of long hot pressing time, low production efficiency, and difficulty in large-scale implementation, and achieve High bonding strength and strong water resistance

Inactive Publication Date: 2014-06-25
BEIJING SHUANGCHENGMU TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this patent does not involve hot-melt adhesive or plastic components, and the hot-pressing time is as long as 1-12 hr., and it also requires pressure-holding and cooling, resulting in low production efficiency and difficult large-scale implementation

Method used

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  • Hot-melt adhesive film for plywood and preparation method thereof
  • Hot-melt adhesive film for plywood and preparation method thereof
  • Hot-melt adhesive film for plywood and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Preparation of hot-melt adhesive film for plywood: 255kg of polytetrahydrofuran diol (molecular weight 1800±50, hydroxyl value 60.6-64.1mgKOH / g) was vacuum dehydrated at 120°C for 1.5h in a reactor to reduce the moisture content of the material to 0.04 %, lower the temperature to 80°C, fill the reactor with argon gas, add 124kg of polymeric MDI (NCO content 31.5%, functionality 2.4; isocyanate index 3.3), stir at 80°C for prepolymerization for 120min, and take samples to analyze NCO The mass fraction is 7.10%, add 24kg of 1,4-butanediol, continue the chain extension reaction at 80°C for 20min, then add 0.7kg of dibutyltin dilaurate and triethylenediamine, 140kg of polyphenylene Ethylene, 10kg of first-grade rosin resin and 4kg of terpene resin were stirred evenly and vacuum defoamed for 20 minutes. The product was put into a casting machine while it was hot and cast into a hot-melt adhesive film for plywood with a thickness of 0.04mm.

Embodiment 2

[0028] Preparation of hot-melt adhesive film for plywood: 200kg of tetrahydrofuran-propylene oxide copolymerized glycol (molecular weight 1000±100, hydroxyl value 102-104mgKOH / g) was vacuum dehydrated at 110°C for 2 hours in a reactor to reduce the moisture content of the material to 0.05%, lower the temperature to 85°C, fill the reactor with nitrogen, add 130kg of 4,4'-MDI (NCO content 33.2%, functionality 2.0; isocyanate index 2.8), stir at 75°C for prepolymerization About 180 minutes, the mass fraction of NCO was 8.30% by sampling analysis, and 25.5kg of 1,4-butanediol was added to continue the chain extension reaction at 75°C for 30 minutes, and then 0.55kg of dibutyltin dilaurate and triethylenedi The polystyrene of amine, 150kg, the polyα-methylstyrene of 40kg and the disproportionated rosin of 18kg, vacuum defoaming 20min after stirring evenly, the product is thrown into casting machine while hot and casts into the hot-melt adhesive film that plywood is used, and its thi...

Embodiment 3

[0030] Preparation of hot-melt adhesive film for plywood: 50kg of polytetrahydrofuran diol (molecular weight 1000±100, hydroxyl value 102-104mgKOH / g) and 225kg of tetrahydrofuran-propylene oxide copolymerized glycol (molecular weight 2000±100, hydroxyl value Value 52-60mgKOH / g), vacuum dehydration at 115°C for 1.75h, make the moisture content of the material 0.04%, cool down to 85°C, fill the reactor with argon, add 130kg of polymeric MDI (NCO content 30.0-32.0% , functionality 2.7; isocyanate index 3.0), stirred at 85°C for prepolymerization for about 180min, sampled and analyzed the mass fraction of NCO: 9.50%, added 23.5kg of 1,4-butanediol, and continued to expand at 85°C Chain reaction for 15min, then add 0.7kg of dibutyltin dilaurate and triethylenediamine, 170kg of regenerated polystyrene, 15kg of rosin resin, 5kg of disproportionated rosin and 5kg of terpene phenolic resin, after stirring evenly Vacuum defoaming for 20 minutes, and the product was put into a casting ma...

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Abstract

The invention discloses a hot-melt adhesive film for plywood. The hot-melt adhesive film is mainly prepared from the following raw materials: a polyether polyol, diisocyanate MDI, a chain extender, a catalyst, styrene resin and tackifying resin, wherein in the raw materials, the polyether polyol and the diisocyanate MDI are added proportionally according to an isocyanate index, namely a mol ratio of NCO / OH of (2.8-3.3): 1, the dosage of the chain extender is 5.8%-7.7% of the total mass of the polyether polyol and the diisocyanate MDI, the catalyst is composed of dibutyltin dilaurate and triethylene diamine in a mass ratio of 1: 1 and the dosage of the catalyst accounts for 0.2%-0.25% of the mass of all the materials, the dosage of the styrene resin accounts for 25%-34% of the mass of all the materials, and the dosage of the tackifying resin accounts for 2.5%-4% of the mass of all the materials. The raw materials of the hot-melt adhesive film include no formaldehyde or other harmful substances, and the hot-melt adhesive film is high in bonding strength and waterproofness, and belongs to a WBP glue (resistant to boiling water); when the hot-melt adhesive film is used for producing the plywood, the time of the process is basically as long as that of a common plywood production process.

Description

technical field [0001] The invention belongs to the technical field of adhesives, in particular to a hot-melt adhesive film for plywood and a preparation method thereof. Background technique [0002] Urea-formaldehyde resin glue is the main type of adhesive used in (wooden) plywood production, and its consumption exceeds 90% of the glue used in plywood production. Urea-formaldehyde resin has a wide range of raw materials, cheap prices, fast curing speed, and low curing temperature, but its adhesive layer has poor water resistance (especially boiling water resistance), is easy to age, and has high free formaldehyde content, which leads to formaldehyde release in plywood products. Also high. [0003] US5643983 "Moisture curable100% solids one component plywood adhesive" patent proposes to use a 100% solid-containing one-component adhesive mixture as the adhesive for plywood. The mixture is composed of isocyanate-terminated polyurethane, prepolymerized diisocyanate, Preparati...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/00C09J175/08C09J125/06C09J125/16C09J193/04C09J145/00C09J161/14C08G18/66C08G18/48C08G18/10
Inventor 王文涛吴子良莫丽华左艳仙
Owner BEIJING SHUANGCHENGMU TECH