Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Production method for infrared radiation reflecting film

A manufacturing method, infrared technology, applied in chemical instruments and methods, sputtering plating, ion implantation plating, etc., can solve problems such as deterioration, insufficient physical strength such as scratch resistance, and achieve the effect of improving productivity

Inactive Publication Date: 2014-08-06
NITTO DENKO CORP
View PDF6 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] These metal layers and metal oxide layers often have insufficient physical strength such as scratch resistance, and are also prone to deterioration due to external environmental factors such as heat, ultraviolet rays, oxygen, moisture, and chlorine (chloride ions).

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Production method for infrared radiation reflecting film
  • Production method for infrared radiation reflecting film
  • Production method for infrared radiation reflecting film

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0090] The solvent used for the preparation of these solutions is not particularly limited as long as it is a solvent capable of dissolving each of the above-mentioned materials. For example, low-boiling-point solvents such as methyl ethyl ketone (MEK) and methylene chloride can be used suitably. In addition, the solution for forming the transparent protective layer may contain coupling agents such as silane coupling agents and titanium coupling agents, leveling agents, and ultraviolet absorbers in addition to polymers, monomers, and crosslinking agents. , antioxidants, heat stabilizers, lubricants, plasticizers, anti-coloring agents, flame retardants, antistatic agents and other additives. The contents of these additives can be appropriately adjusted within the range not impairing the object of the present invention.

[0091] A transparent protective layer can be formed by applying the above solution on the infrared reflective layer and drying the solvent. Curing of the poly...

Embodiment 1

[0121] Formation of hard coat at substrate

[0122] On one side of a polyethylene terephthalate film (manufactured by TORAY INDUSTRIES, INC., trade name "Lumirror U48", visible light transmittance: 93%) with a thickness of 50 μm, an acrylic ultraviolet curing type is formed with a thickness of 2 μm Hard coating (manufactured by Nippon Soda, NH2000G). Specifically, a hard coat solution was applied by a gravure coater, dried at 80°C, and then irradiated with a cumulative light intensity of 300mJ / cm by an ultra-high pressure mercury lamp. 2 UV light for curing.

[0123] Formation of infrared reflective layer

[0124] On the hard coat layer of the polyethylene terephthalate film substrate, an infrared reflective layer was formed using a roll-to-roll sputtering device. Specifically, a first metal oxide layer made of zinc-tin composite oxide (ZTO) with a film thickness of 30 nm and a metal layer made of an Ag-Pd alloy with a film thickness of 15 nm were sequentially formed by...

Embodiment 2～7

[0130] In the following Examples 2-7, except having changed the composition of the target used for film formation of a metal oxide layer, it carried out similarly to Example 1, and produced the infrared reflection film. In these examples, powder that would cause abnormal discharge during sputtering was not produced in the same manner as in Example 1, and the product of the thickness and length of the metal oxide layer could be continuously stabilized at 6000 nm·m. film formation without cleaning the target and sputtering device.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
electrical resistivityaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention relates to a production method for an infrared radiation reflecting film. The infrared radiation reflecting film (100) is provided with, in order, an infrared radiation reflecting layer (20) having a metal layer (25) and metal oxide layers (21, 22), and a transparent protective layer (30) on a transparent film substrate (10). In this production method, the metal oxide layers are formed by DC sputtering using a winding sputtering apparatus. The sputtering target used in DC sputtering contains zinc atoms and tin atoms. The sputtering target is preferably obtained by sintering a metal powder, and at least one metal oxide among zinc oxide and tin oxide.

Description

technical field [0001] The present invention relates to a method for producing an infrared reflective film that is mainly disposed and used indoors such as glass windows. Background technique [0002] Conventionally, an infrared reflective substrate having an infrared reflective layer on a substrate such as glass or a film is known. As the infrared reflective layer, an infrared reflective layer in which a metal layer and a metal oxide layer are alternately laminated is widely used, which can provide heat-shielding properties by reflecting near-infrared rays such as sunlight. As the metal layer constituting the infrared reflective layer, silver or the like is widely used from the viewpoint of improving the selective reflectivity of infrared rays. In addition, as the metal oxide layer, indium tin oxide (ITO), indium zinc oxide (IZO), and the like are widely used (for example, Patent Document 1). In addition, attempts have been made to improve the durability of infrared refle...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/34C23C14/08C23C14/14G02B5/08
CPCG02B5/26B32B38/0008B32B2037/243B32B2038/0092B32B2309/02B32B2309/04B32B2309/105B32B2309/62B32B2309/66B32B2310/0831C23C14/086C23C14/3414G02B5/208B29L2011/0083C23C14/205C23C14/34H01J37/3429H01J2237/332
Inventor 渡边圣彦大森裕
Owner NITTO DENKO CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com