Ultrahigh heat conduction graphite flake/copper composite material and preparation method thereof

A technology of copper-based composite materials and graphite flakes is applied in the field of preparation of high-thermal-conductivity graphite flake-reinforced copper-based composite materials, which can solve the problem of weak lamellar bonding force, low ratio of directional arrangement of scales, and incomplete high thermal conductivity. Play a role and other issues to achieve the effect of low cost of raw materials

Active Publication Date: 2014-07-16
UNIV OF SCI & TECH BEIJING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the preparation of high-performance graphite flake / copper composites needs to solve two key problems: 1. Graphite flakes only have high thermal conductivity in the lamellar direction, while the bonding force between the flakes is weak, and its theoretical thermal conductivity The value is only 6W·m -1 ·K -1
However, the ratio of the directional arrangement of the scales in the matrix is ​​not high, the scales have a large bending phenomenon, and the high thermal conductivity in the layer direction of the graphite scales has not fully exerted its effect.

Method used

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  • Ultrahigh heat conduction graphite flake/copper composite material and preparation method thereof
  • Ultrahigh heat conduction graphite flake/copper composite material and preparation method thereof

Examples

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Effect test

Embodiment 1

[0029] The graphite flakes in this example have a thickness of 20 microns and an average diameter of 800 microns. Graphite flakes, TiH 2 with TiCl 3 The powder is placed in the coating device according to the mass ratio of 100:15:2, and the initial vacuum degree is 10 -3 Pa, the vacuum degree in plating is controlled at 1-10Pa, the plating temperature is 850°C, and the time is 2h. During this process, TiCl 3 volatilize with TiH 2 The gas-phase Ti produced by reaction reduction is deposited on the surface of graphite flakes. After cooling, the material is screened to obtain titanium-coated graphite flakes.

[0030] Take the surface-modified graphite flakes, flaky copper powder with a thickness of 5 μm and an average diameter of 50 μm, 5% polyvinyl alcohol solution, and ethylene glycol solution and mix them uniformly in a volume ratio of 40:40:10:10. Then put the composite powder slurry into a directional extrusion die for directional extrusion, the width of the die extrusi...

Embodiment 2

[0032] The graphite flakes in this example have a thickness of 10 microns and an average diameter of 1000 microns. First, the molybdenum carbide coating is coated on the surface of the graphite flakes by means of salt bath plating. The specific process is to use trioxide as the molybdenum source, and NaCl-KCl mixed salt with a molar ratio of 1:1 as the molten salt. Mix graphite flakes, molybdenum trioxide, and mixed salts in a mass ratio of 1:2:1, put them into a corundum crucible, cover the crucible, put the corundum crucible into a tube furnace, and place it under the protection of high-purity argon. The temperature was raised to 1000°C at a rate of 10°C / min, kept for 1 hour and then cooled to room temperature with the furnace. After the powder sample is taken out from the tube furnace, add deionized water for ultrasonication for 20 minutes, evaporate to dryness after repeated rinsing, and then use a vibrating sieve to remove excess impurities to obtain the final required g...

Embodiment 3

[0035] The graphite flakes in this example have a thickness of 10 microns and an average diameter of 1000 microns. The selected substrate is flaky copper powder with an average diameter of 50 microns and a thickness of 5 microns.

[0036]Take graphite flakes, flaky copper powder, 8% polyvinyl alcohol solution, and ethylene glycol solution and mix them uniformly in a volume ratio of 32:48:10:10. Then put the composite powder slurry into a directional extrusion die for directional extrusion. The width of the extrusion opening of the die is 1 mm, and the extrusion pressure is 12 MPa to obtain a sheet with a thickness of 1 mm. Subsequently, drying was carried out in a tube furnace at a drying temperature of 200° C. for 3 hours. The sheets are stacked into a mold, followed by vacuum hot-press sintering. The sintering temperature is 980°C, the pressure is 40MPa, and the graphite flake / copper composite material is obtained after holding the heat for 30 minutes and then cooling with...

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Abstract

The invention discloses a high-heat conduction graphite flake referenced copper-based composite material and a preparation method thereof, belonging to the field of high-performance electronic packaging functional materials. The high-heat conduction graphite flake referenced copper-based composite material comprises a base material copper or copper alloy and a coated reinforcing phase high-heat conduction graphite flake, wherein the volume fraction of the coated graphite flake is 20-80 percent. The preparation method comprises the steps: firstly modifying the surface of the graphite flake, and coating a coating of metals of titanium, chromium, molybdenum, tungsten or relevant carbides on the surface of the graphite flake; then adding the surface modified graphite flake and the metal base body powder in a solvent containing a binding agent and a plasticizing agent, uniformly mixing to obtain a mixed slurry, placing the slurry in an extruding mould for performing directional extrusion, and then removing the binding agent to obtain a pre-sintered sheet; overlapping the sheets and then sintering to obtain the composite material. The composite material prepared by adopting the preparation method has the advantages that the flake reinforcing phase and the base body are well combined, and the flake is directionally arranged in the base body, thus ultrahigh heat conductivity, controllable coefficient of thermal expansion and better machinability are achieved.

Description

technical field [0001] The invention belongs to the field of high-performance electronic packaging functional materials, and relates to a preparation method of a copper-based composite material reinforced with high thermal conductivity graphite flakes. Background technique [0002] With the rapid development of modern electronic information technology, the integration and power consumption of electronic components are constantly increasing, and heat dissipation has become one of the key factors affecting the reliability of electronic products. The thermal conductivity of traditional electronic packaging materials has been difficult to meet the needs of modern electronic device cooling tasks. At the same time, the development of electronic products toward miniaturization, light weight, and complexity also puts forward higher requirements for electronic packaging materials. [0003] In recent years, metal matrix composites with diamond as a reinforcing phase have been hailed ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/00C22C1/10C22C1/05
Inventor 何新波刘骞章晨任淑彬吴茂曲选辉
Owner UNIV OF SCI & TECH BEIJING
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